| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/11/2013 | US20130087906 Circuit board, fabricating method thereof and package structure |
| 04/11/2013 | US20130087905 Curable organopolysiloxane composition and semiconductor device |
| 04/11/2013 | US20130087904 Wafer level applied thermal heat sink |
| 04/11/2013 | US20130087903 Electronics Packaging For High Temperature Downhole Applications |
| 04/11/2013 | US20130087902 Integrated circuit packaging system with thermal structures and method of manufacture thereof |
| 04/11/2013 | US20130087901 Design for exposed die package |
| 04/11/2013 | US20130087900 Thermally Enhanced Low Parasitic Power Semiconductor Package |
| 04/11/2013 | US20130087899 Diode cell modules |
| 04/11/2013 | US20130087898 Semiconductor Device and Method of Forming Prefabricated Multi-Die Leadframe for Electrical Interconnect of Stacked Semiconductor Die |
| 04/11/2013 | US20130087897 Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die |
| 04/11/2013 | US20130087896 Stacking-type semiconductor package structure |
| 04/11/2013 | US20130087895 Radiation-shielded semiconductor device |
| 04/11/2013 | US20130087892 Electrical Connection for Chip Scale Packaging |
| 04/11/2013 | US20130087891 Semiconductor chip and fabricating method thereof |
| 04/11/2013 | US20130087889 Diffusion barrier and method of formation thereof |
| 04/11/2013 | US20130087880 Mems device and method of manufacture |
| 04/11/2013 | US20130087824 Opto-electrical device and method for manufacturing thereof |
| 04/11/2013 | US20130087787 Electrical mask inspection |
| 04/11/2013 | US20130087519 Frame structure for solar cell module |
| 04/11/2013 | DE112011100975T5 Biaxial verspannte Feldeffekttransistor-Bauelemente Biaxially strained field effect transistor devices |
| 04/11/2013 | DE112004000360T5 Zweimetallisches Stud-Bumping für Flipchip-Anwendungen Two Metallic stud bumping for flip chip applications |
| 04/11/2013 | DE102012109514A1 Elektronik-Gehäuse-Verbinder und Verfahren zu dessen Herstellung Electronic housing connector and method for its production |
| 04/11/2013 | DE102012109356A1 Halbleiterstruktur und Verfahren zu ihrer Herstellung Semiconductor structure and process for their preparation |
| 04/11/2013 | DE102012102131A1 Verfahren zur Herstellung eines flexiblen Bauelements A method for producing a flexible member |
| 04/11/2013 | DE102011115376A1 Arrangement for use in half-bridge module for arranging n-channel-MOSFET to half bridge circuit, has support plates comprising contact surfaces, where drain terminals of MOSFETS are applied on plates with surfaces and connected by lines |
| 04/11/2013 | DE102011084303A1 Method for producing carrier for electronic power module, involves forming electrical connection between heavy-current conductor and sintered conductor |
| 04/11/2013 | DE102011084276A1 Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung Encapsulation for an organic electronic device, an organic electronic device with the encapsulation and a process for producing an organic electronic device with the encapsulation |
| 04/11/2013 | DE102010007086B4 Anordnung mit Leistungshalbleiterbaugruppen und einer Flüssigkeitskühleinrichtung Arrangement with power semiconductor modules and a liquid cooling device |
| 04/11/2013 | DE102009010199B4 Halbleiterpackage mit Formschlossentlüftung und Verfahren zu dessen Hersstellung Semiconductor package with shape Castle ventilation and method of Hersstellung |
| 04/11/2013 | DE102008000217B4 Halbleiterbauelement-Teststrukturen, Verwendung und Herstellungsverfahren A semiconductor device test structures, and using production methods |
| 04/11/2013 | DE102006031844B4 Verfahren zur Befestigung von elektronischen Bauelementen auf einem Träger durch Drucksinterung und somit hergestellte Schaltungsanordnung A method for mounting electronic components on a substrate by pressure sintering, and thus prepared circuitry |
| 04/10/2013 | EP2579693A1 Multi-chip wiring board and process for producing same, and wiring board and process for producing same |
| 04/10/2013 | EP2579458A1 Switching circuit and envelope signal amplifier |
| 04/10/2013 | EP2579441A1 Control device for electric power converter |
| 04/10/2013 | EP2579439A2 Electric power conversion apparatus |
| 04/10/2013 | EP2579312A2 Solid state imaging device and manufacturing method thereof |
| 04/10/2013 | EP2579310A2 One-time programmable device having an LDMOS structure and related manufacturing method |
| 04/10/2013 | EP2579309A1 Power module and manufacturing method thereof |
| 04/10/2013 | EP2579308A2 Stacked semiconductor devices |
| 04/10/2013 | EP2579306A2 Springy clip type apparatus for fastening power semiconductor |
| 04/10/2013 | EP2579305A1 Heat radiation dissipation film structure and method for making the same |
| 04/10/2013 | EP2578982A1 Heat exchanger and method for manufacturing same |
