| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/01/2013 | CN101674716B Heat-pipe type radiator and manufacturing method thereof |
| 05/01/2013 | CN101600328B Temperature control unit for electronic component, detection apparatus and handler apparatus |
| 05/01/2013 | CN101587885B Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module |
| 05/01/2013 | CN101320748B Organic light emitting display device and method of manufacturing the same |
| 05/01/2013 | CN101266964B Semiconductor device with high-frequency interconnection |
| 04/30/2013 | US8432382 Electronic module, methods of manufacturing and driving the same, and electronic instrument |
| 04/30/2013 | US8432046 Semiconductor device |
| 04/30/2013 | US8432045 Conductive pads defined by embedded traces |
| 04/30/2013 | US8432043 Stacked wire bonded semiconductor package with low profile bond line |
| 04/30/2013 | US8432042 System and method for relieving stress and improving heat management in a 3D chip stack having an array of inter-stack connections |
| 04/30/2013 | US8432041 Semiconductor devices and methods of manufacture thereof |
| 04/30/2013 | US8432039 Integrated circuit device and electronic instrument |
| 04/30/2013 | US8432038 Through-silicon via structure and a process for forming the same |
| 04/30/2013 | US8432037 Semiconductor device with a line and method of fabrication thereof |
| 04/30/2013 | US8432036 Lead frames with improved adhesion to plastic encapsulant |
| 04/30/2013 | US8432035 Metal cap layer with enhanced etch resistivity for copper-based metal regions in semiconductor devices |
| 04/30/2013 | US8432034 Use of a local constraint to enhance attachment of an IC device to a mounting platform |
| 04/30/2013 | US8432033 Electronic device and manufacturing method therefor |
| 04/30/2013 | US8432032 Chip package and fabrication method thereof |
| 04/30/2013 | US8432031 Semiconductor die including a current routing line having non-metallic slots |
| 04/30/2013 | US8432030 Power electronic package having two substrates with multiple semiconductor chips and electronic components |
| 04/30/2013 | US8432029 Signal light using phosphor coated LEDs |
| 04/30/2013 | US8432028 Integrated circuit packaging system with package-on-package and method of manufacture thereof |
| 04/30/2013 | US8432027 Integrated circuit die stacks with rotationally symmetric vias |
| 04/30/2013 | US8432026 Stackable multi-chip package system |
| 04/30/2013 | US8432025 Semiconductor device and plurality of dams |
| 04/30/2013 | US8432024 Integrated circuit including bond wire directly bonded to pad |
| 04/30/2013 | US8432023 Increased I/O leadframe and semiconductor device including same |
| 04/30/2013 | US8432022 Shielded embedded electronic component substrate fabrication method and structure |
| 04/30/2013 | US8432015 Semiconductor device and wire bonding method |
| 04/30/2013 | US8431999 Low capacitance transient voltage suppressor |
| 04/30/2013 | US8431998 Insulated gate semiconductor device |
| 04/30/2013 | US8431969 Interconnection structure of three-dimensional semiconductor device |
| 04/30/2013 | US8431968 Electromigration resistant standard cell device |
| 04/30/2013 | US8431484 Stable electroless fine pitch interconnect plating |
| 04/30/2013 | US8431480 Semiconductor device and manufacturing method thereof |
| 04/30/2013 | US8431223 Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications |
| 04/30/2013 | US8430156 Liquid loop with multiple pump assembly |
| 04/30/2013 | US8430152 Heat dissipation device |
| 04/30/2013 | DE202013003538U1 Kühlstruktur Cooling structure |
| 04/30/2013 | DE202013001317U1 Kühlvorrichtung Cooler |
| 04/30/2013 | CA2526484C Semiconductor package having filler metal of gold/silver/copper alloy |
| 04/25/2013 | WO2013059715A2 Iron based alloys for bioabsorbable stent |
| 04/25/2013 | WO2013059590A1 Edge seal for lower electrode assembly |
| 04/25/2013 | WO2013059446A1 Power converters with integrated capacitors |
| 04/25/2013 | WO2013059181A1 Package-on-package assembly with wire bond vias |
| 04/25/2013 | WO2013058754A1 Bulk amorphous alloy heat sink |
| 04/25/2013 | WO2013058746A1 Antifuse element utilizing non-planar topology |
| 04/25/2013 | WO2013058317A1 Radiographic image capturing apparatus |
| 04/25/2013 | WO2013058287A1 Method for manufacturing coupled printed circuit board and coupled printed circuit board |
| 04/25/2013 | WO2013058234A1 Semiconductor device fabrication method and semiconductor device |
