| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/03/2015 | US8944148 Add-on heat sink |
| 02/03/2015 | US8944147 Heat exchanger and method for manufacturing same |
| 02/03/2015 | US8943683 Fabricating method of embedded package structure |
| 01/29/2015 | WO2015013530A1 Signal strength enhancement in a biometric sensor array |
| 01/29/2015 | WO2015013415A1 A soc design with critical technology pitch alignment |
| 01/29/2015 | WO2015013024A1 Methods to control wafer warpage upon compression molding thereof and articles useful therefor |
| 01/29/2015 | WO2015012792A1 Screw plug adjustable heat sinks and methods of fabricating the same |
| 01/29/2015 | WO2015012790A1 Square plug adjustable heat sinks and methods of fabricating the same |
| 01/29/2015 | WO2015012535A1 Heat pipe manufacturing method |
| 01/29/2015 | WO2015012405A1 Element-housing package and mounting structure |
| 01/29/2015 | WO2015012188A1 Bonding structure and semiconductor device using same |
| 01/29/2015 | WO2015012181A1 Power module and manufacturing method thereof |
| 01/29/2015 | WO2015012180A1 Power module and manufacturing method thereof |
| 01/29/2015 | WO2015011849A1 Electronic device and manufacturing method for same |
| 01/29/2015 | WO2015011391A1 Part made from a composite material, comprising a thermally and electrically conductive portion, and method for producing such a part |
| 01/29/2015 | WO2015011072A1 Heat exchanger and method for production thereof and use thereof |
| 01/29/2015 | WO2015010638A1 Wafer encapsulation |
| 01/29/2015 | WO2015010586A1 Grooved solder mask igbt module substrate |
| 01/29/2015 | WO2015010567A1 Plastic-packaging intelligent power module and radiator structure thereof |
| 01/29/2015 | WO2015010195A1 Through semiconductor via structure with reduced stress proximity effect |
| 01/29/2015 | US20150033050 Semiconductor integrated circuit and computing device including the same |
| 01/29/2015 | US20150031200 Bump Pad Structure |
| 01/29/2015 | US20150031194 Method for designing antenna cell that prevents plasma induced gate dielectric damage in semiconductor integrated circuits |
| 01/29/2015 | US20150031173 Copper post solder bumps on substrates |
| 01/29/2015 | US20150031172 Method for interconnection of components on a substrate |
| 01/29/2015 | US20150031149 Multi-chip package and method of manufacturing the same |
| 01/29/2015 | US20150029776 Semiconductor device having a reduced area and enhanced yield |
| 01/29/2015 | US20150029638 Polyimides as dielectrics |
| 01/29/2015 | US20150028917 Semiconductor Component and an Operating Method for a Protective Circuit Against Light Attacks |
| 01/29/2015 | US20150028914 Semiconductor device and method for forming the same |
| 01/29/2015 | US20150028500 Forming alignment mark and resulting mark |
| 01/29/2015 | US20150028499 Apparatus and Method for Forming Alignment Features for Back Side Processing of a Wafer |
| 01/29/2015 | US20150028498 Molding composition for semiconductor package and semiconductor package using the same |
| 01/29/2015 | US20150028497 Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus |
| 01/29/2015 | US20150028495 Soc design with critical technology pitch alignment |
| 01/29/2015 | US20150028494 Integrated circuit device having through-silicon-via structure and method of manufacturing the integrated circuit device |
| 01/29/2015 | US20150028493 Semiconductor device and manufacturing method thereof |
| 01/29/2015 | US20150028492 Semiconductor devices having bit line structures disposed in trenches, methods of fabricating the same, packages including same, modules including the same, and systems including the same |
| 01/29/2015 | US20150028491 Improved SiCOH Hardmask with Graded Transition Layers |
| 01/29/2015 | US20150028490 Integrated circuits having device contacts and methods for fabricating the same |
| 01/29/2015 | US20150028489 Method for off-grid routing structures utilizing self aligned double patterning (sadp) technology |
| 01/29/2015 | US20150028488 Method for manufacturing a conducting contact on a conducting element |
| 01/29/2015 | US20150028486 Interconnect structures for embedded bridge |
| 01/29/2015 | US20150028485 Substrate structure and semiconductor package having the same |
| 01/29/2015 | US20150028484 Random local metal cap layer formation for improved integrated circuit reliability |
| 01/29/2015 | US20150028483 Novel method for electromigration and adhesion using two selective deposition |
| 01/29/2015 | US20150028482 Device layout for reducing through-silicon-via stress |
| 01/29/2015 | US20150028481 Semiconductor devices with ball strength improvement |
| 01/29/2015 | US20150028480 Substrate and assembly thereof with dielectric removal for increased post height |
| 01/29/2015 | US20150028479 Semiconductor devices with close-packed via structures having in-plane routing and method of making same |
| 01/29/2015 | US20150028478 Semiconductor devices |
| 01/29/2015 | US20150028477 Semiconductor packages having semiconductor chips disposed in opening in shielding core plate |
| 01/29/2015 | US20150028476 Devices, systems, and methods related to forming through-substrate vias with sacrificial plugs |
