Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2013
05/14/2013US8441130 Power supply interconnect structure of semiconductor integrated circuit
05/14/2013US8441129 Semiconductor device
05/14/2013US8441128 Semiconductor arrangement
05/14/2013US8441127 Bump-on-trace structures with wide and narrow portions
05/14/2013US8441126 Semiconductor device
05/14/2013US8441125 Semiconductor device
05/14/2013US8441124 Cu pillar bump with non-metal sidewall protection structure
05/14/2013US8441123 Semiconductor device with metal dam and fabricating method
05/14/2013US8441122 Semiconductor device having semiconductor chip and metal plate
05/14/2013US8441121 Package carrier and manufacturing method thereof
05/14/2013US8441120 Heat spreader package
05/14/2013US8441118 Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
05/14/2013US8441117 Semiconductor device
05/14/2013US8441116 Semiconductor package having substrate for high speed semiconductor package
05/14/2013US8441115 Semiconductor device with exposed thermal conductivity part
05/14/2013US8441114 Electronic circuit composed of sub-circuits and method for producing
05/14/2013US8441113 Elimination of RDL using tape base flip chip on flex for die stacking
05/14/2013US8441112 Method of manufacturing layered chip package
05/14/2013US8441110 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
05/14/2013US8441109 Structure and method for self protection of power device with expanded voltage ranges
05/14/2013US8441106 Apparatus and method for defining laser cleave alignment
05/14/2013US8441105 Semiconductor device, wafer structure and method for fabricating semiconductor device
05/14/2013US8441102 Semiconductor device having a capacitor
05/14/2013US8441099 Wireless chip
05/14/2013US8441098 Semiconductor package
05/14/2013US8441096 Fuse of semiconductor device and method for forming the same
05/14/2013US8441092 Thermoelectric cooler system, method and device
05/14/2013US8441070 Semiconductor device and method of manufacturing semiconductor device
05/14/2013US8441041 Memory device peripheral interconnects
05/14/2013US8441040 Semiconductor memory device
05/14/2013US8441039 Nanopillar E-fuse structure and process
05/14/2013US8441038 Nano relay with floating bridge
05/14/2013US8440543 Hybrid circuit structure and partial backfill method for improving thermal cycling reliability of same
05/14/2013US8440478 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
05/14/2013US8438727 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
05/14/2013CA2612973C Systems and methods for thermal management of lamps and luminaires using led sources
05/10/2013WO2013066799A1 Semiconductor substrate with molded support layer
05/10/2013WO2013066504A1 Low cte interposer
05/10/2013WO2013066455A2 Flattened substrate surface for substrate bonding
05/10/2013WO2013066294A1 Multi die package structures
05/10/2013WO2013066271A1 A heat sink assembly apparatus
05/10/2013WO2013065895A1 Method for manufacturing a fanout semiconductor package using a lead frame, and semiconductor package and package-on-package for same
05/10/2013WO2013065729A1 Photoreception device, and method for producing photoreception device
05/10/2013WO2013065647A1 Semiconductor device
05/10/2013WO2013065474A1 Semiconductor device
05/10/2013WO2013065464A1 Semiconductor device
05/10/2013WO2013065462A1 Semiconductor device and manufacturing method therefor
05/10/2013WO2013065433A1 Resin composition
05/10/2013WO2013065427A1 Semiconductor module and manufacturing method therefor
05/10/2013WO2013065420A1 Electronic component, assembly substrate, and method for manufacturing electronic component
05/10/2013WO2013065316A1 Power converter
05/10/2013WO2013065287A1 Method for manufacturing semiconductor package
05/10/2013WO2013065230A1 Semiconductor device and manufacturing method thereof
05/10/2013WO2013065196A1 Microchannel cooling device, microchannel cooling system, and electronic instrument
05/10/2013WO2013064945A1 Improved composite getters
05/10/2013WO2013063888A1 Pin structure and pin connection structure thereof
05/10/2013WO2013063817A1 Cof encapsulation unit and cof encapsulation winding
05/10/2013WO2013063748A1 Shielding structure for electronic device
05/10/2013WO2013032748A3 Thermal management system for an aircraft avionics bay
05/10/2013WO2013025981A3 Selective plating of frame lid assembly
05/10/2013WO2013009871A3 Memory module in a package
05/10/2013WO2012174300A3 Hermetic electronics package with dual-sided electrical feedthrough configuration
05/10/2013DE202013001316U1 Vapor-Chamber-Kühler Vapor Chamber cooler
05/10/2013DE202013001295U1 Kühlvorrichtung Cooler
05/09/2013US20130115737 Method of manufacturing a semiconductor device with outer leads having a lead-free plating
05/09/2013US20130113121 Resin paste composition
05/09/2013US20130113120 Semiconductor device and manufacturing method of semiconductor device
05/09/2013US20130113119 Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film
05/09/2013US20130113118 Semiconductor Device and Method of Forming Sloped Surface in Patterning Layer to Separate Bumps of Semiconductor Die from Patterning Layer
05/09/2013US20130113117 Wireless Communication Devices With In-Package Integrated Passive Components
05/09/2013US20130113116 Contact and Method of Formation
05/09/2013US20130113115 System in package process flow
05/09/2013US20130113114 Device Including Two Power Semiconductor Chips and Manufacturing Thereof
05/09/2013US20130113113 Wiring structure in a semiconductor device, method of forming the wiring structure, semiconductor device including the wiring structure and method of manufacturing the semiconductor device
05/09/2013US20130113112 Semiconductor device
05/09/2013US20130113111 Semiconductor devices and methods of manufacturing the same
05/09/2013US20130113110 Semiconductor Structure Having Lateral Through Silicon Via And Manufacturing Method Thereof
05/09/2013US20130113109 Wiring structure, thin film transistor array substrate including the same, and display device
05/09/2013US20130113108 System in package process flow
05/09/2013US20130113107 Semiconductor device
05/09/2013US20130113106 Three-dimensional (3d) integrated circuit with enhanced copper-to-copper bonding
05/09/2013US20130113105 Barrier For Through-Silicon Via
05/09/2013US20130113104 Structure for picking up a buried layer and method thereof
05/09/2013US20130113103 DEVICE HAVING TSVs WITH GETTERING LAYER LATERAL TO TSV TIPS
05/09/2013US20130113102 Semiconductor interconnect structure having a graphene-based barrier metal layer
05/09/2013US20130113101 Use of Gas Cluster Ion Beam To Reduce Metal Void Formation In Interconnect Structures
05/09/2013US20130113100 Semiconductor structure and manufacturing method thereof
05/09/2013US20130113099 Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof
05/09/2013US20130113098 Through via package
05/09/2013US20130113097 Methods of and semiconductor devices with ball strength improvement
05/09/2013US20130113096 Semiconductor device
05/09/2013US20130113095 Packaging substrate and fabrication method thereof
05/09/2013US20130113094 Post-passivation interconnect structure and method of forming the same
05/09/2013US20130113093 Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package
05/09/2013US20130113092 Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
05/09/2013US20130113091 Method of packaging semiconductor die
05/09/2013US20130113090 Power module, electrical power converter, and electric vehicle
05/09/2013US20130113089 Module ic package structure having a metal shielding function for preventing electrical malfunction induced by short-circuit
05/09/2013US20130113088 Chip packaging structure, chip packaging method, and electronic device
05/09/2013US20130113084 Semiconductor substrate with molded support layer
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