| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/10/2013 | CN103035624A Electrostatic protection device and chip thereof |
| 04/10/2013 | CN103035623A Static protector and manufacturing method |
| 04/10/2013 | CN103035622A Semiconductor chip package including voltage generation circuit with reduced power noise |
| 04/10/2013 | CN103035621A Super junction metal oxide semiconductor field effect transistor (MOSFET) terminal protection structure |
| 04/10/2013 | CN103035620A Emi shielded semiconductor package and emi shielded substrate module |
| 04/10/2013 | CN103035619A Electromigration reliability test structure |
| 04/10/2013 | CN103035618A Structure design for 3dic testing |
| 04/10/2013 | CN103035617A Method of judging failure causes of module on chip and wafer structure thereof |
| 04/10/2013 | CN103035616A Vertical transition structure among three-dimensional multi-chip component boards |
| 04/10/2013 | CN103035615A Semiconductor device and manufacturing method of the same |
| 04/10/2013 | CN103035614A Semiconductor structure and method for making same |
| 04/10/2013 | CN103035613A 半导体器件 Semiconductor devices |
| 04/10/2013 | CN103035612A One time programmable structure using a gate last high-k metal gate process |
| 04/10/2013 | CN103035611A Low-temperature co-firing ceramic inductor |
| 04/10/2013 | CN103035610A Electric connection structure for connection trap and substrate in radio frequency (RF) laterally diffused metal oxide semiconductor (LDMOS) and manufacture method |
| 04/10/2013 | CN103035609A Wirelessly communicating among vertically arranged integrated circuits in semiconductor package |
| 04/10/2013 | CN103035608A Semiconductor structure and package structure thereof |
| 04/10/2013 | CN103035607A Method and framework for DIP (Double In-line Package) arrangement in integrated block package frame |
| 04/10/2013 | CN103035606A Leadframe based flash memory cards |
| 04/10/2013 | CN103035605A Semiconductor device and method of manufacture thereof |
| 04/10/2013 | CN103035604A Flip chip encapsulation structure and fabrication process thereof |
| 04/10/2013 | CN103035603A Synchronous buck converter having coplanar array of contact bumps of equal volume |
| 04/10/2013 | CN103035602A Semiconductor device |
| 04/10/2013 | CN103035601A Semiconductor device including diffusion soldered layer on sintered silver layer |
| 04/10/2013 | CN103035600A Bump with protection structure |
| 04/10/2013 | CN103035599A Metal pad structures in dies |
| 04/10/2013 | CN103035598A Formation of connectors without UBM |
| 04/10/2013 | CN103035597A Interposer, circuit board module, and method for manufacturing interposer |
| 04/10/2013 | CN103035596A Electrical connection for chip scale packaging |
| 04/10/2013 | CN103035595A Power module terminal and connection structure thereof |
| 04/10/2013 | CN103035594A Novel type power semiconductor device module |
| 04/10/2013 | CN103035593A Package on packaging structure and methods of making same |
| 04/10/2013 | CN103035592A Heat dissipation device transmitting heat by using phonons |
| 04/10/2013 | CN103035591A Semiconductor encapsulation piece and manufacturing method thereof |
| 04/10/2013 | CN103035590A Insulated gate bipolar translator (IGBT) power module |
| 04/10/2013 | CN103035589A Module chip scale packaging |
| 04/10/2013 | CN103035588A Folded tape package, production method, and camera module |
| 04/10/2013 | CN103035587A High power insulated gate bipolar transistor (IGBT) module encapsulation structure |
| 04/10/2013 | CN103035586A Schottky diode |
| 04/10/2013 | CN103035585A Metal aluminum base aluminum nitride package substrate and preparation method thereof |
| 04/10/2013 | CN103035584A Power module package and method of manufacturing the same |
| 04/10/2013 | CN103035583A Chip box formed in stretching mode and good in welding performance and producing method thereof |
| 04/10/2013 | CN103035582A Method for producing semiconductor device |
| 04/10/2013 | CN103035581A Silicon slice temporary bonding method |
| 04/10/2013 | CN103035580A Temporary bonding and dissociating process method applied to thin silicon slices |
| 04/10/2013 | CN103035579A Wafer level chip scale package and method of manufacturing the same |
| 04/10/2013 | CN103035564A Semiconductor device and production method thereof |
| 04/10/2013 | CN103035532A Field effect transistor of radio frequency lateral double-diffusion and preparation method thereof |
| 04/10/2013 | CN103035484A Method for Fabricating a MIM Capacitor Having a Local Interconnect Metal Electrode and Related Structure |