| 01/29/2015 | US20150028475 Technique for wafer-level processing of qfn packages |
| 01/29/2015 | US20150028474 Semiconductor package and method of manufacturing the semiconductor package |
| 01/29/2015 | US20150028473 Stack packages and methods of fabricating the same |
| 01/29/2015 | US20150028472 Stacked package and method for manufacturing the same |
| 01/29/2015 | US20150028471 Semiconductor Device and Method of Forming Through Mold Hole with Alignment and Dimension Control |
| 01/29/2015 | US20150028470 Through-Silicon Coaxial Via Structure And Method |
| 01/29/2015 | US20150028469 Semiconductor assembly and method of manufacture |
| 01/29/2015 | US20150028468 Non-leaded type semiconductor package and method of assembling same |
| 01/29/2015 | US20150028467 Semiconductor device and method for manufacturing the same |
| 01/29/2015 | US20150028466 Semiconductor device and manufacturing method thereof |
| 01/29/2015 | US20150028465 Semiconductor device and method of manufacturing the same |
| 01/29/2015 | US20150028464 Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus |
| 01/29/2015 | US20150028463 Integrated Passives Package, Semiconductor Module and Method of Manufacturing |
| 01/29/2015 | US20150028462 Semiconductor module |
| 01/29/2015 | US20150028461 Conductive Pads and Methods of Formation Thereof |
| 01/29/2015 | US20150028460 Semiconductor component and method of manufacture |
| 01/29/2015 | US20150028459 Method for semiconductor self-aligned patterning |
| 01/29/2015 | US20150028456 Semiconductor Device, a Semiconductor Wafer Structure, and a Method for Forming a Semiconductor Wafer Structure |
| 01/29/2015 | US20150028452 Complementary back end of line (beol) capacitor |
| 01/29/2015 | US20150028450 Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the same |
| 01/29/2015 | US20150028448 Chip Package with Embedded Passive Component |
| 01/29/2015 | US20150028447 Methods of forming an e-fuse for an integrated circuit product and the resulting e-fuse structure |
| 01/29/2015 | US20150028421 Esd protection semiconductor device |
| 01/29/2015 | US20150028400 Semiconductor device |
| 01/29/2015 | US20150028395 pH SENSOR WITH BONDING AGENT DISPOSED IN A PATTERN |
| 01/29/2015 | US20150028363 Chip-on-film package and display device including the same |
| 01/29/2015 | US20150028342 Array substrate, manufacturing method thereof and display device |
| 01/29/2015 | US20150028337 Monitoring and Controlling Temperatures in a Semiconductor Structure |
| 01/29/2015 | US20150028324 Display device |
| 01/29/2015 | US20150028289 Active matrix using hybrid integrated circuit and bipolar transistor |
| 01/29/2015 | US20150028084 Method for carrying out solder connections in a technologically optimized manner |
| 01/29/2015 | US20150027770 Leadframe and the method to fabricate thereof |
| 01/29/2015 | US20150027767 System and method for lead frame package degating |
| 01/29/2015 | DE112013001612T5 Halbleiterbauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 01/29/2015 | DE102014213439A1 Leiterrahmen, Stromumwandlungsvorrichtung, Halbleitergerät und Verfahren zur Herstellung eines Halbleitergeräts Lead frame, power conversion device, the semiconductor device and process for producing a semiconductor device |
| 01/29/2015 | DE102014203225A1 Anordnung und Verfahren zur Abfuhr der Wärmeverluste von elektrischen Bauelementen hoher Pulsleistung Apparatus and method for dissipating the heat loss of electrical components high pulse power |
| 01/29/2015 | DE102014110552A1 Integriertes passivbauteilpackage, halbleitermodul und herstellungsverfahren Integrated passive component package, semiconductor module and the manufacturing processes |
| 01/29/2015 | DE102014110442A1 Halbleitervorrichtung mit einer Steuerschaltung A semiconductor device with a control circuit |
| 01/29/2015 | DE102014110362A1 Leitende Kontaktinseln und Verfahren zu ihrer Herstellung Conductive contact pads and methods for their preparation |
| 01/29/2015 | DE102014110358A1 Verfahren zum bearbeiten eines werkstücks A method for processing a workpiece |
| 01/29/2015 | DE102014109981A1 Chip-Package mit passiven Komponenten Chip package with passive components |
| 01/29/2015 | DE102014109909A1 Chipbaugruppe mit eingebetteter passiver Komponente Chip module with embedded passive component |
| 01/29/2015 | DE102014109874A1 Elektronisches Element und elektronische Vorrichtung The electronic device and electronic device |
| 01/29/2015 | DE102014010807A1 Überwachung und Steuerung der Temperatur in einer Halbleiterstruktur Monitoring and controlling the temperature in a semiconductor structure |
| 01/29/2015 | DE102013214518A1 Wärmeübertrager und Verfahren zu dessen Herstellung und Verwendung Heat exchanger and method of making and using |
| 01/29/2015 | DE102013214486A1 Optoelektronisches Bauelement und Verfahren zu seiner Herstellung Optoelectronic component and process for its preparation |
| 01/29/2015 | DE102013108089A1 Organische Leuchtdiode und Anordnung mit einer organischen Leuchtdiode Organic light-emitting diode and arrangement with an organic light-emitting diode |