| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/28/2013 | US8450150 Manufacturing method of semiconductor integrated circuit device |
| 05/28/2013 | CA2666815C Electrothermal interface material enhancer |
| 05/28/2013 | CA2520241C Metal base circuit board and its production process |
| 05/27/2013 | DE202013002938U1 Vapor-Chamber-Kühler Vapor Chamber cooler |
| 05/23/2013 | WO2013075108A1 Two level leadframe with upset ball bonding surface and device package |
| 05/23/2013 | WO2013074846A1 Radio frequency package on package circuit |
| 05/23/2013 | WO2013074619A1 Matrices for rapid alignment of graphitic structures for stacked chip cooling applications |
| 05/23/2013 | WO2013074540A1 Glass-encapsulated pressure sensor |
| 05/23/2013 | WO2013074298A1 Defected ground plane inductor |
| 05/23/2013 | WO2013074178A1 Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump |
| 05/23/2013 | WO2013074061A1 Controlled solder-on-die integrations on packages and methods of assembling same |
| 05/23/2013 | WO2013073696A1 Cooling device and electronic device using same |
| 05/23/2013 | WO2013073638A1 Curable composition, composition for application, cured film, laser processing method, and manufacturing method for multi-layer wiring structure |
| 05/23/2013 | WO2013073606A1 Silane-containing composition, curable resin composition, and sealing material |
| 05/23/2013 | WO2013073574A1 Semiconductor device, method for manufacturing same, and electronic component |
| 05/23/2013 | WO2013073573A1 Semiconductor device and fabrication method for same, and electronic component |
| 05/23/2013 | WO2013073543A1 Electronic substrate and electronic device |
| 05/23/2013 | WO2013073440A1 Transfer substrate for forming metal wiring line and method for forming metal wiring line by means of said transfer substrate |
| 05/23/2013 | WO2013073339A1 Treatment method and template for substrate |
| 05/23/2013 | WO2013073082A1 Expanded semiconductor chip and semiconductor device |
| 05/23/2013 | WO2013073021A1 Device for cooling electrical apparatus |
| 05/23/2013 | WO2013073019A1 Device for cooling electrical apparatus |
| 05/23/2013 | WO2013072897A2 Active shield with electrically configurable interconnections |
| 05/23/2013 | WO2013072363A1 Energy conversion device |
| 05/23/2013 | WO2013072180A1 Electronic apparatus, such as a modem or the like, comprising a plurality of air-cooled processors |
| 05/23/2013 | WO2013071615A1 Back frame, manufacturing method of the back frame, and backlight system |
| 05/23/2013 | WO2013071578A1 Chip-on-film structure for liquid crystal panel |
| 05/23/2013 | US20130130493 Connecting pad producing method |
| 05/23/2013 | US20130130492 System and method for improving solder joint reliability in an integrated circuit package |
| 05/23/2013 | US20130130445 Active area bonding compatible high current structures |
| 05/23/2013 | US20130130435 Thick film conductive composition and use thereof |
| 05/23/2013 | US20130128487 Air cavity package configured to electrically couple to a printed circuit board and method of providing same |
| 05/23/2013 | US20130128483 Device with an integrated circuit |
| 05/23/2013 | US20130127071 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 05/23/2013 | US20130127070 Stacked Seminconductor Package |
| 05/23/2013 | US20130127069 Matrices for rapid alignment of graphitic structures for stacked chip cooling applications |
| 05/23/2013 | US20130127068 Semiconductor device |
| 05/23/2013 | US20130127067 Through silicon via in n+ epitaxy wafers with reduced parasitic capacitance |
| 05/23/2013 | US20130127066 Integrated Circuit Including Interconnect Levels |
| 05/23/2013 | US20130127065 Cmut devices and fabrication methods |
| 05/23/2013 | US20130127064 Method and apparatus to improve reliability of vias |
| 05/23/2013 | US20130127063 Semiconductor device heat dissipation structure |
| 05/23/2013 | US20130127062 Multiple die face-down stacking for two or more die |
| 05/23/2013 | US20130127061 Integrated circuit package system |
| 05/23/2013 | US20130127060 Under bump passives in wafer level packaging |
| 05/23/2013 | US20130127059 Adjusting Sizes of Connectors of Package Components |
| 05/23/2013 | US20130127058 Liner-free tungsten contact |
| 05/23/2013 | US20130127057 Seed layer passivation |
| 05/23/2013 | US20130127056 Semiconductor devices including dual damascene metallization structures |
| 05/23/2013 | US20130127055 Mechanisms of forming damascene interconnect structures |
| 05/23/2013 | US20130127054 Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same |
| 05/23/2013 | US20130127053 Semiconductor package and semiconductor package module having the same |
| 05/23/2013 | US20130127052 Methods and Apparatus of Packaging Semiconductor Devices |
| 05/23/2013 | US20130127051 Window ball grid array (bga) semiconductor packages |
| 05/23/2013 | US20130127050 Semiconductor device and manufacturing method therefor |
| 05/23/2013 | US20130127049 Method for Stacking Devices and Structure Thereof |
| 05/23/2013 | US20130127048 Device |
