| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/29/2015 | DE102013107971A1 Optoelektronischer Halbleiterchip, Halbleiterbauelement und Verfahren zur Herstellung von optoelektronischen Halbleiterchips The optoelectronic semiconductor chip, semiconductor device and process for the production of optoelectronic semiconductor chips |
| 01/29/2015 | DE102004043258B4 Halbleiteranordnung mit einem Paar von Wärmesenken und Verfahren zu deren Herstellung A semiconductor device comprising a pair of heat sinks and methods for their preparation |
| 01/29/2015 | DE10146227B4 Siliciumnitrid-Sinterkörper, Leiterplatte und thermoelektrisches Modul Silicon nitride sintered body, PCB and thermoelectric module |
| 01/28/2015 | EP2830403A1 Method for manufacturing substrate with integrated radiator, and substrate with integrated radiator |
| 01/28/2015 | EP2830089A1 RF power device |
| 01/28/2015 | EP2830088A2 Cooling fluid flow passage matrix for electronics cooling |
| 01/28/2015 | EP2829579A1 Curable composition, cured product, and method for using curable composition |
| 01/28/2015 | EP2828925A1 Micro-link high-bandwidth chip-to-chip bus |
| 01/28/2015 | EP2828892A1 Electroconductive thin film, coating liquid for forming electroconductive thin film, field-effect transistor, and method for producing field-effect transistor |
| 01/28/2015 | EP2828890A1 An assembly and a chip package |
| 01/28/2015 | EP2828889A2 Thermal interface material |
| 01/28/2015 | EP2828888A1 Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone |
| 01/28/2015 | EP2828319A1 Compositions comprising resin- linear organosiloxane block copolymers and organopolysiloxanes |
| 01/28/2015 | EP2828316A1 Compositions of resin-linear organosiloxane block copolymers |
| 01/28/2015 | CN204131895U 热传递催化散热结构 Heat transfer catalytic thermal structure |
| 01/28/2015 | CN204131822U 加强绝缘强度的led驱动电源线路板及其封装结构 Reinforced insulation strength led drive power circuit board and package structure |
| 01/28/2015 | CN204130552U 一种点接触型二极管 For point-contact diode |
| 01/28/2015 | CN204130524U 一种新型单相整流桥 A new single-phase rectifier bridge |
| 01/28/2015 | CN204130523U 一种功率模块引线端子 A power module of the lead terminal |
| 01/28/2015 | CN204130522U 一种局部镀银的引线框架 A topical silver-plated lead frame |
| 01/28/2015 | CN204130521U 一种封装导线材料结构 A wire material structure package |
| 01/28/2015 | CN204130520U 贴片式mosfet管的固定及散热结构 Fixed and thermal structure SMD mosfet tube |
| 01/28/2015 | CN204130519U 基于插件式mosfet管的固定及散热结构 Thermal structure based on fixed and plug-mosfet tube |
| 01/28/2015 | CN204130518U 一种微型耐压高散热的芯片 A miniature high pressure cooling chips |
| 01/28/2015 | CN204130517U 带边缘保护的晶圆级芯片尺寸封装结构及芯片封装单元 Wafer-level chip size package structure and chip packaging units with edge protection |
| 01/28/2015 | CN104321870A 电功率模块设置 Electric power module settings |
| 01/28/2015 | CN104321869A 半导体功率模块和装置 Semiconductor power modules and devices |
| 01/28/2015 | CN104321867A 半导体器件 Semiconductor devices |
| 01/28/2015 | CN104321865A 具有机械熔丝的半导体封装 Semiconductor package with mechanical fuses |
| 01/28/2015 | CN104321864A 具有非共面的、包封的微电子器件和无焊内建层的微电子封装 Having non-coplanar, encapsulated microelectronic device and bumpless build-up layer of the microelectronic package |
| 01/28/2015 | CN104321863A 带有多个管芯的封装基板 Package substrate with a plurality of dies |
| 01/28/2015 | CN104321862A 层叠基板 Laminated substrate |
| 01/28/2015 | CN104321861A 电子元件搭载用基板以及电子装置 Electronic element mounting board and an electronic device |
| 01/28/2015 | CN104321860A 电子器件中易碎无机层处的接触部位的几何结构 Fragile electronic devices at the contact portion of the inorganic layer geometry |
| 01/28/2015 | CN104321714A 至少部分地由晶片制成并且包括至少一个复制的集成电路的至少一个管芯 Made at least partially from the wafer and an integrated circuit comprising at least one copy of at least one die |
| 01/28/2015 | CN104321385A 固化性树脂组合物及其固化物、密封剂以及光半导体装置 The curable resin composition and a cured product, and optical semiconductor device encapsulant |
| 01/28/2015 | CN104321384A 可固化组合物 The curable composition |
| 01/28/2015 | CN104319272A 晶闸管阀段及其晶闸管散热器 Thyristor valve section and thyristor radiator |
| 01/28/2015 | CN104319271A Cdm静电保护电路 Cdm electrostatic protection circuit |
| 01/28/2015 | CN104319270A 胎压感应器封装引线框架 Tire pressure sensor package leadframe |
| 01/28/2015 | CN104319269A 多级引线框架 Multi-level lead frame |
| 01/28/2015 | CN104319268A 一种晶片型二极体封装元件及其制法 A wafer-type diode packaging components Jiqizhifa |
| 01/28/2015 | CN104319267A 一种超高密度分立式薄型无引脚封装体及其封装方法 An ultra-high-density discrete thin leadless package and packaging method |
| 01/28/2015 | CN104319266A 车用电子元件的密封胶封装结构及胶封方法 Car sealant sealed plastic package structure and method of electronic components |
| 01/28/2015 | CN104319265A 元件嵌入式封装结构、其半导体装置及其制造方法 Element embedded package structure, a semiconductor device and manufacturing method thereof |
| 01/28/2015 | CN104319264A 一种玻璃上芯片封装摄像头模组 On a glass chip camera module package |
