| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/08/2013 | CN103094230A Contact and formation method |
| 05/08/2013 | CN103094229A Buried layer extraction structure and manufacturing method thereof |
| 05/08/2013 | CN103094228A Power Semiconductor Module Cooling Apparatus |
| 05/08/2013 | CN103094227A Three-dimensional chip and combination structure and manufacture method of three-dimensional chip |
| 05/08/2013 | CN103094226A System And Method For Operating An Electric Power Converter |
| 05/08/2013 | CN103094225A Heat sink convenient to assemble |
| 05/08/2013 | CN103094224A Power Module Package |
| 05/08/2013 | CN103094223A Packaging Substrate And Fabrication Method Thereof |
| 05/08/2013 | CN103094222A Semiconductor Package And Method For Manufacturing The Same And Semiconductor Package Module Having The Same |
| 05/08/2013 | CN103094221A Integrated Circuit With Double Seal Ring Having Gaps Therein |
| 05/08/2013 | CN103094220A Storage device, semiconductor device and manufacturing method thereof |
| 05/08/2013 | CN103094218A System in package process flow |
| 05/08/2013 | CN103094202A Semiconductor part and tungsten filling method thereof |
| 05/08/2013 | CN103094196A Interconnection structure and manufacturing method of the same |
| 05/08/2013 | CN103094194A Forming method of metal inter-lamination dielectric layer and metal inter-lamination dielectric layer |
| 05/08/2013 | CN103094188A Method for manufacturing fuse wire window on core and fuse wire window |
| 05/08/2013 | CN103094186A Semiconductor structure and forming method thereof |
| 05/08/2013 | CN103094138A Three-dimensional (3d) integrated circuit with enhanced copper-to-copper bonding and forming method thereof |
| 05/08/2013 | CN103094137A Methods of and semiconductor device with ball strength improvement |
| 05/08/2013 | CN103094134A Method and chip of increasing thickness of metal layer of chip bonding block area |
| 05/08/2013 | CN103094131A Stacked packages using laser direct structuring |
| 05/08/2013 | CN103091971A Mask plate and manufacturing method thereof, and method for monitoring fog pollutions of mask plate |
| 05/08/2013 | CN103091922A Array substrate, display panel of array substrate and device of array substrate |
| 05/08/2013 | CN103087650A Composition for anisotropic conductive adhesive film, anisotropic conductive adhesive film and semiconductor device |
| 05/08/2013 | CN103087530A Curable organopolysiloxane composition and semiconductor device |
| 05/08/2013 | CN103087472A Liquid resin composition for electronic component and electronic component device |
| 05/08/2013 | CN103086719A Boron nitride agglomerated powder |
| 05/08/2013 | CN102427071B Novel heat dissipation component of intelligent refrigerator control chip |
| 05/08/2013 | CN102403232B Process for total dose radiation hardening of factory region |
| 05/08/2013 | CN102378790B Epoxy resin composite |
| 05/08/2013 | CN102347297B Packaging structure for a plurality of small-size chips |
| 05/08/2013 | CN102344567B Modified bismaleimide resin, preparation method thereof and composition containing resin |
| 05/08/2013 | CN102280391B Wafer level package structure and formation method thereof |
| 05/08/2013 | CN102270635B 化合物半导体装置及其制造方法 The compound semiconductor device and manufacturing method |
| 05/08/2013 | CN102256451B Printed circuit board embedded with chip device and manufacturing method thereof |
| 05/08/2013 | CN102201395B Multi-layer semiconductor module packaging structure with anti-surge function and manufacturing method thereof |
| 05/08/2013 | CN102184906B Packaging substrate with well structure filled with insulator and manufacturing method thereof |
| 05/08/2013 | CN102184843B Chip cutting protection ring of diode based on groove MOSFET (metal-oxide-semiconductor field effect transistor) and manufacturing method thereof |
| 05/08/2013 | CN102163544B Package board carrying lath and mixing-preventing method thereof |
| 05/08/2013 | CN102156901B Paper including semiconductor device and manufacturing method of same |
| 05/08/2013 | CN102130073B Advanced quad flat non-leaded package structure and manufacturing method thereof |
| 05/08/2013 | CN102117771B LED epitaxial wafer and LED chip as well as manufacturing method thereof |
| 05/08/2013 | CN102089894B Heat exchanger for a thermoelectric thin layer element |
| 05/08/2013 | CN102077343B Leadframe and method for manufacturing the same |
| 05/08/2013 | CN102017140B Semiconductor device |
| 05/08/2013 | CN102017139B 3-D integrated circuit lateral heat dissipation |
| 05/08/2013 | CN102017132B Hermetic sealing cap |
