| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/02/2013 | DE112011102296T5 Elektronische Oberflächenbefestigungskomponente Electronic surface mount component |
| 05/02/2013 | DE112011101959T5 Wärmesenke und Verfahren zu deren Herstellung Heat sink and method for the preparation thereof |
| 05/02/2013 | DE112010004254T5 Mikroelektronische Baugruppe und Verfahren zu ihrer Herstellung A microelectronic assembly and process for their preparation |
| 05/02/2013 | DE102012219791A1 Niederinduktives leistungsmodul Niederinduktives power module |
| 05/02/2013 | DE102012219686A1 Leistungsmodul mit geringer streuinduktivität Power module with low leakage inductance |
| 05/02/2013 | DE102012218765A1 Halbleitervorrichtung mit innerhalb desselben Halbleitersubstrats ausgebildetem Leistungselement und Schaltungselement A semiconductor device comprising trained within the same semiconductor substrate power element and circuit element |
| 05/02/2013 | DE102012110188A1 Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung Electronic device and method for manufacturing an electronic device |
| 05/02/2013 | DE102012110000A1 3D-Chipaufbau mit abgeschirmten Strukturen 3D chip structure with shielded structures |
| 05/02/2013 | DE102012101606A1 ESD-Schutzbauelement und Bauelement mit einem ESD-Schutzbauelement und einer LED ESD protection device and the ESD protection device having a device and a LED |
| 05/02/2013 | DE102012101560A1 Leuchtdiodenvorrichtung Light emitting diode device |
| 05/02/2013 | DE102011117490A1 Vapor chamber radiator for cooling components in electronic device, has main body comprising two plates, and cavity exhibiting capillary structure, supporting structure and work fluid, where opening passes through plates and cavity |
| 05/01/2013 | EP2587536A1 Semiconductor substrate having copper/diamond composite material and method of making same |
| 05/01/2013 | EP2587535A1 Ceramic radiation heat dissipation structure |
| 05/01/2013 | EP2587534A2 Cooling device for a heat-emitting element |
| 05/01/2013 | EP2587533A1 Wiring substrate, light emitting device, and method for manufacturing wiring substrate |
| 05/01/2013 | EP2587532A2 Joined structural body of members, joining method of members, and package for containing an electronic component |
| 05/01/2013 | EP2587484A1 Integrated circuit with configurable output cell |
| 05/01/2013 | EP2587472A1 Semiconductor device and process for production thereof |
| 05/01/2013 | EP2586832A1 Encapsulant for optical semiconductor device and optical semiconductor device using same |
| 05/01/2013 | EP2586831A1 Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device |
| 05/01/2013 | EP2586742A1 Electronic component package and method of manufacturing the same |
| 05/01/2013 | EP2586057A1 Thermogenerator comprising phase-change materials |
| 05/01/2013 | CN202918642U Heat radiation device |
| 05/01/2013 | CN202918626U Fin type radiator for electronic component |
| 05/01/2013 | CN202918215U Novel integrated power packaging module |
| 05/01/2013 | CN202917498U Chip-diode structure |
| 05/01/2013 | CN202917483U 半导体器件 Semiconductor devices |
| 05/01/2013 | CN202917482U Plastic encapsulated reinforcement structure of a lead frame |
| 05/01/2013 | CN202917481U Reinforcement structure of a lead frame |
| 05/01/2013 | CN202917480U Multi-chip integrated circuit leading wire framework for increasing plastic packaging binding force |
| 05/01/2013 | CN202917479U High power small package power transistor |
| 05/01/2013 | CN202917478U A packaging structure of single-row vertical pins |
| 05/01/2013 | CN202917477U 半导体器件 Semiconductor devices |
| 05/01/2013 | CN202917476U 芯片封装结构 Chip package structure |
| 05/01/2013 | CN202917475U 芯片封装结构 Chip package structure |
| 05/01/2013 | CN202917474U Semiconductor package structure |
| 05/01/2013 | CN202917473U 半导体器件 Semiconductor devices |
| 05/01/2013 | CN202917472U High performance heavy current VDMOS power device chip insulation packaging structure |
| 05/01/2013 | CN202917471U A packaging structure of a class D audio power amplifier circuit |
| 05/01/2013 | CN202917470U Water-cooling heat dissipater |
| 05/01/2013 | CN202917469U Cooling fin for chip |
| 05/01/2013 | CN202917468U 半导体封装结构 The semiconductor package structure |
| 05/01/2013 | CN202917467U Packaging cutting structure and packaging structure |
| 05/01/2013 | CN202917466U A device used for increasing creepage distance of a power semiconductor module |
| 05/01/2013 | CN202917465U 半导体封装结构 The semiconductor package structure |
| 05/01/2013 | CN202917464U Connecting structure between heating element and heat radiator |
| 05/01/2013 | CN202917178U Encrypt security USB (universal series bus) flash disc and UDP (user datagram protocol) module |
