| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/16/2013 | DE112011102300T5 Verfahren zur elektrolytischen Abscheidung von Gallium- und Galliumlegierungs-Dünnschichten und zugehöriger Photovoltaikstrukturen A method for the electrolytic deposition of gallium and Galliumlegierungs thin films and related photovoltaic structures |
| 05/16/2013 | DE112005003653B4 Leistungshalbleitermodul mit auf Schaltungsträger aufgebrachten Lastanschlusselementen und Anschlussklemmelementen Power semiconductor module applied to circuit carrier load connection elements and terminal elements |
| 05/16/2013 | DE10295972B4 Nicht in einer Form hergestellte Packung für eine Halbleiteranordnung und Verfahren zur Herstellung Not manufactured in a mold package for a semiconductor device and method for producing |
| 05/16/2013 | DE102012220453A1 Liquid cooling device for power device e.g. insulated-gate bipolar transistor(IGBT) used in electric vehicle, has upper and lower end sections of tap-shaped ribs that are soldered to upper wall and bottom wall of housing |
| 05/16/2013 | DE102012219693A1 Dimm-flüssigkeitskühlsystem, das durch benutzer gewartet werden kann Dimming liquid cooling system that can be serviced by user |
| 05/16/2013 | DE102012110961A1 Gehäuse für eine Chipanordnung und Verfahren zum Herstellen eines Gehäuses A housing for a chip arrangement and method for manufacturing a housing |
| 05/16/2013 | DE102012101666B3 Power semiconductor modular system, has assembly segment and adjustment segment undetachably connected when undercut connection is not formed during positioning of two semiconductor modules relative to each other |
| 05/16/2013 | DE102011118483A1 Heat exchanger used for motor car, has base whose oriented cross-section is set with different widths and lengths perpendicular and parallel to longitudinal direction such that maximum length has greater extension than maximum width |
| 05/16/2013 | DE102011055223B3 Unmittelbare Kontaktierung eines Energiespeichers oder einer Last mittels eines elektronischen Lastschalters Direct contact with an energy store or a load by means of an electronic circuit breaker |
| 05/16/2013 | DE102007027378B4 Verfahren zur Herstellung eines elektronischen Bauelements A method of manufacturing an electronic component |
| 05/16/2013 | DE102007015295B4 Leistungshalbleiterbauelement mit Temperatursensor und Verfahren zur Herstellung eines Leistungshalbleiterbauelements mit einem integrierten Temperatursensor Power semiconductor component with the temperature sensor and method for manufacturing a power semiconductor device with an integrated temperature sensor |
| 05/16/2013 | DE102007012986B4 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production |
| 05/16/2013 | DE102006012007B4 Leistungshalbleitermodul mit oberflächenmontierbaren flachen Außenkontakten und Verfahren zur Herstellung desselben und dessen Verwendung The power semiconductor module of the same with flat outer surface mount contacts and methods of making and use thereof |
| 05/16/2013 | DE102005011159B4 Halbleiterbauteil mit oberflächenmontierbaren Außenkontaktflächen und Verfahren zur Herstellung desselben Of the same semiconductor device with surface-mountable external contact surfaces and methods for preparing |
| 05/16/2013 | CA2818085A1 A method of making a heat radiating structure for high-power led |
| 05/15/2013 | EP2592654A1 Imaging device, and method for manufacturing imaging device |
| 05/15/2013 | EP2592651A2 Heat dissipating module |
| 05/15/2013 | EP2592650A1 Silicon carbide substrate, semiconductor device, and soi wafer |
| 05/15/2013 | EP2592403A1 Component with temperature recording |
| 05/15/2013 | EP2592363A1 Energy conversion device |
| 05/15/2013 | EP2591644A1 Connecting contact |
| 05/15/2013 | EP2591506A1 Microelectronic device having metal interconnection levels connected by programmable vias |
| 05/15/2013 | EP2591501A1 Microelectronic package with dual or multiple - etched flip -chip connectors and corresponding manufacturing method |
| 05/15/2013 | EP2591500A1 Cmos compatible microchannel heat sink for electronic cooling and its fabrication |
| 05/15/2013 | EP2591497A2 Method to form solder deposits on substrates |
| 05/15/2013 | CN202940236U Package substrate structure |
| 05/15/2013 | CN202940235U Package substrate and package structure |
| 05/15/2013 | CN202940234U Package structure of contact intelligent card |
| 05/15/2013 | CN202940233U Lead frame one-step injection molding block |
| 05/15/2013 | CN202940232U Plastic package lead frame |
| 05/15/2013 | CN202940231U Power electronic system with first and second subsystems |
| 05/15/2013 | CN202940230U Thermoelectric-refrigeration heat pipe radiator for electric automobile IGBT |
| 05/15/2013 | CN202940229U Photovoltaic power supply management module |
| 05/15/2013 | CN202940228U Packaging structure of semiconductor integrated transistor |
| 05/15/2013 | CN202940227U Soft-material ring and hard epoxy-resin packaging diode |
| 05/15/2013 | CN202940226U Package substrate |
| 05/15/2013 | CN202940225U Package substrate |
| 05/15/2013 | CN103109587A Coating method for an optoelectronic chip-on-board module |
| 05/15/2013 | CN103109383A Optoelectronic component and method for producing it |
| 05/15/2013 | CN103109374A Method for marking a solar cell, and solar cell |
| 05/15/2013 | CN103109368A Semiconductor chip with reinforcing through-silicon-vias |
| 05/15/2013 | CN103109367A Stackable molded microelectronic packages |