| 01/28/2015 | CN104319239A 涉及利用表面贴装器件实施的共形覆膜的设备及方法 Involving conformal coating apparatus and method using surface mount devices implemented |
| 01/28/2015 | CN102832210B 低阻衬底上的多表面集成器件 Multi-surface low resistance integrated devices on the substrate |
| 01/28/2015 | CN102800645B 对称式差动电感结构 Symmetric differential inductor structure |
| 01/28/2015 | CN102800566B 一种半导体器件中接触区引线工艺保护对准标记的方法 A semiconductor device lead process alignment mark protection method contacting zone |
| 01/28/2015 | CN102751249B 散热器及其制造方法 Heat sink and a manufacturing method |
| 01/28/2015 | CN102738125B 新型的分形pfs结构 The new structure fractal pfs |
| 01/28/2015 | CN102651350B 晶片封装体 Chip package |
| 01/28/2015 | CN102629561B 叠层式半导体组件制备方法 Stacked semiconductor component preparation |
| 01/28/2015 | CN102623423B 集成电路图案及多重图案化方法 IC design and multiple patterning method |
| 01/28/2015 | CN102610604B 具有限定的热流的集成器件及其制造方法 Having a heat integrated device and manufacturing method defined |
| 01/28/2015 | CN102569209B 防裂结构 Crack structure |
| 01/28/2015 | CN102471581B 半导体密封用固化性组合物 Semiconductor encapsulating curable composition |
| 01/28/2015 | CN102468275B 半导体器件和制造半导体器件的方法 The method of manufacturing a semiconductor device and a semiconductor device |
| 01/28/2015 | CN102412231B 互连件区域 Interconnect area |
| 01/28/2015 | CN102347287B 多层布线基板 A multilayer wiring board |
| 01/28/2015 | CN102194716B 半导体装置的制造方法及半导体装置 The method of manufacturing a semiconductor device and semiconductor device |
| 01/28/2015 | CN102158775B 微机电系统麦克风封装结构及其形成方法 MEMS microphone package structure and method of forming |
| 01/27/2015 | US8943456 Layout determining for wide wire on-chip interconnect lines |
| 01/27/2015 | US8942643 Routing for a package antenna |
| 01/27/2015 | US8942009 Lead assembly for a flip-chip power switch |
| 01/27/2015 | US8942004 Printed circuit board having electronic components embedded therein |
| 01/27/2015 | US8941999 Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics |
| 01/27/2015 | US8941996 Circuit board and heat dissipation device thereof |
| 01/27/2015 | US8941995 Fixing bracket and electronic device using the same |
| 01/27/2015 | US8941962 Snubber circuit and method of using bipolar junction transistor in snubber circuit |
| 01/27/2015 | US8941832 Lateral shift measurement using an optical technique |
| 01/27/2015 | US8941742 Luminance measurement method, luminance measurement device, and image quality adjustment technique using the method and device |
| 01/27/2015 | US8941460 Rolled-up transformer structure for a radiofrequency integrated circuit (RFIC) |
| 01/27/2015 | US8941357 Heating circuits and methods based on battery discharging and charging using resonance components in series and freewheeling circuit components |
| 01/27/2015 | US8941356 Battery heating circuits and methods with resonance components in series using energy transfer |
| 01/27/2015 | US8941250 Electronic component package fabrication method and structure |
| 01/27/2015 | US8941249 Low loop wire bonding |
| 01/27/2015 | US8941248 Semiconductor device package and method |
| 01/27/2015 | US8941247 Stacked die package for MEMS resonator system |
| 01/27/2015 | US8941246 Semiconductor device and manufacturing method thereof |
| 01/27/2015 | US8941245 Semiconductor package including semiconductor chip with through opening |
| 01/27/2015 | US8941244 Semiconductor device and manufacturing method thereof |
| 01/27/2015 | US8941243 Semiconductor device and method of manufacturing thereof |
| 01/27/2015 | US8941242 Method of protecting against via failure and structure therefor |
| 01/27/2015 | US8941241 Semiconductor device and method of manufacturing the same |
| 01/27/2015 | US8941240 Fabricating a contact rhodium structure by electroplating and electroplating composition |
| 01/27/2015 | US8941239 Copper interconnect structure and method for forming the same |
| 01/27/2015 | US8941238 Semiconductor device |
| 01/27/2015 | US8941237 Semiconductor device |
| 01/27/2015 | US8941236 Using collapse limiter structures between elements to reduce solder bump bridging |
| 01/27/2015 | US8941235 Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate |
| 01/27/2015 | US8941234 Manufacturing process and heat dissipating device for forming interface for electronic component |
| 01/27/2015 | US8941233 Integrated circuit package with inter-die thermal spreader layers |
| 01/27/2015 | US8941232 Metal bumps for cooling device connection |
| 01/27/2015 | US8941231 Electronic chip and method of fabricating the same |
| 01/27/2015 | US8941230 Semiconductor package and manufacturing method |
| 01/27/2015 | US8941229 Semiconductor device and method of manufacturing the same |
| 01/27/2015 | US8941228 Semiconductor module and manufacturing method thereof |
| 01/27/2015 | US8941227 Package structure and method for manufacturing same |