| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/18/2013 | US20130092938 Silicon based microchannel cooling and electrical package |
| 04/18/2013 | US20130092937 Display device |
| 04/18/2013 | US20130092936 Semiconductor apparatus |
| 04/18/2013 | US20130092935 Probe Pad Design for 3DIC Package Yield Analysis |
| 04/18/2013 | US20130092230 Substrate comprising a transparent conductive oxide film and its manufacturing process |
| 04/18/2013 | US20130091693 Thermal expansion-enhanced heat sink for an electronic assembly |
| 04/18/2013 | DE112011101661T5 Optimierter Verbindungsdraht Optimized connecting wire |
| 04/18/2013 | DE112010003271T5 Hochfrequenz Fast Recovery Diode High frequency fast recovery diode |
| 04/18/2013 | DE112008001282B4 Kühlvorrichtung Cooler |
| 04/18/2013 | DE112007002071B4 Elektronisches system sowie verfahren zur herstellung eines solchen und halbleitergehäuse mit formgedächtnislegierungsstab An electronic system as well as methods for producing such a semiconductor package and a shape memory alloy rod |
| 04/18/2013 | DE102012218670A1 Elektronikmodul und leistungssystem Electronic module and power system |
| 04/18/2013 | DE102012217198A1 Elektronische Vorrichtung und Verfahren zum Herstellen derselben Electronic device and method of manufacturing the same |
| 04/18/2013 | DE102012202765B3 Halbleitermodul Semiconductor module |
| 04/18/2013 | DE102011115887A1 Leistungshalbleiterchip mit oberseitigen Potentialflächen Power semiconductor chip with top-side potential surfaces |
| 04/18/2013 | DE102008024487B4 Halbleitervorrichtung mit integrierter Spule und Verfahren zu deren Herstellung A semiconductor device comprising an integrated coil and processes for their preparation |
| 04/17/2013 | EP2582217A2 Assembly for liquid cooling electronics by direct submersion into circulated engine coolant. |
| 04/17/2013 | EP2582214A2 Method for Forming Conductive Circuit |
| 04/17/2013 | EP2582213A1 Flow channel member, heat exchanger using same, and electronic component device |
| 04/17/2013 | EP2581937A1 Resin-sealed semiconductor device and method for manufacturing same |
| 04/17/2013 | EP2581936A2 Package with unattached semiconductor device |
| 04/17/2013 | EP2581935A2 MOM capacitor having electrodes made from local interconnects and manufacturing method thereof |
| 04/17/2013 | EP2581357A1 Aluminium nitride substrate for circuit board and production method thereof |
| 04/17/2013 | EP2581338A1 Method for encapsulating microdevice by transferring cover and depositing getter through the cover |
| 04/17/2013 | EP2580861A1 Integrated circuit including a differential power amplifier with a single ended output and an integrated balun |
| 04/17/2013 | EP2580778A1 Heat-conducting element, assembly and use of the same |
| 04/17/2013 | EP2580777A2 Wafer backside coating process with pulsed uv light source |
| 04/17/2013 | EP2580776A1 Method of redistributing functional element |
| 04/17/2013 | CN202889774U Printed circuit board (PCB) assembly |
| 04/17/2013 | CN202889221U Three-phase rectification power module of wide-range bending line electrode |
| 04/17/2013 | CN202888186U Semiconductor discharge tube with plastic package pieces |
| 04/17/2013 | CN202888185U Flat packaging crimping type outlet electrode insulated gate bipolar transistor element |
| 04/17/2013 | CN202888171U Thyristor module |
| 04/17/2013 | CN202888170U Multi-chip assembly with controllable operating temperature |
| 04/17/2013 | CN202888169U Composite element integrating thermistor and semiconductor chip |
| 04/17/2013 | CN202888168U Electronic component |
| 04/17/2013 | CN202888167U Carborundum power electronic device |
| 04/17/2013 | CN202888166U Multi-row matrix lead frame of integrated circuit SOT89 |
| 04/17/2013 | CN202888165U SOT223 (Small Outline Transistor 223) matrix type lead wire framework capable of improving material utilization rate |
| 04/17/2013 | CN202888164U Novel TO (Triode)-series matrix type lead frame |
| 04/17/2013 | CN202888163U Photoelectric coupler lead wire frame and photoelectric coupler |
| 04/17/2013 | CN202888162U Electrode |
| 04/17/2013 | CN202888161U Low-stress electrode |
| 04/17/2013 | CN202888160U Novel diode module |
| 04/17/2013 | CN202888159U Chip |
| 04/17/2013 | CN202888158U Pad and chip |
| 04/17/2013 | CN202888157U Liquid cooling plate-type radiator used for electric power semiconductor element |
| 04/17/2013 | CN202888156U Heat radiator of chip |
| 04/17/2013 | CN202888155U Metal substrate for being welded with power module |
