| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/23/2013 | US8426960 Wafer level chip scale packaging |
| 04/23/2013 | US8426959 Semiconductor package and method of manufacturing the same |
| 04/23/2013 | US8426958 Stacked chip package with redistribution lines |
| 04/23/2013 | US8426957 Edge connect wafer level stacking |
| 04/23/2013 | US8426956 Semiconductor package structure having plural packages in a stacked arrangement |
| 04/23/2013 | US8426955 Integrated circuit packaging system with a stack package and method of manufacture thereof |
| 04/23/2013 | US8426954 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
| 04/23/2013 | US8426953 Semiconductor package with an embedded printed circuit board and stacked die |
| 04/23/2013 | US8426952 Stacked half-bridge package with a common conductive leadframe |
| 04/23/2013 | US8426951 Multi-chip package having frame interposer |
| 04/23/2013 | US8426950 Die package including multiple dies and lead orientation |
| 04/23/2013 | US8426948 Laminated semiconductor wafer, laminated chip package and method of manufacturing the same |
| 04/23/2013 | US8426947 Laminated semiconductor wafer, laminated chip package and method of manufacturing the same |
| 04/23/2013 | US8426946 Laminated semiconductor substrate, laminated chip package and method of manufacturing the same |
| 04/23/2013 | US8426943 Semiconductor device having e-fuse structure and method of fabricating the same |
| 04/23/2013 | US8426942 Semiconductor device with a fuse |
| 04/23/2013 | US8426941 Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement |
| 04/23/2013 | US8426930 Sensor module |
| 04/23/2013 | US8426922 CMOS structure and latch-up preventing method of same |
| 04/23/2013 | US8426894 Pixel structure |
| 04/23/2013 | US8426885 Light emitting device |
| 04/23/2013 | US8426856 Thermally sensitive material embedded in the substrate |
| 04/23/2013 | US8426855 Pad structure having a metalized region and a non-metalized region |
| 04/23/2013 | US8426752 Electric connection box |
| 04/23/2013 | US8426745 Thin film resistor |
| 04/23/2013 | US8426742 Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package |
| 04/23/2013 | US8426308 Method of forming through silicon via of semiconductor device using low-k dielectric material |
| 04/23/2013 | US8426305 Method of fabricating integrated circuitry |
| 04/23/2013 | US8426251 Semiconductor device |
| 04/23/2013 | US8426244 High speed, high density, low power die interconnect system |
| 04/23/2013 | US8426241 Structure and method of fabricating a CZTS photovoltaic device by electrodeposition |
| 04/23/2013 | US8426234 Device for detecting an attack against an integrated circuit |
| 04/23/2013 | US8426024 Diamond like carbon coating of substrate housings |
| 04/23/2013 | US8425115 Multi-layered thermal sensor for integrated circuits and other layered structures |
| 04/23/2013 | CA2393069C Power converter enclosure |
| 04/18/2013 | WO2013055700A1 Wafer level applied rf shields |
| 04/18/2013 | WO2013055406A1 Multi-die integrated circuit structure with heat sink |
| 04/18/2013 | WO2013054887A1 Cooler for semiconductor module, and semiconductor module |
| 04/18/2013 | WO2013054852A1 Silicon nitride substrate and method for manufacturing silicon nitride substrate |
| 04/18/2013 | WO2013054739A1 Method for producing semiconductor device, and semiconductor device |
| 04/18/2013 | WO2013054625A1 Resin substrate having built-in component |
| 04/18/2013 | WO2013054615A1 Cooler for semiconductor module, and semiconductor module |
| 04/18/2013 | WO2013054504A1 Semiconductor package and semiconductor device |
| 04/18/2013 | WO2013054416A1 Semiconductor module |
| 04/18/2013 | WO2013054408A1 Circuit board for large-capacity module peripheral circuit and large-capacity module containing peripheral circuit using said circuit board |
| 04/18/2013 | WO2013054015A1 Flip-chip hybridization of microelectronic components using suspended fusible resistive connection elements |
| 04/18/2013 | WO2013053420A1 Power semi-conductor chip with a metal moulded body for contacting thick wires or strips, and method for the production thereof |
| 04/18/2013 | WO2013053419A1 Method for providing a connection between metal moulded bodies and a power semi-conductor which is used to join thick wires or strips |
| 04/18/2013 | WO2013053174A1 High efficiency heat sink with porous metal structure |
