| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/29/2013 | DE102012220715A1 Gitterebenen mit wechselnden Abständen für mehrschichtige Keramikpackungen Lattice planes with varying distances for multilayer ceramic packages |
| 05/29/2013 | DE102012206758B3 Method for manufacturing substrate for power semiconductor component such as MOSFET of power semiconductor module, involves performing galvanic isolation of metal film on broad strip conductor |
| 05/29/2013 | DE102012111520A1 Chipgehäuse und Verfahren zum Bilden eines Chipgehäuses Chip package and method of forming a chip package |
| 05/29/2013 | DE102011119755A1 Cooling device for cooling power electronic component, has cooling channel for guiding cooling fluid from inlet opening along interface to discharge opening, which is formed between displacement element and interfaces of heat sink |
| 05/29/2013 | DE102011119467A1 Solarzellenmodul und Konzentratormodul sowie deren Verwendung Solar cell module and concentrator and their use |
| 05/29/2013 | DE102005007373B4 Leistungshalbleiterbaugruppe Power semiconductor module |
| 05/29/2013 | CN202957250U MOS pipe sleeved by thermal shrinkable sleeve |
| 05/29/2013 | CN202957240U High-power double-tablet overlay packaged diode matrix type assembly |
| 05/29/2013 | CN202957239U Structure for detecting electric leakage of packaged chip |
| 05/29/2013 | CN202957238U 变压器 Transformer |
| 05/29/2013 | CN202957237U Chip encapsulation structure |
| 05/29/2013 | CN202957236U Residual gum removing flat pin structure of semiconductor device |
| 05/29/2013 | CN202957235U Solder anti-flowing device for material of surface mount diode |
| 05/29/2013 | CN202957234U High-strength material of surface mount diode |
| 05/29/2013 | CN202957233U 半导体结构 The semiconductor structure |
| 05/29/2013 | CN202957232U Fractal fin radiator |
| 05/29/2013 | CN202957231U Camera module group support and camera module group |
| 05/29/2013 | CN103125148A Connection terminal and circuit component |
| 05/29/2013 | CN103125021A Compensation for stress induced resistance variations |
| 05/29/2013 | CN103125020A Power routing with integrated decoupling capacitance |
| 05/29/2013 | CN103125019A Semiconductor package configured to electrically couple to printed circuit board and method of providing the same |
| 05/29/2013 | CN103123920A Electronic assembly apparatus and associated methods |
| 05/29/2013 | CN103123919A Low inductance power module |
| 05/29/2013 | CN103123918A Radio frequency semiconductor apparatus |
| 05/29/2013 | CN103123917A Conductive structure and method for forming the same |
| 05/29/2013 | CN103123916A Semiconductor device, electronic device, and semiconductor device manufacturing method |
| 05/29/2013 | CN103123915A Adjusting sizes of connectors of package components |
| 05/29/2013 | CN103123914A Novel water cooling head |
| 05/29/2013 | CN103123909A Aluminum interconnecting wire and preparation method thereof |
| 05/29/2013 | CN103123428A Thin film transistor (TFT)-liquid crystal display (LCD) array substrate and production method thereof |
| 05/29/2013 | CN103122221A Anisotropic conductive film with easy pre-bonding process |
| 05/29/2013 | CN103122124A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 05/29/2013 | CN103121799A Sputtering target, transparent conductive film and transparent conductive glass substrate |
| 05/29/2013 | CN102376601B Detection method and structure for deviation of contact hole |
| 05/29/2013 | CN102332434B Semiconductor structure and method of forming devices |
| 05/29/2013 | CN102214624B Semiconductor structure with through holes and manufacturing method thereof |
| 05/29/2013 | CN102208393B Semiconductor element and forming method thereof |
| 05/29/2013 | CN102194722B Organic electroluminescent display and detection method thereof |
| 05/29/2013 | CN102176238B Limiter and semiconductor device using the same |
| 05/29/2013 | CN102157496B Contact hole test device and method for testing leakage current of grid by active area contact hole |
| 05/29/2013 | CN102084482B Method of fabricating a semiconductor package or circuit assembly using a fluxing underfill composition applied to solder contact points in a dip process |
| 05/29/2013 | CN102083582B Au-Ga-In brazing filler metal |
| 05/29/2013 | CN102074534B Micro PCB radio frequency module and packaging method thereof |
| 05/29/2013 | CN102057482B Wiring board and liquid crystal display device |
| 05/29/2013 | CN102054761B Semiconductor structure and method for forming dual-damascene structure |
| 05/29/2013 | CN102047414B Power semiconductor circuit device and method for manufacturing the same |
| 05/29/2013 | CN102034834B Semiconductor device, electronic apparatus, and manufacturing methods thereof |
| 05/29/2013 | CN102033423B Device and method for calibrating photoetching tool |
