| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/23/2013 | DE102011086687A1 Verfahren zum Kontaktieren eines Halbleiters und Kontaktanordnung für einen Halbleiter A method for contacting a semiconductor and contact arrangement for a semiconductor |
| 05/23/2013 | DE102008054306B4 Herstellungsverfahren für harzabgedichtete Halbleitervorrichtung Manufacturing process for harzabgedichtete semiconductor device |
| 05/23/2013 | DE102004032184B4 Laserstrahlbearbeitungsverfahren und Laserstrahlbearbeitungsmaschine bzw. -vorrichtung Laser beam machining method and laser processing machine |
| 05/23/2013 | CA2856015A1 Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure |
| 05/22/2013 | EP2595188A1 Circuitry package |
| 05/22/2013 | EP2595187A2 Surface mountable microwave signal Transition block for microstrip to perpendicular waveguide transition |
| 05/22/2013 | EP2595186A2 High frequency semiconductor package |
| 05/22/2013 | EP2595185A2 Device with an integrated circuit |
| 05/22/2013 | EP2595184A2 Silver bond wire for semiconductor devices |
| 05/22/2013 | EP2595183A2 Heat dissipation module |
| 05/22/2013 | EP2595095A1 Portable data carrier |
| 05/22/2013 | EP2594596A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 05/22/2013 | EP2594123A2 Anti-tamper device for integrated circuits |
| 05/22/2013 | EP2593977A2 Improved heat sinking methods for performance and scalability |
| 05/22/2013 | EP2593976A2 Semifinished product and method for producing a light-emitting diode |
| 05/22/2013 | EP2593965A1 Apparatus for integrated circuit packaging |
| 05/22/2013 | DE202013004162U1 Wasserkühlmodul Water cooling module |
| 05/22/2013 | CN202949371U Insulated gate bipolar transistor water-cooling inversion device |
| 05/22/2013 | CN202949353U Power supply module used for large-power pulse stepping modulated high-voltage power supply |
| 05/22/2013 | CN202949234U High voltage TSC thyristor switched capacitor valve group |
| 05/22/2013 | CN202948921U Non-insulated type power module |
| 05/22/2013 | CN202948920U Three-dimensional integration high-density multi-chip assembly |
| 05/22/2013 | CN202948919U Static protector |
| 05/22/2013 | CN202948918U Package substrate and package structure of semiconductor component |
| 05/22/2013 | CN202948917U Integrated lead wire framework used for MGP die |
| 05/22/2013 | CN202948916U Semiconductor lead frame capable of preventing chip crushing |
| 05/22/2013 | CN202948915U High density hybrid integrated circuit |
| 05/22/2013 | CN202948914U Conductive electrodes and electronic device with linear material |
| 05/22/2013 | CN202948913U Radiating device tightly fitted with heat pipe |
| 05/22/2013 | CN202948912U Diode fixing structure of photovoltaic battery junction box |
| 05/22/2013 | CN202948391U Radiator |
| 05/22/2013 | CN103119739A Led模块 Led Module |
| 05/22/2013 | CN103119713A Electrochemically powered integrated circuit package |
| 05/22/2013 | CN103119712A Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same |
| 05/22/2013 | CN103119711A Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby |
| 05/22/2013 | CN103119710A Method for manufacturing package substrate for semiconductor element mounting |
| 05/22/2013 | CN103119702A Semiconductor chip device with polymeric filler trench |
| 05/22/2013 | CN103119374A Cooler and refrigeration device provided with same |
| 05/22/2013 | CN103119197A Amorphous silicon nitride film and method for producing same |
| 05/22/2013 | CN103117276A Low-inductive semiconductor module |
| 05/22/2013 | CN103117275A Chip packaging structure and chip packaging method |
| 05/22/2013 | CN103117274A Single-phase bridge rectifier |
| 05/22/2013 | CN103117273A Three-phase bridge rectifier |
| 05/22/2013 | CN103117272A Potting single-phase flat-shaped bridge rectifier |
| 05/22/2013 | CN103117271A Rectifier bridge pile with short noumenon |
| 05/22/2013 | CN103117270A High speed memory chip module and electronics system device with a high speed memory chip module |
| 05/22/2013 | CN103117269A Fuse wire assembly, fuse wire assembly manufacturing method and equipment |
| 05/22/2013 | CN103117268A MOM capacitor having electrodes made from local interconnects and manufacturing method thereof |
| 05/22/2013 | CN103117267A Semiconductor arrangement for galvanically isolated signal transmission and method for producing such an arrangement |
