| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/24/2013 | CN103066049A Package substrate and manufacture method thereof |
| 04/24/2013 | CN103066048A Packaging substrate and packaging structure provided with supporting body and manufacture method thereof |
| 04/24/2013 | CN103066047A Lead frame strip and packaging method for semiconductor packing |
| 04/24/2013 | CN103066046A System and method for lead frame locking design features |
| 04/24/2013 | CN103066045A 智能功率模块 Intelligent Power Module |
| 04/24/2013 | CN103066044A Rewiring high-density quad flat no-lead (QFN) packaging component and manufacturing method thereof |
| 04/24/2013 | CN103066043A 半导体封装件 Semiconductor package |
| 04/24/2013 | CN103066042A Connection structure of power module electrode terminals |
| 04/24/2013 | CN103066041A Chip stacking structure and manufacturing method of the same |
| 04/24/2013 | CN103066040A Wafer level penetrating silicon transmission structure and manufacturing method for microwave frequency band |
| 04/24/2013 | CN103066039A Cooling system suitable for high heat flow density environment and cooling method of the same |
| 04/24/2013 | CN103066038A Insulated gate bipolar translator (IGBT) module radiator based on loop circuit heat pipes and manufacturing method of the same |
| 04/24/2013 | CN103066037A Thermoelectricity refrigeration heat pipe radiator for electric car insulated gate bipolar translator (IGBT) |
| 04/24/2013 | CN103066036A Active heat dissipation substrate |
| 04/24/2013 | CN103066035A Radiating block of liquid cooling type central processing unit (CPU) radiator and manufacturing method of the radiating block |
| 04/24/2013 | CN103066034A Improved heat sink assembly |
| 04/24/2013 | CN103066033A 半导体装置 Semiconductor device |
| 04/24/2013 | CN103066032A Packages and methods for forming same |
| 04/24/2013 | CN103066031A Coupling nodular technique applied before lead frame type product package |
| 04/24/2013 | CN103066030A High reliability encapsulation |
| 04/24/2013 | CN103066029A Packaging substrate strip structure and manufacturing method thereof |
| 04/24/2013 | CN103066028A Power module mounting structure with upper guide groove and lower guide groove |
| 04/24/2013 | CN103066027A Power module, method for manufacturing power module, and molding die |
| 04/24/2013 | CN103066026A High-breaking-strength semiconductor wafer improved structure and manufacture method thereof |
| 04/24/2013 | CN103066010A Metal oxide semiconductor (MOS) transistor and manufacturing method thereof |
| 04/24/2013 | CN103065983A Simultaneous silicone dispension on coupler |
| 04/24/2013 | CN103065982A Process capable of improving package reliability of printed circuit board (PCB) substrate semiconductor |
| 04/24/2013 | CN103065979A Non-contact type integrated circuit (IC) card manufacturing method based on chip on board (COB) encapsulation |
| 04/24/2013 | CN103065974A Method for manufacturing bonding block of chip and chip |
| 04/24/2013 | CN103065942A Method for controlling quirk corrosion formative semi-conducting film thickness and semiconductor structure |
| 04/24/2013 | CN103065929A Manufacture method of alignment mark protective layer |
| 04/24/2013 | CN102290398B Storage capacitor framework and making method thereof, and pixel structure |
| 04/24/2013 | CN102244044B Diode die-pressing discharging base and novel die-pressing discharging process thereof |
| 04/24/2013 | CN102203927B Method for device plastic packaging and packaging structure |
| 04/24/2013 | CN102148221B Electronic component package and manufacturing method therefor |
| 04/24/2013 | CN102148211B Semiconductor assembly, semiconductor device and manufacturing method |
| 04/24/2013 | CN102130087B Three-dimensional integrated circuit metallic conductor rail and preparation method thereof |
| 04/24/2013 | CN102098898B General serial bus device |
| 04/24/2013 | CN102076601B Mems device with independent rotation in two axes of rotation |
| 04/24/2013 | CN102046528B Graphite complex and manufacturing method thereof |
| 04/24/2013 | CN102005440B 集成电路结构及其形成方法 Integrated circuit structure and method of forming |
| 04/24/2013 | CN101989583B Radiating structure and radiating system employing same |
| 04/24/2013 | CN101964335B Packaging member and production method thereof |
| 04/24/2013 | CN101963340B Lighting device |