| 05/29/2013 | CN102022707B Heat radiating device of light module |
| 05/29/2013 | CN101989555B Manufacturing method for molding image sensor package structure and image sensor package structure thereof |
| 05/29/2013 | CN101964308B Method of manufacturing semiconductor device, semiconductor device thus manufactured, and semiconductor manufacturing apparatus |
| 05/29/2013 | CN101901791B Die set for multi-packaging assembly and method for making the die set and the multi- packaging assembly |
| 05/29/2013 | CN101681963B 紫外线辐射发光二极管装置和流体处理系统 Ultraviolet radiation light emitting diode device and a fluid handling system |
| 05/29/2013 | CN101526200B LED illumination device and radiating member thereof |
| 05/29/2013 | CN101309577B Heat sink and method of making same |
| 05/29/2013 | CN101308864B Electro-luminescence device and method of manufacturing electro-luminescence device |
| 05/29/2013 | CN101286484B Semiconductor device and fabrication method |
| 05/29/2013 | CN101266953B Semiconductor device and manufacturing method thereof |
| 05/28/2013 | USRE44246 Method for containing a device and a corresponding device |
| 05/28/2013 | USRE44239 Electrode and its fabrication method for semiconductor devices, and sputtering target for forming electrode film for semiconductor devices |
| 05/28/2013 | US8450861 Integrated circuit device with semiconductor device components embedded in plastic housing composition |
| 05/28/2013 | US8450860 Power switch component having improved temperature distribution |
| 05/28/2013 | US8450859 Semiconductor device mounted structure and its manufacturing method |
| 05/28/2013 | US8450858 Method of manufacturing semiconductor device including wiring layout and semiconductor device |
| 05/28/2013 | US8450857 Through mold via polymer block package |
| 05/28/2013 | US8450856 Semiconductor device and method of forming the same |
| 05/28/2013 | US8450855 Semiconductor device |
| 05/28/2013 | US8450854 Interconnect structures with patternable low-k dielectrics and method of fabricating same |
| 05/28/2013 | US8450853 Semiconductor device and a method of manufacturing the same, and an electronic device |
| 05/28/2013 | US8450852 Wiring substrate |
| 05/28/2013 | US8450851 Display device and manufacturing method thereof |
| 05/28/2013 | US8450850 Thin-film transistor substrate and method of manufacturing the same |
| 05/28/2013 | US8450849 Robust FBEOL and UBM structure of C4 interconnects |
| 05/28/2013 | US8450848 Semiconductor device and method for fabricating the same |
| 05/28/2013 | US8450847 Optoelectronic semiconductor chip fitted with a carrier |
| 05/28/2013 | US8450846 Method and system for communicating via flip-chip die and package waveguides |
| 05/28/2013 | US8450845 Semiconductor device |
| 05/28/2013 | US8450844 Semiconductor package and method of manufacturing the same |
| 05/28/2013 | US8450843 Semiconductor device and method for designing the same |
| 05/28/2013 | US8450842 Structure and electronics device using the structure |
| 05/28/2013 | US8450841 Bonded wire semiconductor device |
| 05/28/2013 | US8450840 Ultra ruggedized ball grid array electronic components |
| 05/28/2013 | US8450839 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices |
| 05/28/2013 | US8450838 Electro-optic apparatus, electronic device, and method for manufacturing electro-optic apparatus |
| 05/28/2013 | US8450837 Circuit device having an improved heat dissipitation, and the method of manufacturing the same |
| 05/28/2013 | US8450836 Semiconductor device |
| 05/28/2013 | US8450825 Semiconductor package |
| 05/28/2013 | US8450816 Method for manufacturing a microelectromechanical component; and a microelectromechanical component |
| 05/28/2013 | US8450805 Compound semiconductor switch circuit device |
| 05/28/2013 | US8450801 Lateral-diffusion metal-oxide-semiconductor device |
| 05/28/2013 | US8450787 Nonvolatile semiconductor memory and method of manufacturing the same |
| 05/28/2013 | US8450779 Graphene based three-dimensional integrated circuit device |
| 05/28/2013 | US8450734 Semiconductor device and fabrication method for the same |
| 05/28/2013 | US8450202 Nanotube electronics templated self-assembly |
| 05/28/2013 | US8450201 Multimode signaling on decoupled input/output and power channels |
| 05/28/2013 | US8450183 Power semiconductor device and method of manufacturing the same |
| 05/28/2013 | US8450163 Semiconductor device comprising metal gates and semiconductor resistors formed on the basis of a replacement gate approach |
| 05/28/2013 | US8450157 Methods of manufacturing master, pixel array substrate and electro-optical device |
| 05/28/2013 | US8450153 Package manufacturing method and semiconductor device |
| 05/28/2013 | US8450151 Micro surface mount device packaging |