| 05/08/2013 | CN102010679B Adhesive for connection of circuit member and semiconductor device using the same |
| 05/08/2013 | CN102007825B Wiring board and method for manufacturing the same |
| 05/08/2013 | CN101996926B Method and structure for self aligned contact of integrated circuit |
| 05/08/2013 | CN101996897B Method for fabricating circuit substrate assembly and power electronics module |
| 05/08/2013 | CN101944526B Die-to-die electrical isolation in a semiconductor package |
| 05/08/2013 | CN101930959B Copper conductive paste, method of manufacturing substrate with copper conductor filled in through-hole, circuit substrate, electronic component, semiconductor package |
| 05/08/2013 | CN101894825B 半导体封装 The semiconductor package |
| 05/08/2013 | CN101889485B Cooling device utilizing internal synthetic jets |
| 05/08/2013 | CN101785375B Water jacket |
| 05/08/2013 | CN101651136B Semiconductor light emitting device |
| 05/08/2013 | CN101571237B Light emitting diode module and lighting string comprising same |
| 05/08/2013 | CN101529588B Power module substrate, method for manufacturing power module substrate, and power module |
| 05/08/2013 | CN101514281B Conductive silver ink for encapsulating LED and preparation method thereof |
| 05/08/2013 | CN101505167B Audio encoding and decoding module for mobile terminal |
| 05/08/2013 | CN101452904B Lead frame, method of making the same and light receiving/emitting device |
| 05/08/2013 | CN101447641B Cap member and semiconductor device employing same |
| 05/08/2013 | CN101192394B Semiconductor device and electronic device using the same |
| 05/07/2013 | US8437818 System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits |
| 05/07/2013 | US8437137 Fixing mechanism for fixing a thermal module on a base and related electronic device |
| 05/07/2013 | US8436482 Semiconductor device, and method of fabricating semiconductor device |
| 05/07/2013 | US8436481 Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet |
| 05/07/2013 | US8436480 Semiconductor package |
| 05/07/2013 | US8436479 Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same |
| 05/07/2013 | US8436478 Methods of fluxless micro-piercing of solder balls, and resulting devices |
| 05/07/2013 | US8436477 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate |
| 05/07/2013 | US8436475 IC device having low resistance TSV comprising ground connection |
| 05/07/2013 | US8436474 Semiconductor integrated circuit |
| 05/07/2013 | US8436473 Integrated circuits including air gaps around interconnect structures, and fabrication methods thereof |
| 05/07/2013 | US8436472 Corner stress release structure design for increasing circuit routing areas |
| 05/07/2013 | US8436471 Semiconductor package with its surface edge covered by resin |
| 05/07/2013 | US8436469 Semiconductor device |
| 05/07/2013 | US8436468 Semiconductor device having a through electrode |
| 05/07/2013 | US8436467 Semiconductor device |
| 05/07/2013 | US8436466 Method and system for intra-chip waveguide communication |
| 05/07/2013 | US8436465 Semiconductor device and method for manufacturing the semiconductor device |
| 05/07/2013 | US8436464 Hollow sealing structure and manufacturing method for hollow sealing structure |
| 05/07/2013 | US8436463 Packaging substrate structure with electronic component embedded therein and method for manufacture of the same |
| 05/07/2013 | US8436462 Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure |
| 05/07/2013 | US8436461 Semiconductor device |
| 05/07/2013 | US8436460 Multiple die paddle leadframe and semiconductor device package |
| 05/07/2013 | US8436459 Power semiconductor module |
| 05/07/2013 | US8436458 Flip-chip, face-up and face-down wirebond combination package |
| 05/07/2013 | US8436456 Wiring board, semiconductor device and method for manufacturing semiconductor device |
| 05/07/2013 | US8436455 Stacked structure of semiconductor packages including through-silicon via and inter-package connector, and method of fabricating the same |
| 05/07/2013 | US8436453 Micromechanical device lubrication |
| 05/07/2013 | US8436452 Carrier for chip packages |
| 05/07/2013 | US8436451 Semiconductor device and method of manufacturing a semiconductor device |
| 05/07/2013 | US8436450 Differential internally matched wire-bond interface |
| 05/07/2013 | US8436449 Chip package and method for fabricating the same |
| 05/07/2013 | US8436448 Through-silicon via with air gap |
| 05/07/2013 | US8436433 Unattached contained semiconductor devices |
| 05/07/2013 | US8436426 Multi-layer via-less thin film resistor |
| 05/07/2013 | US8436352 Semiconductor integrated circuit |