| 04/24/2013 | CN101963337B 照明装置 Lighting device |
| 04/24/2013 | CN101952959B Integrated circuit package and method of manufacturing same |
| 04/24/2013 | CN101901638B Busbar assembly, vehicle inverter module and method for cooling the inverter module |
| 04/24/2013 | CN101889344B Embedded package security tamper mesh |
| 04/24/2013 | CN101884103B Electrostatic discharge prevention circuit |
| 04/24/2013 | CN101866935B Image sensor and lens module |
| 04/24/2013 | CN101858505B Light-emitting diode (LED) lamp |
| 04/24/2013 | CN101815422B Radiator |
| 04/24/2013 | CN101802988B Chip package with pin stabilization layer |
| 04/24/2013 | CN101795530B Circuit board and method for constructing the same |
| 04/24/2013 | CN101795052B Novel valve module of converter valve for high-voltage direct-current power transmission based on thyristor |
| 04/24/2013 | CN101765352B Flat type heat conducting pipe and heat radiating module using same |
| 04/24/2013 | CN101754662B Radiating device combination |
| 04/24/2013 | CN101754657B Radiating device |
| 04/24/2013 | CN101752331B Cooling jacket, cooling unit, and electronic apparatus |
| 04/24/2013 | CN101742891B Radiation device |
| 04/24/2013 | CN101730444B Heat radiation device |
| 04/24/2013 | CN101719477B Alignment mark and defect detection method |
| 04/24/2013 | CN101686628B Radiating device |
| 04/24/2013 | CN101640314B Dipole antenna and radio frequency identification devices (RFID) tag and radio frequency identification devices (RFID) system with same |
| 04/24/2013 | CN101614339B Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus |
| 04/24/2013 | CN101556033B Lighting device and light engine thereof |
| 04/24/2013 | CN101540299B Device mounting board, semiconductor module and manufacturing method thereof , and portable equipment |
| 04/24/2013 | CN101540290B Resin encapsulation and manufacturing method thereof |
| 04/24/2013 | CN101496294B Dual inductor circuit for multi-band wireless communication device |
| 04/24/2013 | CN101443903B Double-sided integrated circuit chips |
| 04/24/2013 | CN101425532B Organic electro-luminescent display device |
| 04/24/2013 | CN101369566B Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same |
| 04/23/2013 | US8428539 Spread spectrum isolator |
| 04/23/2013 | US8427844 Widebody coil isolators |
| 04/23/2013 | US8426987 Misalignment detection devices |
| 04/23/2013 | US8426986 Phase separated curable compositions |
| 04/23/2013 | US8426985 Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component |
| 04/23/2013 | US8426984 Substrate structure with compliant bump and manufacturing method thereof |
| 04/23/2013 | US8426983 Semiconductor device |
| 04/23/2013 | US8426982 Structure and manufacturing method of chip scale package |
| 04/23/2013 | US8426981 Composite layered chip package |
| 04/23/2013 | US8426980 Chip-to-chip multi-signaling communication system with common conductive layer |
| 04/23/2013 | US8426979 Composite layered chip package |
| 04/23/2013 | US8426978 Semiconductor device including a first wiring having a bending portion and a via including the bending portion |
| 04/23/2013 | US8426977 Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module |
| 04/23/2013 | US8426975 Semiconductor device having wiring layer with a wide wiring and fine wirings |
| 04/23/2013 | US8426974 Interconnect for an optoelectronic device |
| 04/23/2013 | US8426973 Integrated circuit of decreased size |
| 04/23/2013 | US8426972 Semiconductor device and method for manufacturing the same |
| 04/23/2013 | US8426971 Top tri-metal system for silicon power semiconductor devices |
| 04/23/2013 | US8426970 Substrate processing including a masking layer |
| 04/23/2013 | US8426969 Semiconductor device having active region and dummy wirings |
| 04/23/2013 | US8426968 High speed, high density, low power die interconnect system |
| 04/23/2013 | US8426967 Scaled-down phase change memory cell in recessed heater |
| 04/23/2013 | US8426966 Bumped chip package |
| 04/23/2013 | US8426965 Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool |
| 04/23/2013 | US8426964 Micro bump and method for forming the same |
| 04/23/2013 | US8426963 Power semiconductor package structure and manufacturing method thereof |
| 04/23/2013 | US8426962 Semiconductor device |
| 04/23/2013 | US8426961 Embedded 3D interposer structure |