| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/17/2013 | CN103050454A Package on package structure |
| 04/17/2013 | CN103050453A Surface mount microwave device and packaging process thereof |
| 04/17/2013 | CN103050452A Rewiring high-density AAQFN (Area Array Quad Flat No-lead) packaging device and manufacture method thereof |
| 04/17/2013 | CN103050451A Double-row pin quad flat no lead packaging piece and insulating treatment method thereof |
| 04/17/2013 | CN103050450A Chip packaging structure and manufacturing method thereof |
| 04/17/2013 | CN103050449A Package member and manufacture method thereof |
| 04/17/2013 | CN103050448A Busbar type power module support |
| 04/17/2013 | CN103050447A Methods of packaging semiconductor devices and structures thereof |
| 04/17/2013 | CN103050439A Interconnection line structure and forming method thereof |
| 04/17/2013 | CN103050436A Semiconductor device and method of forming conductive pillar having an expanded base |
| 04/17/2013 | CN103050433A Semiconductor contact hole structure and manufacturing method thereof |
| 04/17/2013 | CN103050418A Pad manufacturing method and pad |
| 04/17/2013 | CN103050399A Diode with three-medium-layer passivation structure and manufacturing method thereof |
| 04/17/2013 | CN103050376A Deposited material and method of formation |
| 04/17/2013 | CN103047893A Micro cone tower array heat exchanging plate and manufacture method thereof |
| 04/17/2013 | CN103044924A Addition type liquid pouring sealant for semiconductor assembling piece and preparation method thereof |
| 04/17/2013 | CN102347305B Array structure of lead frame |
| 04/17/2013 | CN102315197B Three-dimensional (3D) integrated circuit structure and method for detecting alignment of chip structures |
| 04/17/2013 | CN102280433B Encapsulation structure and encapsulation method for wafer-level die sizes |
| 04/17/2013 | CN102263086B 半导体封装结构 Semiconductor package structure |
| 04/17/2013 | CN102263011B Semiconductor structure manufacturing method |
| 04/17/2013 | CN102239554B Molding device for producing epoxy plastic-sealed pressed automobile rectifying diode |
| 04/17/2013 | CN102237187B Planar transformer and method for manufacturing same through integration |
| 04/17/2013 | CN102234731B Aluminum alloy sheet production method and application thereof |
| 04/17/2013 | CN102226990B Novel transistor construction |
| 04/17/2013 | CN102214615B Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof |
| 04/17/2013 | CN102208355B Square planar guide-pin-free semiconductor packaging part and manufacturing method thereof |
| 04/17/2013 | CN102194779B 封装结构 Package |
| 04/17/2013 | CN102194775B Pin-free packaging structure with four flat sides |
| 04/17/2013 | CN102169875B Semiconductor device and producing method thereof |
| 04/17/2013 | CN102157498B Hybrid integrated circuit module and manufacturing method thereof |
| 04/17/2013 | CN102148203B Semiconductor chip and method for forming conductive pillar |
| 04/17/2013 | CN102110688B Serial number generator and forming method thereof, and integrated circuit and forming method thereof |
| 04/17/2013 | CN102104007B Method and equipment for manufacturing special circuit board |
| 04/17/2013 | CN102097809B Thyristor valve block of static var compensator (SVC) |
| 04/17/2013 | CN102088012B Electronic component package body and manufacturing method thereof |
| 04/17/2013 | CN102074542B Double-flat integrated circuit (IC) chip packaging part with short pins and manufacturing method thereof |
| 04/17/2013 | CN102074505B Liquid crystal on silicon (LCOS) device and manufacturing method thereof |
| 04/17/2013 | CN102044517B Production method of super-high-power IC chip package |
| 04/17/2013 | CN102024781B Tri-dimensional integrated circuit structure |
| 04/17/2013 | CN101998812B Heat-dissipating module |
| 04/17/2013 | CN101996931B Method for forming semiconductor device |
| 04/17/2013 | CN101937899B Semiconductor packaging structure and packaging technology thereof |
| 04/17/2013 | CN101930950B 半导体装置 Semiconductor device |
| 04/17/2013 | CN101807563B Electrostatic protection element and electronic device |
| 04/17/2013 | CN101806439B Heat dissipation structure of LED |
| 04/17/2013 | CN101779280B Corrugated interfaces for multilayered interconnects |
| 04/17/2013 | CN101764092B Semiconductor structure, forming and operating method thereof |
| 04/17/2013 | CN101728363B Chip package structure and manufacturing method thereof |