| 05/22/2013 | CN103117266A Electric conduction plug and forming method |
| 05/22/2013 | CN103117265A Lead pad and integrated circuit |
| 05/22/2013 | CN103117264A Wiring substrate and manufacturing method of the same |
| 05/22/2013 | CN103117263A Integrated circuit package |
| 05/22/2013 | CN103117262A Electrical device with connection interface, circuit board thereof, and method for manufacturing the same |
| 05/22/2013 | CN103117261A Package structures and methods for forming the same |
| 05/22/2013 | CN103117260A Welding spot structure |
| 05/22/2013 | CN103117259A Triangle jumper wire |
| 05/22/2013 | CN103117258A High-hole-density through hole metal foam electronic element heat-dissipation device based on impact jet flow |
| 05/22/2013 | CN103117257A Package body of bridge rectifier |
| 05/22/2013 | CN103117256A Ceramic bonding copper substrate and manufacture method thereof |
| 05/22/2013 | CN103117255A DBC (database computer) substrate |
| 05/22/2013 | CN103117254A Package |
| 05/22/2013 | CN103117253A Encapsulation structure of power module |
| 05/22/2013 | CN103117233A Rotating curing |
| 05/22/2013 | CN103117232A Wafer-level packaging method and packaging structure thereof |
| 05/22/2013 | CN103117231A Wafer-level packaging method and packaging structure thereof |
| 05/22/2013 | CN102440085B Heat exchanger and method of manufacturing the same |
| 05/22/2013 | CN102420201B 硅通孔结构及其制造方法 TSV structure and manufacturing method |
| 05/22/2013 | CN102208387B Circuit board for being connected with ball grid array packaging assembly and method for forming bonding pad structure |
| 05/22/2013 | CN102208382B Integrated circuit package component provided with side-edge pins |
| 05/22/2013 | CN102176435B Flexible type base plate structure and manufacturing method thereof |
| 05/22/2013 | CN102105971B Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein |
| 05/22/2013 | CN102097401B Semiconductor element cooling apparatus |
| 05/22/2013 | CN102064175B Semiconductor structure and manufacturing method thereof |
| 05/22/2013 | CN101999168B Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking |
| 05/22/2013 | CN101996942B Semiconductor device and production method thereof |
| 05/22/2013 | CN101855596B Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device |
| 05/22/2013 | CN101840886B Manufacturing method of semiconductor device |
| 05/22/2013 | CN101770958B Protective thin film coating in chip packaging |
| 05/22/2013 | CN101471352B Photodetection semiconductor device, photodetector, and image display device |
| 05/22/2013 | CN101465329B Radiating plate for semiconductor package and electroplating method therefor |
| 05/22/2013 | CN101443979B Multi-chip module for battery power control |
| 05/22/2013 | CN101281879B Double-stage self-aligning contact window and manufacturing method thereof |
| 05/21/2013 | US8446726 Semiconductor module having an insert and method for producing a semiconductor module having an insert |
| 05/21/2013 | US8446021 Microfluidic component and method for manufacturing same |
| 05/21/2013 | US8446020 Multi-chip module |
| 05/21/2013 | US8446019 Solder bump interconnect |
| 05/21/2013 | US8446018 Package on package |
| 05/21/2013 | US8446017 Stackable wafer level package and fabricating method thereof |
| 05/21/2013 | US8446016 Chip stack package |
| 05/21/2013 | US8446015 Semiconductor device and method for manufacturing thereof |
| 05/21/2013 | US8446014 Integrated circuit interconnect structure |
| 05/21/2013 | US8446013 Wiring substrate and method for manufacturing the wiring substrate |
| 05/21/2013 | US8446012 Interconnect structures |
| 05/21/2013 | US8446011 Devices and memory arrays including bit lines and bit line contacts |
| 05/21/2013 | US8446010 Multilayer wiring, semiconductor device, substrate for display device, and display device |
| 05/21/2013 | US8446008 Semiconductor device bonding with stress relief connection pads |
| 05/21/2013 | US8446007 Non-uniform alignment of wafer bumps with substrate solders |
| 05/21/2013 | US8446006 Structures and methods to reduce maximum current density in a solder ball |
| 05/21/2013 | US8446005 Semiconductor device having a bus configuration which reduces electromigration |