| 04/25/2013 | WO2013058232A1 Chip diode and diode package |
| 04/25/2013 | WO2013058169A1 Method for forming through holes in insulating substrate and method for manufacturing insulating substrate for interposer |
| 04/25/2013 | WO2013058086A1 Method for manufacturing lidded container and joining method |
| 04/25/2013 | WO2013058039A1 Resin substrate having built-in component |
| 04/25/2013 | WO2013058038A1 Semiconductor device and semiconductor device manufacturing method |
| 04/25/2013 | WO2013057949A2 Manufacturing method for semiconductor package, semiconductor package, and semiconductor device |
| 04/25/2013 | WO2013057889A1 Thermal-conductive sheet, led mounting substrate, and led module |
| 04/25/2013 | WO2013057867A1 Semiconductor device |
| 04/25/2013 | WO2013057861A1 Semiconductor device |
| 04/25/2013 | WO2013057642A1 Through-wafer via device and method of manufacturing the same |
| 04/25/2013 | WO2013057172A1 Power semiconducter module and power semiconductor module assembly with multiple power semiconducter modules |
| 04/25/2013 | WO2013056936A1 Method for producing thin semiconductor components |
| 04/25/2013 | WO2013056927A1 Attachment part for a support of a semiconductor light device |
| 04/25/2013 | WO2013056629A1 Encapsulation structure, method and electronic device |
| 04/25/2013 | WO2013056519A1 Wafer-level through-silicon via transmission structure applicable to microwave band and manufacturing method thereof |
| 04/25/2013 | WO2013056456A1 Panel structure of chip on film |
| 04/25/2013 | WO2013033601A3 Enhanced clad metal base plate |
| 04/25/2013 | WO2013032726A3 Glass as a substrate material and a final package for mems and ic devices |
| 04/25/2013 | WO2013032725A3 Glass as a substrate material and a final package for mems and ic devices |
| 04/25/2013 | WO2013032664A3 Laminated heat sinks |
| 04/25/2013 | WO2013032280A3 Substrate for chip packages and method of manufacturing substrate for chip packages |
| 04/25/2013 | WO2013032277A3 Method of manufacturing substrate for chip packages and method of manufacturing chip package |
| 04/25/2013 | WO2013023157A3 Thin film structure for high density inductors and redistribution in wafer level packaging |
| 04/25/2013 | WO2012170802A3 Cooling system with anomaly detection |
| 04/25/2013 | WO2012170328A3 Microelectronic substrate for alternate package functionality |
| 04/25/2013 | WO2012167027A3 Protective layer for protecting tsv tips during thermo-compressive bonding |
| 04/25/2013 | WO2012135406A3 High density microelectronics packaging |
| 04/25/2013 | US20130100616 Multiple die stacking for two or more die |
| 04/25/2013 | US20130100559 Semiconductor Component and An Operating Method for A Protective Circuit Against Light Attacks |
| 04/25/2013 | US20130100185 ALCu HARD MASK PROCESS |
| 04/25/2013 | US20130099396 Wafer backside coating process with pulsed uv light source |
| 04/25/2013 | US20130099395 Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device |
| 04/25/2013 | US20130099394 Film for back surface of flip-chip semiconductor |
| 04/25/2013 | US20130099393 Stacked Semiconductor Package |
| 04/25/2013 | US20130099392 Support mounted electrically interconnected die assembly |
| 04/25/2013 | US20130099391 Chamfered corner crackstop for an integrated circuit chip |
| 04/25/2013 | US20130099390 Electronic device |
| 04/25/2013 | US20130099389 Multilayered circuit type antenna package |
| 04/25/2013 | US20130099388 Stacked semiconductor package |
| 04/25/2013 | US20130099387 Microelectronic package with stacked microelectronic units and method for manufacture thereof |
| 04/25/2013 | US20130099386 Semiconductor memory device having cell patterns on interconnection and fabrication method thereof |
| 04/25/2013 | US20130099385 Packages and Methods for Forming the Same |
| 04/25/2013 | US20130099384 Stacked IC Devices Comprising a Workpiece Solder Connected to the TSV |
| 04/25/2013 | US20130099383 Semiconductor Device and Method |
| 04/25/2013 | US20130099382 Method for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough |
| 04/25/2013 | US20130099381 Semiconductor device and connection checking method for semiconductor device |
| 04/25/2013 | US20130099380 Wafer level chip scale package device and manufacturing method therof |
| 04/25/2013 | US20130099379 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment |
| 04/25/2013 | US20130099378 Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die |