| 05/23/2013 | US20130127047 Conductive structure and method for forming the same |
| 05/23/2013 | US20130127046 Reduced susceptibility to electrostatic discharge during 3d semiconductor device bonding and assembly |
| 05/23/2013 | US20130127045 Mechanisms for forming fine-pitch copper bump structures |
| 05/23/2013 | US20130127044 Micro surface mount device packaging |
| 05/23/2013 | US20130127043 Micro surface mount device packaging |
| 05/23/2013 | US20130127042 Semiconductor Device and Method of Forming Conductive Layer Over Substrate with Vents to Channel Bump Material and Reduce Interconnect Voids |
| 05/23/2013 | US20130127041 Ball grid array to pin grid array conversion |
| 05/23/2013 | US20130127040 Die carrier for package on package assembly |
| 05/23/2013 | US20130127039 Semiconductor Device and Method of Laser-Marking Laminate Layer Formed Over EWLB With Tape Applied to Opposite Surface |
| 05/23/2013 | US20130127038 Semiconductor device bonded by an anisotropic conductive film |
| 05/23/2013 | US20130127037 Semiconductor device built-in substrate |
| 05/23/2013 | US20130127036 Novel mechanism for mems bump side wall angle improvement |
| 05/23/2013 | US20130127035 Thick bond pad for chip with cavity package |
| 05/23/2013 | US20130127034 Semiconductor device |
| 05/23/2013 | US20130127033 Semiconductor device |
| 05/23/2013 | US20130127032 Semiconductor device and manufacturing method thereof |
| 05/23/2013 | US20130127031 Chip-carrier, a method for forming a chip-carrier and a method for forming a chip package |
| 05/23/2013 | US20130127030 Semiconductor device packaging having substrate with pre-encapsulation through via formation |
| 05/23/2013 | US20130127029 Two level leadframe with upset ball bonding surface and device package |
| 05/23/2013 | US20130127028 Three-dimensional integrated circuit having redundant relief structure for chip bonding section |
| 05/23/2013 | US20130127027 Pre-encapsulated lead frames for microelectronic device packages, and associated methods |
| 05/23/2013 | US20130127026 Connecting material, method for manufacturing connecting material and semiconductor device |
| 05/23/2013 | US20130127025 Semiconductor package and manufacturing method thereof |
| 05/23/2013 | US20130127024 Integrated circuit chips with fine-line metal and over-passivation metal |
| 05/23/2013 | US20130127021 Methods for adhering materials, for enhancing adhesion between materials, and for patterning materials, and related semiconductor device structures |
| 05/23/2013 | US20130127019 Semiconductor devices including through silicon via electrodes and methods of fabricating the same |
| 05/23/2013 | US20130127018 Semiconductor Device and Method of Forming Reconstituted Wafer with Larger Carrier to Achieve More EWLB Packages per Wafer with Encapsulant Deposited Under Temperature and Pressure |
| 05/23/2013 | US20130127014 Hermetic packaging of integrated circuit components |
| 05/23/2013 | US20130127010 Integrated circuit including a differential power amplifier with a single ended output and an integrated balun |
| 05/23/2013 | US20130127008 Thermally efficient integrated circuit package |
| 05/23/2013 | US20130126987 Physical quantity sensor and method of making the same |
| 05/23/2013 | US20130126973 Semiconductor device and method of manufacturing the same |
| 05/23/2013 | US20130126933 Electronic device contact structures |
| 05/23/2013 | US20130126916 Package for mounting electronic components, electronic apparatus, and method for manufacturing the package |
| 05/23/2013 | US20130126866 Semiconductor device and manufacturing method thereof |
| 05/23/2013 | US20130126591 Thermal Compress Bonding |
| 05/23/2013 | DE112007000175B4 Feldeffekttransistor eines Mehrfingertyps Field effect transistor of a multi-finger type |
| 05/23/2013 | DE102012111177A1 Chipträger, Verfahren zum Bilden eines Chipträgers und Verfahren zum Bilden eines Chipgehäuses Chip carrier, method of forming a chip carrier and method of forming a chip package |
| 05/23/2013 | DE102012110060A1 Making semiconductor structure, comprises forming first opening in dielectric layer, forming opening in dielectric material, forming seed layer within first opening, forming masking layer, and forming fill layer over seed layer |
| 05/23/2013 | DE102012100029B3 Arrangement for fixing computer processor on motherboard, has a socket head screw whose screw head has an internal thread cooperating with external thread of heat sink screw which is screwed in the internal thread of socket head screw |
| 05/23/2013 | DE102012003545A1 Unter-höcker-passivstrukturen bei wafer level packaging Under-bump-passive structures at wafer level packaging |
| 05/23/2013 | DE102011118932A1 Vorrichtung mit einem integrierten Schaltkreis Device having an integrated circuit |
| 05/23/2013 | DE102011086896A1 Electrical component used in electric circuit of electric control device for motor car, has circuit board with which deformable material is connected such that no particle of terminal pin is passed between material and circuit board |