Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2013
05/09/2013US20130113083 Resin composition, resin film, semiconductor device, and production method thereof
05/09/2013US20130113071 Semiconductor device with fuse
05/09/2013US20130113070 Interposers for Semiconductor Devices and Methods of Manufacture Thereof
05/09/2013US20130113068 Low-k dielectric protection spacer for patterning through substrate vias through a low-k wiring layer
05/09/2013US20130113054 Semiconductor sensor device and method of packaging same
05/09/2013US20130112993 Semiconductor device and wiring substrate
05/09/2013US20130112652 Method for manufacturing substrate for semiconductor element
05/09/2013US20130112247 Frame for solar panels
05/08/2013EP2590491A2 Heat management device and electronic apparatus
05/08/2013EP2590213A1 Power module and power converter using same
05/08/2013EP2590211A2 System and method for operating an electric power converter
05/08/2013EP2590210A2 Heat dissipating device and manufacture method thereof
05/08/2013EP2590208A2 Large panel leadframe
05/08/2013EP2589626A1 Resin composition for printed circuit board
05/08/2013EP2589082A1 Electronic devices with yielding substrates
05/08/2013EP2589079A1 Stacked ic comprising integrated voltage regulator with embedded passive device (s)
05/08/2013EP2589078A2 Method and system for thin multi chip stack package with film on wire and copper wire
05/08/2013EP2589077A2 Microelectronic package and method of manufacturing same
05/08/2013EP2589076A2 Bumpless build-up layer package design with an interposer
05/08/2013EP2589072A2 Interposer and method for producing holes in an interposer
05/08/2013EP2588539A1 Curable organopolysiloxane composition and optical semiconductor device
05/08/2013EP2588538A1 Curable organopolysiloxane composition and optical semiconductor device
05/08/2013DE112011102577T5 Integriertes Schaltungsmodul mit elektrochemischer Leistungsversorgung Integrated Module with electrochemical power supply
05/08/2013DE102012110494A1 Vorrichtung umfassend zwei Leistungshalbleiterchips und Herstellungsverfahren dafür A device comprising two power semiconductor chips and manufacturing method thereof
05/08/2013DE102011085658A1 Elektronische Schaltung Electronic circuit
05/08/2013DE102010006132B4 Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC Miniaturized electrical component comprising a stack of a MEMS and an ASIC
05/08/2013DE102009011233B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
05/08/2013DE102006005050B4 Halbleitervorrichtung mit Extraktionselektrode und Verfahren A semiconductor device comprising extraction electrode and method
05/08/2013DE102005059224B4 SiC-Halbleitervorrichtung und Herstellungsverfahren dafür SiC semiconductor device and manufacturing method thereof
05/08/2013DE102004048688B4 Leistungs-Halbleitervorrichtung Power semiconductor device
05/08/2013DE10050601B4 Haltevorrichtung für elektronische Bauteile und Halteverfahren für solche Bauteile Holding device for holding electronic components and procedures for such devices
05/08/2013CN202930948U Active power filter's heat sink
05/08/2013CN202930391U HITACHI-series automobile rectifier bridge diode
05/08/2013CN202930380U Full color LED sealing structure of integrating driving mechanism
05/08/2013CN202930378U Thyristor module and silicon controlled rectifier
05/08/2013CN202930377U Semiconductor bonding wire which can be preserved for long time
05/08/2013CN202930376U Semiconductor bonding wire which can be preserved for long time
05/08/2013CN202930375U Small-sized framework for card molding encapsulation and framework strip
05/08/2013CN202930374U Common-anode small-power silicon controlled rectifier module
05/08/2013CN202930373U Micro-bump chip packaging structure with metal protective layer
05/08/2013CN202930372U Power electronic system with switching device and trigger device
05/08/2013CN202930371U No-polarity 485 chip
05/08/2013CN1998080B Tamper respondent covering
05/08/2013CN103098563A Connecting contact
05/08/2013CN103098376A Transistor circuit, flip-flop, signal processing circuit, driver circuit, and display device
05/08/2013CN103098245A Semifinished product and method for producing a light-emitting diode
05/08/2013CN103098225A Electrodeposition methods of gallium and gallium alloy films and related photovoltaic structures
05/08/2013CN103098207A Stacked semiconductor chip device with thermal management
