| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/25/2013 | US20130099376 Microelectronic packages with dual or multiple-etched flip-chip connectors |
| 04/25/2013 | US20130099375 Semiconductor package substrate and semiconductor package including the same |
| 04/25/2013 | US20130099374 Package of electronic device including connecting bump, system including the same and method for fabricating the same |
| 04/25/2013 | US20130099373 Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device |
| 04/25/2013 | US20130099372 Methods of Forming Bump Structures That Include a Protection Layer |
| 04/25/2013 | US20130099371 Semiconductor package having solder jointed region with controlled ag content |
| 04/25/2013 | US20130099370 Semiconductor package |
| 04/25/2013 | US20130099369 Hermetic Surface Mount Packages for Diodes and Transistors |
| 04/25/2013 | US20130099368 Chip carriers, semiconductor devices including the same, semiconductor packages including the same, and methods of fabricating the same |
| 04/25/2013 | US20130099367 Integrated circuit packaging system with planarity control and method of manufacture thereof |
| 04/25/2013 | US20130099366 Systems and methods for lead frame locking design features |
| 04/25/2013 | US20130099365 Integrated circuit packaging system with leadframe lead array routing and method of manufacture thereof |
| 04/25/2013 | US20130099364 Top-side Cooled Semiconductor Package with Stacked Interconnection Plates and Method |
| 04/25/2013 | US20130099360 Semiconductor package and method for manufacturing the same |
| 04/25/2013 | US20130099359 Semiconductor package and stacked semiconductor package |
| 04/25/2013 | US20130099358 Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same |
| 04/25/2013 | US20130099353 Esd protection device |
| 04/25/2013 | US20130099352 Structure and method for a high-k transformer with capacitive coupling |
| 04/25/2013 | US20130099349 Semiconductor device and method of manufacturing the same |
| 04/25/2013 | US20130099289 Compact Memory Arrays |
| 04/25/2013 | US20130099250 Structure of semiconductor chips with enhanced die strength and a fabrication method thereof |
| 04/25/2013 | US20130099235 Semiconductor wafer and method for manufacturing stack package using the same |
| 04/25/2013 | DE112011102298T5 Verbesserte Kühlung von Gehäusen für dreidimensional gestapelte Chips Improved cooling of enclosures for three-dimensionally stacked chips |
| 04/25/2013 | DE112008000452B4 Halbleitermodul und Wechselrichtervorrichtung Semiconductor module and inverter device |
| 04/25/2013 | DE102012219330A1 Halbleitervorrichtung und Verfahren zum Bilden von Höckerstrukturen mit einer Schutzschicht A semiconductor device and method for forming humps structures with a protective layer |
| 04/25/2013 | DE102012202377A1 Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung Adhesive useful for encapsulating an electronic device |
| 04/25/2013 | DE102012110133A1 Ein Halbleiterbauelement mit einem Durchkontakt und ein Herstellungsverfahren dafür A semiconductor device having a via and a fabrication method thereof |
| 04/25/2013 | DE102012109984A1 Halbleiterbauelement und Verfahren Semiconductor device and method |
| 04/25/2013 | DE102011117223B3 Luftleithaube zur Strömungsführung von Luft in einem elektronischen Gerät und elektronisches Gerät mit einer solchen Luftleithaube Airguide for guiding the flow of air in an electronic device and electronic device with such airguide |
| 04/25/2013 | DE102011117132A1 Cooling device e.g. vapor chamber cooler has support rod in which mounting hole is formed at specific position and passing through main portion |
| 04/25/2013 | DE102011116534A1 Strahlungsemittierendes Bauelement Radiation-emitting component |
| 04/25/2013 | DE102011085038A1 Verfahren zur Kapselung einer elektronischen Anordnung A method for encapsulating an electronic arrangement |
| 04/25/2013 | DE102011085034A1 Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung Adhesive useful for encapsulating an electronic device |
| 04/25/2013 | DE102011084885A1 Auflage für eine Leuchtvorrichtung Pad for a light-emitting device |
| 04/25/2013 | DE102011054739A1 Thermoelement und Herstellungsverfahren Thermocouple and manufacturing processes |
| 04/24/2013 | EP2584642A1 Protective circuit module and battery pack having the same |
| 04/24/2013 | EP2584605A2 Packaging structure and method and electronic device |
| 04/24/2013 | EP2584604A1 Heat dissipation structure for electronic device |
| 04/24/2013 | EP2584603A1 Heat transfer sheet, manufacturing method for heat transfer sheet, and heat radiation device |
| 04/24/2013 | EP2584602A1 Package structure, method for manufacturing same, and method for repairing package structure |
| 04/24/2013 | EP2584598A1 Method of producing a semiconductor device comprising a through-substrate via and a capping layer and corresponding semiconductor device |
| 04/24/2013 | EP2584005A1 Typical metal containing polysiloxane composition, process for production of same, and uses thereof |
| 04/24/2013 | EP2583993A1 Thermally conductive sheet and process for producing same |