| 05/15/2013 | CN103109366A 半导体模块 Semiconductor Modules |
| 05/15/2013 | CN103109362A Integrated circuits with through-substrate vias |
| 05/15/2013 | CN103109337A 电化学装置 Electrochemical device |
| 05/15/2013 | CN103108527A Wind scooper and electronic device |
| 05/15/2013 | CN103107204A Vertical gallium nitride schottky diode |
| 05/15/2013 | CN103107171A Semiconductor device of flip chip |
| 05/15/2013 | CN103107167A Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device |
| 05/15/2013 | CN103107166A Inductor and wireless coupling communication system in three-dimensional stack packaging chip |
| 05/15/2013 | CN103107165A Semiconductor packaging structure provided with seal ring and micro electro mechanical system device |
| 05/15/2013 | CN103107164A Radio frequency packaging structure |
| 05/15/2013 | CN103107163A Semiconductor test structure and forming method and testing method thereof |
| 05/15/2013 | CN103107162A Metal oxide semiconductor (MOS) component latch-up monitoring structure |
| 05/15/2013 | CN103107161A Pinboard structure using conducting resin as signal return plane and preparation method thereof |
| 05/15/2013 | CN103107160A Semiconductor device for increasing bit line contact area, and module and system including the same |
| 05/15/2013 | CN103107159A Programmable polycrystalline silicon fuse device structure and realizing method of technology of programmable polycrystalline silicon fuse device structure |
| 05/15/2013 | CN103107158A Semiconductor device and forming method thereof |
| 05/15/2013 | CN103107157A Chip package, method for forming the same |
| 05/15/2013 | CN103107156A Protruding block structure of wafer welding cushion and manufacturing method thereof |
| 05/15/2013 | CN103107155A Double aluminum pad structure and achieving method thereof |
| 05/15/2013 | CN103107154A Stress isolation welding pad structure for through silicon via (TSV) copper interconnection and manufacturing method thereof |
| 05/15/2013 | CN103107153A Chip package and the forming method thereof |
| 05/15/2013 | CN103107152A Bumps for chip scale packaging |
| 05/15/2013 | CN103107151A Termination structure for gallium nitride Schottky diode |
| 05/15/2013 | CN103107150A Interposers for semiconductor devices and methods of manufacture thereof |
| 05/15/2013 | CN103107149A Liquid cooling device for power device e.g. insulated-gate bipolar transistor(igbt) used in electric vehicle, has upper and lower end sections of tap-shaped ribs that are soldered to upper wall and bottom wall of housing |
| 05/15/2013 | CN103107148A Thermally enhanced packaging structure |
| 05/15/2013 | CN103107147A Radiator with surface covered with graphene film |
| 05/15/2013 | CN103107146A Semiconductor package and method of manufacturing the same |
| 05/15/2013 | CN103107145A Semiconductor packaging piece, prefabricated lead frame and manufacturing method thereof |
| 05/15/2013 | CN103107144A Three dimensional semiconductor assembly board |
| 05/15/2013 | CN103107143A Housing for a chip arrangement and a method for forming a housing |
| 05/15/2013 | CN103107142A Semiconductor device having lid structure and method of making same |
| 05/15/2013 | CN103107141A Parcel-gilt cover plate structure |
| 05/15/2013 | CN103107140A Thin film crystal transistor array base plate and manufacture method thereof |
| 05/15/2013 | CN103107131A Semiconductor device, method of manufacturing the device, and liquid crystal display |
| 05/15/2013 | CN103107128A Metal bonding method of three-dimensional chip structure and bonding structure |
| 05/15/2013 | CN103107125A Semiconductor device and forming method thereof |
| 05/15/2013 | CN103107102A Method of packaging semiconductor die |
| 05/15/2013 | CN103107101A Semiconductor sensor device and method of packaging same |
| 05/15/2013 | CN103107099A Semiconductor packages and methods of packaging semiconductor devices |
| 05/15/2013 | CN103107098A Encapsulating method of advanced square flat pins-free and encapsulating structure thereof |
| 05/15/2013 | CN103107086A Manufacturing technique of low-voltage chip and low-voltage chip thereof |
| 05/15/2013 | CN103105913A Heat dissipation system |
| 05/15/2013 | CN103103403A Electronic packaging material |
| 05/15/2013 | CN103102816A Anisotropic conductive film and semiconductor device |
| 05/15/2013 | CN103102801A Solution composition for passivation layer, thin film transistor array panel and manufacturing method for thin film transistor array panel |
| 05/15/2013 | CN102306648B Optical coupler |
| 05/15/2013 | CN102208385B Semiconductor device and semiconductor packaging structure provided with the same |
| 05/15/2013 | CN102208377B Radiating unit with antioxidant nano-film and deposition method of antioxidant nano-film |
| 05/15/2013 | CN102150242B Liquid for protecting copper wiring surface and method for manufacturing semiconductor circuit element |
| 05/15/2013 | CN101904002B Package-on-package secure module having BGA mesh cap |
| 05/14/2013 | US8443306 Planar compatible FDSOI design architecture |
| 05/14/2013 | US8441136 Protection layer for adhesive material at wafer edge |
| 05/14/2013 | US8441135 Semiconductor device |
| 05/14/2013 | US8441134 Chip stacking structure |
| 05/14/2013 | US8441133 Semiconductor device |
| 05/14/2013 | US8441132 Packaged microelectronic devices recessed in support member cavities, and associated methods |
| 05/14/2013 | US8441131 Strain-compensating fill patterns for controlling semiconductor chip package interactions |