| 04/10/2013 | EP2578638A1 Optical semiconductor sealing curable composition and optical semiconductor apparatus using this |
| 04/10/2013 | EP2577814A2 Contact holder |
| 04/10/2013 | EP2577729A1 Electronic chip having channels through which a heat transport coolant can flow, electronic components and communication arm incorporating said chip |
| 04/10/2013 | EP2577728A1 Semiconductor device, solid-state imaging device, and camera system |
| 04/10/2013 | EP2577727A1 Methods for forming color images on memory devices and memory devices formed thereby |
| 04/10/2013 | EP2577726A1 Stacked interposer leadframes |
| 04/10/2013 | EP2577725A2 Semiconductor element and method for producing the same |
| 04/10/2013 | EP2577724A1 Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies |
| 04/10/2013 | EP2577688A1 Through via inductor or transformer in a high-resistance substrate with programmability |
| 04/10/2013 | EP2577210A1 Heat and energy exchange |
| 04/10/2013 | EP2576639A1 Electronic device module comprising film of homogeneous polyolefin copolymer and grafted silane |
| 04/10/2013 | EP1564807B1 Semiconductor device and manufacturing method of the same |
| 04/10/2013 | CN202872681U Inverter circuit and structure thereof |
| 04/10/2013 | CN202871802U Plastic packaging epitaxial ultrafast recovery diode |
| 04/10/2013 | CN202871801U High-performance heavy-current VDMOS power device chip double-point bonding packaging structure |
| 04/10/2013 | CN202871791U Encapsulating device of compact single-phase integration driving circuit, and single-phase integration driving circuit |
| 04/10/2013 | CN202871790U Infrared remote control amplifier |
| 04/10/2013 | CN202871785U Integrated triggering and rectifying device |
| 04/10/2013 | CN202871784U Shielding insertion mechanism and semiconductor package with integrated electromagnetic shielding body |
| 04/10/2013 | CN202871783U Chip-embedded type stacking-wafer level packaging structure |
| 04/10/2013 | CN202871782U Structure of packaging substrate |
| 04/10/2013 | CN202871781U Smart card SIM module packaging structure |
| 04/10/2013 | CN202871780U Anti-material-overflow framework for high-power chip |
| 04/10/2013 | CN202871779U Anti-wire-collapse multiple chip integrated circuit lead frame |
| 04/10/2013 | CN202871778U Double-layer metal frame built-in inductance integration circuit |
| 04/10/2013 | CN202871777U Three-phase rectifier bridge with improved structure |
| 04/10/2013 | CN202871776U Bridge rectifier double-face salient point connecting sheet |
| 04/10/2013 | CN202871775U Water cooling radiator |
| 04/10/2013 | CN202871774U Storage, conduction and dissipation integrated high-power electronic device |
| 04/10/2013 | CN202871773U Heat radiation structure based on collaborative heat radiation of inverter box body and radiator |
| 04/10/2013 | CN202871772U Inverter radiator assembly |
| 04/10/2013 | CN202871771U Thick film integrated circuit of high-temperature processor |
| 04/10/2013 | CN202871770U Compact intelligent power driving module |
| 04/10/2013 | CN202871769U Package substrate |
| 04/10/2013 | CN103038890A Method for marking a solar cell and solar cell |
| 04/10/2013 | CN103038879A Core-sheath ribbon wire |
| 04/10/2013 | CN103038878A Diode package having improved lead wire and manufacturing method thereof |
| 04/10/2013 | CN103038877A Apparatus and method for controlling semiconductor die warpage |
| 04/10/2013 | CN103038871A Module and production method |
| 04/10/2013 | CN103038654A Methods and devices for stressing an integrated circuit |
| 04/10/2013 | CN103037664A Radiating device and electronic device using same |
| 04/10/2013 | CN103037615A Printed circuit board and formation method thereof |
| 04/10/2013 | CN103036636A Signal distribution and radiation in a wireless enabled integrated circuit (ic) |
| 04/10/2013 | CN103036618A Light transmit-receive element and sealing method thereof |
| 04/10/2013 | CN103035762A Terminal box for solar cell module |
| 04/10/2013 | CN103035747A Point contact type diode |
| 04/10/2013 | CN103035742A Pnpn diode |
| 04/10/2013 | CN103035741A Silicon bidirectional trigger diode |
| 04/10/2013 | CN103035739A Silicone plastic package rectifier diode |
| 04/10/2013 | CN103035738A Silicon plastic packaging patch diode |
| 04/10/2013 | CN103035724A Radio frequency horizontal double-diffusion-field effect transistor and manufacturing method thereof |
| 04/10/2013 | CN103035631A Semi-conductive device for joint encapsulation of high-end chip and low-end chip and manufacture method thereof |
| 04/10/2013 | CN103035630A Stacked semiconductor devices |
| 04/10/2013 | CN103035629A Stacked semiconductor devices |
| 04/10/2013 | CN103035628A Device having wirelessly enabled functional blocks |
| 04/10/2013 | CN103035627A Stacking-type semiconductor package structure |
| 04/10/2013 | CN103035626A Semiconductor package including an integrated waveguide |
| 04/10/2013 | CN103035625A Processing method of one-way electrostatic discharge (ESD) protective device |