| 04/17/2013 | CN101714538B Semiconductor device and method of manufacturing the same |
| 04/17/2013 | CN101679602B Novel flame-retardant epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product thereof |
| 04/17/2013 | CN101661911B Chip package structure |
| 04/17/2013 | CN101655273B Variable frequency control device and variable frequency control method of variable frequency air-conditioner |
| 04/17/2013 | CN101646327B Radiating device and radiating method |
| 04/17/2013 | CN101567326B Printed circuit board and method for forming same |
| 04/17/2013 | CN101533849B Resistive memory devices and method of forming the same |
| 04/17/2013 | CN101466249B Base device with medial plate design and method for cooling the device |
| 04/17/2013 | CN101441727B Electronic apparatus and method of manufacturing the same |
| 04/17/2013 | CN101436586B Semiconductor module and image pickup apparatus |
| 04/17/2013 | CN101295702B Substrate with feedthrough and method for producing the same |
| 04/17/2013 | CN101292393B Vertical signal path, printed board provided with such vertical signal path, and semiconductor package provided with such printed board and semiconductor chip |
| 04/16/2013 | USRE44148 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof |
| 04/16/2013 | US8423851 Measured device and test system utilizing the same |
| 04/16/2013 | US8423317 Temperature detection method of semiconductor device and power conversion apparatus |
| 04/16/2013 | US8421838 Optical device, optical scanning device, image forming apparatus, and manufacturing method of optical device |
| 04/16/2013 | US8421250 Semiconductor device and a method of manufacturing the same |
| 04/16/2013 | US8421249 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 04/16/2013 | US8421248 Electronic device and electronic apparatus |
| 04/16/2013 | US8421247 Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material |
| 04/16/2013 | US8421245 Substrate with embedded stacked through-silicon via die |
| 04/16/2013 | US8421243 Layered chip package and method of manufacturing same |
| 04/16/2013 | US8421242 Semiconductor package |
| 04/16/2013 | US8421241 System and method for stacking a plurality of electrically coupled semiconductor chips with a conductive pin |
| 04/16/2013 | US8421240 Sensor device and method of manufacturing the sensor device |
| 04/16/2013 | US8421238 Stacked semiconductor device with through via |
| 04/16/2013 | US8421237 Stacked memory layers having multiple orientations and through-layer interconnects |
| 04/16/2013 | US8421236 Semiconductor device |
| 04/16/2013 | US8421235 Semiconductor device with heat spreaders |
| 04/16/2013 | US8421234 Semiconductor device and method of manufacturing the same |
| 04/16/2013 | US8421233 Semiconductor device |
| 04/16/2013 | US8421232 Semiconductor device and automotive ac generator |
| 04/16/2013 | US8421231 Electrically conductive composite |
| 04/16/2013 | US8421230 Microelectronic device provided with an array of elements made from a conductive polymer with a positive temperature coefficient |
| 04/16/2013 | US8421228 Structure and methods of forming contact structures |
| 04/16/2013 | US8421227 Semiconductor chip structure |
| 04/16/2013 | US8421225 Three-dimensional stacked substrate arrangements |
| 04/16/2013 | US8421224 Semiconductor chip having double bump structure and smart card including the same |
| 04/16/2013 | US8421223 Conductive structure for a semiconductor integrated circuit |
| 04/16/2013 | US8421222 Chip package having a chip combined with a substrate via a copper pillar |
| 04/16/2013 | US8421221 Integrated circuit heat spreader stacking system |
| 04/16/2013 | US8421220 Silicon based microchannel cooling and electrical package |
| 04/16/2013 | US8421219 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same |
| 04/16/2013 | US8421218 Method for direct heat sink attachment |
| 04/16/2013 | US8421217 Achieving mechanical and thermal stability in a multi-chip package |
| 04/16/2013 | US8421216 Vacuum hermetic organic packaging carrier |
| 04/16/2013 | US8421215 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board |
| 04/16/2013 | US8421214 Semiconductor device and method for manufacturing a semiconductor device |
| 04/16/2013 | US8421213 Package structure |
| 04/16/2013 | US8421212 Integrated circuit packaging system with active surface heat removal and method of manufacture thereof |
| 04/16/2013 | US8421211 Wafer level semiconductor package and fabrication method thereof |