| 04/18/2013 | WO2013019541A3 Low-stress vias |
| 04/18/2013 | WO2013012587A3 Semiconductor package resin composition and usage method thereof |
| 04/18/2013 | WO2013006496A3 Multiple socket concept |
| 04/18/2013 | US20130094799 Optoelectronic interface |
| 04/18/2013 | US20130094301 Interfaces and die packages, and appartuses including the same |
| 04/18/2013 | US20130094149 Structure for mounting heat sink, and heat sink mounted using the structure |
| 04/18/2013 | US20130094113 Initial-on scr device for on-chip esd protection |
| 04/18/2013 | US20130093455 Tsv testing method and apparatus |
| 04/18/2013 | US20130093105 Sealing film and a semiconductor device using the same |
| 04/18/2013 | US20130093104 Bond pad structure and fabricating method thereof |
| 04/18/2013 | US20130093102 Semiconductor packages and methods of manufacturing the same |
| 04/18/2013 | US20130093101 Semiconductor device |
| 04/18/2013 | US20130093100 Semiconductor Device and Method of Forming Conductive Pillar Having an Expanded Base |
| 04/18/2013 | US20130093099 Semiconductor apparatus |
| 04/18/2013 | US20130093098 Through substrate via structures and methods of forming the same |
| 04/18/2013 | US20130093097 Package-On-Package (PoP) Structure and Method |
| 04/18/2013 | US20130093096 Semiconductor device |
| 04/18/2013 | US20130093095 Semiconductor module |
| 04/18/2013 | US20130093094 Method and Apparatus for Die Assembly |
| 04/18/2013 | US20130093093 Semiconductor device with damascene bit line and method for fabricating the same |
| 04/18/2013 | US20130093092 Electronic device and method for producing same |
| 04/18/2013 | US20130093091 Three-Dimensional Vertical Interconnecting Structure and Manufacturing Method Thereof |
| 04/18/2013 | US20130093090 Method for fabricating semiconductor device and semiconductor device |
| 04/18/2013 | US20130093089 Interconnect Structure With An Electromigration and Stress Migration Enhancement Liner |
| 04/18/2013 | US20130093088 Package-on-package assembly with wire bond vias |
| 04/18/2013 | US20130093087 Package-on-package assembly with wire bond vias |
| 04/18/2013 | US20130093086 Semiconductor package and method of fabricating the same |
| 04/18/2013 | US20130093085 Dual interlock heatsink assembly for enhanced cavity pbga packages, and method of manufacture |
| 04/18/2013 | US20130093084 Wafer-Level Chip Scale Package with Re-Workable Underfill |
| 04/18/2013 | US20130093083 Semiconductor device and stacked semiconductor device |
| 04/18/2013 | US20130093082 Semiconductor device, electrode member, and electrode member fabrication method |
| 04/18/2013 | US20130093081 Ic chip package and chip-on-glass structure using the same |
| 04/18/2013 | US20130093079 Connector Structures of Integrated Circuits |
| 04/18/2013 | US20130093078 Process for Forming Package-on-Package Structures |
| 04/18/2013 | US20130093077 Post-passivation interconnect structure |
| 04/18/2013 | US20130093076 Semiconductor package and method of forming the same |
| 04/18/2013 | US20130093075 Semiconductor Device Package and Method |
| 04/18/2013 | US20130093074 Multi-die integrated circuit structure with heat sink |
| 04/18/2013 | US20130093073 High thermal performance 3d package on package structure |
| 04/18/2013 | US20130093072 Leadframe pad design with enhanced robustness to die crack failure |
| 04/18/2013 | US20130093071 Optical module with a lens encapsulated within sealant and method for manufacturing the same |
| 04/18/2013 | US20130093070 Semiconductor device capable of switching operation modes |
| 04/18/2013 | US20130093069 Package structure and the method to fabricate thereof |
| 04/18/2013 | US20130093068 Semiconductor Device and Method of Forming Air Gap Adjacent to Stress Sensitive Region of the Die |
| 04/18/2013 | US20130093067 Wafer level applied rf shields |
| 04/18/2013 | US20130093061 Semiconductor device and method for manufacturing the same |
| 04/18/2013 | US20130093044 Semiconductor device |
| 04/18/2013 | US20130093042 TSV Formation Processes Using TSV-Last Approach |
| 04/18/2013 | US20130092988 Self-aligned silicide formation on source/drain through contact via |
| 04/18/2013 | US20130092949 Semiconductor device, semiconductor substrate, method for manufacturing device, and method for manufacturing semiconductor substrate |
| 04/18/2013 | US20130092948 Semiconductor device and fabrication method of the semiconductor device |