05/08/2013CN103098206A Multi-chip package with offset die stacking and method of making same
05/08/2013CN103098205A Apparatus for integrated circuit packaging
05/08/2013CN103098204A Semiconductor chip with redundant thru-silicon-vias
05/08/2013CN103098203A Wide input output memory with low density, low latency and high density, high latency blocks
05/08/2013CN103098202A Electronic packaging with a variable thickness mold cap
05/08/2013CN103098201A Multifunction sensor as pop-mwlp
05/08/2013CN103098197A Method for producing a semiconductor component with a through-contact and semiconductor component with through-contact
05/08/2013CN103098193A Test pin array with electrostatic discharge protection
05/08/2013CN103098192A Adhesive for electronic components, and manufacturing method for semiconductor chip mount
05/08/2013CN103098191A Electronic-component mounted body, electronic component, and circuit board
05/08/2013CN103098186A Method of fabrication of semiconductor device
05/08/2013CN103097932A Optical coupling device, opticalsystem and methods of assembly
05/08/2013CN103097436A 树脂组合物 Resin composition
05/08/2013CN103097317A Cover glass for packaging semiconductor material, and process for production thereof
05/08/2013CN103096651A Electronic device
05/08/2013CN103096636A Manufacture method and manufacture device of heat conduction structural component and heat conduction structural component
05/08/2013CN103094362A 3D Capacitor And Method Of Manufacturing Same
05/08/2013CN103094330A Semiconductor device and method of manufacturing same
05/08/2013CN103094293A Pad Design For Circuit Under Pad In Semiconductor Devices
05/08/2013CN103094275A Integrated circuit having a mom capacitor and method of making same
05/08/2013CN103094262A Device Including Two Power Semiconductor Chips And Manufacturing Thereof
05/08/2013CN103094261A Electronic Assembly Apparatus And Associated Methods
05/08/2013CN103094260A Package On Package Devices And Methods Of Packaging Semiconductor Dies
05/08/2013CN103094259A Substrate with built-in electronic components
05/08/2013CN103094258A Air cavity type encapsulation and manufacturing method thereof
05/08/2013CN103094257A 3D chip package with shielded structures
05/08/2013CN103094256A Sealing system
05/08/2013CN103094255A Interconnection electromigration test structure
05/08/2013CN103094254A Light-emitting diode module
05/08/2013CN103094253A Grid oxide layer test structure
05/08/2013CN103094252A Through-silicon via (TSV) testing structure and TSV testing method
05/08/2013CN103094251A Test structure used for evaluating organic photo conductor (OPC) effects
05/08/2013CN103094250A Trimming resistor and preparation method thereof
05/08/2013CN103094249A Three dimensional integrated circuit connection structure and method
05/08/2013CN103094248A Metal fuse wire structure and manufacturing method thereof
05/08/2013CN103094247A Self-aligned epitaxial contact hole structure and preparation method
05/08/2013CN103094246A Post-passivation interconnect structure and method of forming the same
05/08/2013CN103094245A Integrated circuit device and method for establishing electrical conductor in integrated circuit device
05/08/2013CN103094244A Packaging substrate having embedded through-via interposer and method of fabricating the same
05/08/2013CN103094243A Packaging substrate structure and fabrication method thereof
05/08/2013CN103094242A Packaging substrate having embedded capacitors and fabrication method thereof
05/08/2013CN103094241A Re-wiring lead frame FCAAQFN package part and manufacture process thereof
05/08/2013CN103094240A High-density etched lead frame FCAAQFN package part and manufacture process thereof
05/08/2013CN103094239A Auxiliary paster pin added lead frame package part and manufacture process
05/08/2013CN103094238A Lead frame and semiconductor device
05/08/2013CN103094237A Semiconductor package
05/08/2013CN103094236A Single-chip package part with wafer thinned after bottom fillers cures and manufacture process thereof
05/08/2013CN103094235A AAQFN package part using electroplating process and manufacture process thereof
05/08/2013CN103094234A Extension pin Fan-out Panel Level ball grid array (BGA) package part and manufacture process thereof
05/08/2013CN103094233A Semiconductor element and fabrication method thereof
05/08/2013CN103094232A Chip packaging structure
05/08/2013CN103094231A Electronic device and method for fabricating electronic device
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