| 05/01/2013 | CN1910971B Packaging and manufacturing of an integrated circuit |
| 05/01/2013 | CN1652339B Nonvolatile semiconductor memory and manufacturing method for the same |
| 05/01/2013 | CN103081358A Electronic part, method for producing same, and electronic device provided with electronic part |
| 05/01/2013 | CN103081107A Porous and non-porous nanostructures |
| 05/01/2013 | CN103081105A Image pickup device, image pickup module, and camera |
| 05/01/2013 | CN103081104A Power semiconductor module and method for manufacturing same |
| 05/01/2013 | CN103081103A Manufacturing fixture for a ramp-stack chip package |
| 05/01/2013 | CN103081102A Optical communication in a ramp-stack chip package |
| 05/01/2013 | CN103081101A Method for manufacturing an antenna component by etching |
| 05/01/2013 | CN103081100A Cooling device, printed circuit board unit, and electronic device |
| 05/01/2013 | CN103081099A 半导体装置 Semiconductor device |
| 05/01/2013 | CN103081098A 半导体模块 Semiconductor Modules |
| 05/01/2013 | CN103081097A Semiconductor module |
| 05/01/2013 | CN103081096A Semiconductor device and method of producing semiconductor device |
| 05/01/2013 | CN103081095A 电子装置 Electronic devices |
| 05/01/2013 | CN103081094A Substrate with though electrode and method for producing same |
| 05/01/2013 | CN103081089A Method for manufacturing semiconductor device |
| 05/01/2013 | CN103081082A Non-contact determination of joint integrity between a TSV die and a package substrate |
| 05/01/2013 | CN103081077A Method of manufacturing semiconductor device and semiconductor device |
| 05/01/2013 | CN103081076A Semiconductor device production method and rinse |
| 05/01/2013 | CN103080568A Pick and bond method and apparatus for transferring adhesive element to substrate |
| 05/01/2013 | CN103080193A Phenyl group-containing organic/inorganic hybrid prepolymer, heat resisitant organic/inorganic hybrid material, and element encapsulation structure |
| 05/01/2013 | CN103080144A Method for producing an esterified substance |
| 05/01/2013 | CN103079819A Thermally conductive sheet |
| 05/01/2013 | CN103077939A Semiconductor package including semiconductor chip with through opening |
| 05/01/2013 | CN103077938A Method and system for transient voltage suppressors |
| 05/01/2013 | CN103077937A Method for processing single-circuit ESD (Electro-Static Discharge) protection device |
| 05/01/2013 | CN103077936A Wiring substrate and manufacturing method of the same |
| 05/01/2013 | CN103077935A Pre-plated lead frame for copper wire bonding |
| 05/01/2013 | CN103077934A Joined structural body of members, joining method of members, and package |
| 05/01/2013 | CN103077933A Three-dimensional chip-to-wafer integration |
| 05/01/2013 | CN103077932A High-depth-to-width-ratio via interconnecting structure and production method |
| 05/01/2013 | CN103077931A Package structure and preparing method thereof |
| 05/01/2013 | CN103077930A Integrated photosensitive sensor |
| 05/01/2013 | CN103077929A Integrated photosensitive sensor chip |
| 05/01/2013 | CN103077928A Single-side local gold-plating cover plate structure |
| 05/01/2013 | CN103077921A Interconnection line structure and forming method thereof |
| 05/01/2013 | CN103077901A Packaging method of semiconductor packaging member and semiconductor packaging member formed by applying packaging method |
| 05/01/2013 | CN103077899A Complex method for chip support plate and chip support plate prepared thereby |
| 05/01/2013 | CN103077897A Method of forming bump structures that include a protection layer |
| 05/01/2013 | CN102347311B Semiconductor device and a manufacturing method thereof |
| 05/01/2013 | CN102263072B Thermal radiation radiating film structure and manufacturing method thereof |
| 05/01/2013 | CN102246297B Silanol condensation catalyst, heat-curable silicone resin composition for sealing photosemiconductors and sealed photosemiconductor using same |
| 05/01/2013 | CN102194798B Short-circuit deembedding test structure for micro-capacitance MOS (Metal Oxide Semiconductor) varactor and variode |
| 05/01/2013 | CN102157671B Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
| 05/01/2013 | CN102157494B Wiring assembly |
| 05/01/2013 | CN102148186B Method for manufacturing semiconductor device |
| 05/01/2013 | CN102148185B Method for forming interconnection structure |
| 05/01/2013 | CN102117793B Efuse macro |
| 05/01/2013 | CN102106198B Semiconductor device and method for manufacturing same |
| 05/01/2013 | CN102044515B Package carrier, package structure, and process for fabricating same |
| 05/01/2013 | CN101980357B Semiconductor device and mold for resin-molding semiconductor device |
| 05/01/2013 | CN101885851B Isocyanuric ring-containing terminal hydrogenpolysiloxane |