| 04/17/2013 | CN202888154U Radiator structure |
| 04/17/2013 | CN202888153U Metal-coated ceramic substrate with radiating function |
| 04/17/2013 | CN202888152U Power module based on novel metal-coated ceramic substrate |
| 04/17/2013 | CN202888151U Self-positioning pipe shell |
| 04/17/2013 | CN202888150U Three-phase rectification module encapsulation housing |
| 04/17/2013 | CN202888149U Full-pressure-welding packaging high-voltage semiconductor device |
| 04/17/2013 | CN202888148U Vane type rotary rectification element |
| 04/17/2013 | CN202888147U Intelligent power module |
| 04/17/2013 | CN202888146U Intelligent power module |
| 04/17/2013 | CN202886795U Array substrate, peripheral circuit thereof and display device |
| 04/17/2013 | CN103053027A Thin film transistor substrate |
| 04/17/2013 | CN103053022A 挠性热交换器 Flexible heat exchanger |
| 04/17/2013 | CN103053021A Electronic part and method of manufacturing same |
| 04/17/2013 | CN103053009A Vertical capacitors formed on semiconducting substrates |
| 04/17/2013 | CN103052687A Functional particle, group of functional particles, filler, resin composition for electronic part, electronic part, and semiconductor device |
| 04/17/2013 | CN103052667A Curing resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material |
| 04/17/2013 | CN103052299A Heat radiating module and fixing method thereof |
| 04/17/2013 | CN103051156A 变频器 Drive |
| 04/17/2013 | CN103050608A LED (light emitting diode) packaged based on zinc oxide-bismuth oxide composite ceramic substrate and preparation method thereof |
| 04/17/2013 | CN103050487A Integrated circuit structure having dies with connectors of different sizes |
| 04/17/2013 | CN103050486A Process for forming package-on-package structures |
| 04/17/2013 | CN103050485A Package substrate structure |
| 04/17/2013 | CN103050484A Multi-path electrostatic discharge protection device |
| 04/17/2013 | CN103050483A Vertically oriented semiconductor device and shielding structure thereof |
| 04/17/2013 | CN103050482A Packaging structure and method of fabricating the same |
| 04/17/2013 | CN103050481A Lettering detection tool |
| 04/17/2013 | CN103050480A Technical method for imaging rear side of silicon wafer |
| 04/17/2013 | CN103050479A Method and apparatus for de-embedding |
| 04/17/2013 | CN103050478A Probe pad design for 3dic package yield analysis |
| 04/17/2013 | CN103050477A Electronic device and method for producing same |
| 04/17/2013 | CN103050476A Semiconductor device and method of forming protection and support structure for conductive interconnect structure |
| 04/17/2013 | CN103050475A Anti-warp packaging substrate |
| 04/17/2013 | CN103050474A Encapsulating substrate structure provided with coupling circuit |
| 04/17/2013 | CN103050473A Wafer-level chip scale package with re-workable underfill |
| 04/17/2013 | CN103050472A Lead frame bar for semiconductor packaging, and mold and adhesive sealing method thereof |
| 04/17/2013 | CN103050471A Single-chip package manufactured by using tin-silver-copper alloy immersion method and manufacturing process of single-chip package |
| 04/17/2013 | CN103050470A 智能功率模块及其制作方法 Intelligent Power Module and its production method |
| 04/17/2013 | CN103050469A Outer-lead-free lead frame strip of semiconductor encapsulation structure |
| 04/17/2013 | CN103050468A Flat multichip encapsulation piece of stamping framework with trapezoidal holes |
| 04/17/2013 | CN103050467A Package structure and the method to fabricate thereof |
| 04/17/2013 | CN103050466A Semiconductor package and method of fabricating the same |
| 04/17/2013 | CN103050465A Wafer-thinning single-chip encapsulation piece with copper pillars and manufacturing technology thereof |
| 04/17/2013 | CN103050464A Electronic packaging connector and methods for its production |
| 04/17/2013 | CN103050463A Ic chip package and chip-on-glass structure using the same |
| 04/17/2013 | CN103050462A Semiconductor device package and method |
| 04/17/2013 | CN103050461A Post-passivation interconnect structure |
| 04/17/2013 | CN103050460A Semiconductor device and method for manufacturing the same |
| 04/17/2013 | CN103050459A Power module signal terminal and connecting structure thereof |
| 04/17/2013 | CN103050458A Silicon through-hole structure with patterning surface, patterning sidewall and local isolation |
| 04/17/2013 | CN103050457A Spacer for semiconductor structure contact |
| 04/17/2013 | CN103050456A Pins for semiconductor device |
| 04/17/2013 | CN103050455A Package on package structure |