| 04/10/2013 | CN103035169A Display device, driver assembly, and method for transferring heat |
| 04/10/2013 | CN103031464A 铜接合线 Copper bonding wire |
| 04/10/2013 | CN103030932A Prepreg, metal-clad laminate, printed wiring board, and semiconductor device |
| 04/10/2013 | CN103030929A 树脂组成物 Resin composition |
| 04/10/2013 | CN102387659B Printed circuit board and production method thereof |
| 04/10/2013 | CN102347309B Electric fuse structure and formation method thereof |
| 04/10/2013 | CN102290389B Semiconductor packaging component with cooling fan and stacking structure thereof |
| 04/10/2013 | CN102206098B Ceramic copper-clad substrate and preparation method thereof |
| 04/10/2013 | CN102142419B Two-sided lead frame structure |
| 04/10/2013 | CN102136466B Electrostatic discharge test structure and system of gate-driven MOSFET (metal oxide semiconductor field effect transistor) |
| 04/10/2013 | CN102136465B Open-circuit embedding-removing test structure for trimmer-capacitance MOS (metal oxide semiconductor) varactor and variable capacitance diode |
| 04/10/2013 | CN102105537B Resin composition |
| 04/10/2013 | CN102084481B Planar electrical power electronic modules for high-temperature applications, and corresponding production methods |
| 04/10/2013 | CN101983424B Semiconductor package and method for manufacturing the same |
| 04/10/2013 | CN101937172B Positive type radiation-sensitive composition, cured film, interlayer insulating film, method for forming method interlayer insulating film, display element and siloxane polymer |
| 04/10/2013 | CN101910253B Silsesquioxane resins |
| 04/10/2013 | CN101681691B Conductive ink and conductor |
| 04/10/2013 | CN101644387B LED lamp |
| 04/10/2013 | CN101577272B Luminescence module |
| 04/10/2013 | CN101556930B Technique for evaluating a fabrication of a semiconductor component and wafer |
| 04/10/2013 | CN101519531B White heat-curable silicone resin composition, optoelectric part case, and molding method |
| 04/10/2013 | CN101506974B Latch-up free vertical TVS diode array structure using trench isolation |
| 04/10/2013 | CN101477955B Encapsulation structure and method for tablet reconfiguration |
| 04/10/2013 | CN101471359B Image pickup apparatus and manufacturing method thereof |
| 04/10/2013 | CN101453866B Cooling plate structure of cooling apparatus |
| 04/10/2013 | CN101383327B LCD device, pixel array substrate, manufacturing of pixel array substrate |
| 04/10/2013 | CN101271920B Pixel circuit and display apparatus as well as fabrication method for display apparatus |
| 04/10/2013 | CN101246883B Integrated circuit packaging |
| 04/10/2013 | CN101207078B Inverted metamorphic solar cell with bypass diode |
| 04/09/2013 | US8418114 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium |
| 04/09/2013 | US8418109 Semiconductor integrated circuit with multi-cut via and automated layout method for the same |
| 04/09/2013 | US8416572 System and method for cooling information handling resources |
| 04/09/2013 | US8416202 Display device having touch panel |
| 04/09/2013 | US8415812 Materials and methods for stress reduction in semiconductor wafer passivation layers |
| 04/09/2013 | US8415811 Semiconductor package and electronic component package |
| 04/09/2013 | US8415810 Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof |
| 04/09/2013 | US8415809 Flip chip overmold package |
| 04/09/2013 | US8415808 Semiconductor device with die stack arrangement including staggered die and efficient wire bonding |
| 04/09/2013 | US8415807 Semiconductor structure and method for making the same |
| 04/09/2013 | US8415806 Semiconductor structure and method for manufacturing the same |
| 04/09/2013 | US8415805 Etched wafers and methods of forming the same |
| 04/09/2013 | US8415804 Semiconductor chip, method of fabricating the same, and stack module and memory card including the same |
| 04/09/2013 | US8415803 Method and system for routing electrical connections of semiconductor chips |
| 04/09/2013 | US8415801 Semiconductor device having thermal endurance and method of manufacturing the same |
| 04/09/2013 | US8415800 Top layers of metal for high performance IC's |
| 04/09/2013 | US8415799 Dual damascene interconnect in hybrid dielectric |
| 04/09/2013 | US8415798 Semiconductor device having a conductor buried in an opening |
| 04/09/2013 | US8415797 Gold wire for semiconductor element connection |
| 04/09/2013 | US8415796 Semiconductor device having a multilayer structure |
| 04/09/2013 | US8415795 Semiconductor device and assembling method thereof |
| 04/09/2013 | US8415794 Semiconductor device having stable signal transmission at high speed and high frequency |