| 04/24/2013 | EP2583303A1 Semiconductor device with through-silicon vias |
| 04/24/2013 | DE202013003171U1 Wasserkühlvorrichtung Water Cooler |
| 04/24/2013 | CN202907382U A power electronic system containing a subsystem and a cooling device |
| 04/24/2013 | CN202907046U COB-encapsulation camera module set |
| 04/24/2013 | CN202906474U Thyristor valve module used in horizontal water-cooling static reactive power compensator |
| 04/24/2013 | CN202905714U Photoelectric coupler integrated with two bidirectional controlled silicon chip |
| 04/24/2013 | CN202905712U Welding plate with metal baffle plate |
| 04/24/2013 | CN202905706U Three-dimensional packaging structure |
| 04/24/2013 | CN202905705U High-density-arrangement low-power integrated circuit lead frame member |
| 04/24/2013 | CN202905704U Combined surface-mount-type diode lead frame member |
| 04/24/2013 | CN202905703U Combined small-power surface-mount diode lead frame member |
| 04/24/2013 | CN202905702U 半导体元件封装结构 The semiconductor device package structure |
| 04/24/2013 | CN202905701U Welding plate with aluminum plate |
| 04/24/2013 | CN202905700U Pin type power device, heat radiation structure and pin clamp thereof |
| 04/24/2013 | CN202905699U CATV die module |
| 04/24/2013 | CN202905698U Square bump rectifier bridge connecting piece |
| 04/24/2013 | CN202905697U 系统级封装结构 System level package structure |
| 04/24/2013 | CN202905696U Wafer level chip packaging structure |
| 04/24/2013 | CN202905695U Novel chip back side through silicon via structure |
| 04/24/2013 | CN202905694U A first-subsystem-and-second-subsystem-containing power electronic system of a connecting device |
| 04/24/2013 | CN202905693U A liquid-cooled power electronic device |
| 04/24/2013 | CN202905692U Heat-pipe radiator base and rolling machine tool thereof |
| 04/24/2013 | CN202905691U Welding plate with graphite radiating plate |
| 04/24/2013 | CN202905690U Ultrahigh frequency device packaged by dielectric composite material |
| 04/24/2013 | CN202905689U Copper-free baseplate DCB ceramic welding module |
| 04/24/2013 | CN202905688U Welding plate with heat radiating fins |
| 04/24/2013 | CN202905687U Flat type IGBT module package structure |
| 04/24/2013 | CN202905686U Multichip wafer level packaging structure |
| 04/24/2013 | CN202905117U Constant current driving circuit of large display screen for teaching |
| 04/24/2013 | CN103069567A Electrical circuit having circuit components to be cooled, heat sink, and method for sealingly embedding an electrical circuit |
| 04/24/2013 | CN103069566A Thermogenerator comprising phase-change materials |
| 04/24/2013 | CN103069565A Method for producing an electrical circuit and electrical circuit |
| 04/24/2013 | CN103069547A Etching method and etching apparatus |
| 04/24/2013 | CN103069177A Pick and bond method for attachment of adhesive element to substrate |
| 04/24/2013 | CN103069176A Method and apparatus for placing adhesive element on a matrix |
| 04/24/2013 | CN103069042A Al alloy film, wiring structure having Al alloy film, and sputtering target used in producing Al alloy film |
| 04/24/2013 | CN103068917A Curable epoxy resin composition and photosemiconductor device using same |
| 04/24/2013 | CN103066098A Graphene Hoare integrated circuit and preparation method thereof |
| 04/24/2013 | CN103066068A Integrated circuit package structure |
| 04/24/2013 | CN103066067A Semiconductor apparatus |
| 04/24/2013 | CN103066066A Semiconductor apparatus |
| 04/24/2013 | CN103066065A Vertically placing mechanical press fitting structure of power device clusters |
| 04/24/2013 | CN103066064A Semiconductor encapsulation piece and manufacturing method thereof |
| 04/24/2013 | CN103066063A Semiconductor apparatus |
| 04/24/2013 | CN103066062A 半导体器件 Semiconductor devices |
| 04/24/2013 | CN103066061A Camera module and system comprising same |
| 04/24/2013 | CN103066060A Detection structure and detection method of semiconductor device mismatch characteristic |
| 04/24/2013 | CN103066059A Semiconductor structure having through substrate via (TSV) and method for forming |
| 04/24/2013 | CN103066058A Semiconductor device and method |
| 04/24/2013 | CN103066057A Vertical parasitic type precision navigation processor (PNP) device and manufacturing method thereof in bipolar complementary metal-oxide-semiconductor transistor (BiCMOS) technology |
| 04/24/2013 | CN103066056A Vertical parasitic type precision navigation processor (PNP) device and manufacturing method thereof in bipolar complementary metal-oxide-semiconductor transistor (BiCMOS) technology |
| 04/24/2013 | CN103066055A Semiconductor device and method for forming the same |
| 04/24/2013 | CN103066054A Metal layout and method of integrated power transistor |
| 04/24/2013 | CN103066053A Connector structures of integrated circuits |
| 04/24/2013 | CN103066052A Semiconductor package and stacked semiconductor package |
| 04/24/2013 | CN103066051A Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof |
| 04/24/2013 | CN103066050A Semiconductor package having solder jointed region with controlled ag content |