| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/05/2013 | CN103137236A Alloyed 2N copper wires for bonding in microelectronics devices |
| 06/05/2013 | CN103137235A Secondary alloyed 1N copper wires for bonding in microelectronics devices |
| 06/05/2013 | CN103135354A Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film |
| 06/05/2013 | CN103135337A Method and system of exposure of alignment mark |
| 06/05/2013 | CN103131355A Under-fill material and method for producing semiconductor device |
| 06/05/2013 | CN102446903B Component structure for detecting filling ability of pre-metal dielectric |
| 06/05/2013 | CN102433481B Preparation method of AlN-particle-reinforced copper composite heat sink material and thereof |
| 06/05/2013 | CN102386169B Electromigration test structure of silicon through hole metal interconnection wire |
| 06/05/2013 | CN102237341B Electrostatic discharge protection component and manufacturing method thereof |
| 06/05/2013 | CN102222661B Electrical alignment mark set and using method thereof |
| 06/05/2013 | CN102138213B 半导体装置 Semiconductor device |
| 06/05/2013 | CN102099912B Method and apparatus for forming i/o clusters in integrated circuits |
| 06/05/2013 | CN102034784B 28K lead frame |
| 06/05/2013 | CN101983223B Composition and method for production thereof, porous material and method for production thereof, interlayer insulating film, semiconductor material, semiconductor device, and low-refractive-index surface protection film |
| 06/05/2013 | CN101946304B Ultra high density capacity comprising pillar-shaped capacitors formed on both sides of a substrate |
| 06/05/2013 | CN101943335B Light-emitting diode lamp |
| 06/05/2013 | CN101919036B A semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding |
| 06/05/2013 | CN101897083B Anisotropic conductive joint package |
| 06/05/2013 | CN101866888B Heat radiation device |
| 06/05/2013 | CN101848623B Heat abstractor |
| 06/05/2013 | CN101841993B Dissipation device |
| 06/05/2013 | CN101835363B Heat-dissipating structure |
| 06/05/2013 | CN101772293B Radiating device |
| 06/05/2013 | CN101772292B Radiating device |
| 06/05/2013 | CN101771047B Semiconductor device having saddle fin transistor and method for fabricating the same |
| 06/05/2013 | CN101765353B Heat-dissipation module |
| 06/05/2013 | CN101754658B Radiating device |
| 06/05/2013 | CN101754649B Radiator and making method of radiating fins thereof |
| 06/05/2013 | CN101742890B Radiation device |
| 06/05/2013 | CN101742886B Radiation device, radiation system and method for radiation |
| 06/05/2013 | CN101742882B Radiation module |
| 06/05/2013 | CN101740490B Semiconductor apparatus manufacturing method and semiconductor apparatus |
| 06/05/2013 | CN101730450B Heat radiation device |
| 06/05/2013 | CN101730447B Heat dissipation device combination |
| 06/05/2013 | CN101730437B Radiation cooling system for temperature control of electronic equipment close to space vehicle |
| 06/05/2013 | CN101687284B Joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module |
| 06/05/2013 | CN101646330B Cooling device |
| 06/05/2013 | CN101593736B Semiconductor device and manufacturing method therefor |
| 06/05/2013 | CN101566325B Light-emitting diode lamp |
| 06/05/2013 | CN101556949B 半导体装置 Semiconductor device |
| 06/05/2013 | CN101553102B Heat radiating device, heat radiating device assembly and fixing device thereof |
| 06/05/2013 | CN101506971B Semiconductor component and assembly with projecting electrode |
| 06/05/2013 | CN101466231B Radiating device |
| 06/05/2013 | CN101307892B Large power LED lamp |
| 06/04/2013 | USRE44255 Support for microelectronic, microoptoelectronic or micromechanical devices |
| 06/04/2013 | USRE44251 Circuit board for mounting electronic parts |
| 06/04/2013 | US8456856 Integrated circuit chip using top post-passivation technology and bottom structure technology |
| 06/04/2013 | US8456817 Housing and method for making the same |
| 06/04/2013 | US8456395 Method for adjusting settings of a display panel |
| 06/04/2013 | US8456307 Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag |
| 06/04/2013 | US8456025 Semiconductor chip having staggered arrangement of bonding pads |
| 06/04/2013 | US8456024 Semiconductor device having a pad-disposition restriction area |
| 06/04/2013 | US8456022 Weldable contact and method for the production thereof |
| 06/04/2013 | US8456020 Semiconductor package and method of manufacturing the same |
| 06/04/2013 | US8456019 Semiconductor device |
| 06/04/2013 | US8456017 Filled through-silicon via with conductive composite material |
| 06/04/2013 | US8456016 Method and core materials for semiconductor packaging |
| 06/04/2013 | US8456014 Semiconductor device |
| 06/04/2013 | US8456013 Post passivation interconnection schemes on top of the IC chips |
| 06/04/2013 | US8456012 Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same |
| 06/04/2013 | US8456011 Method to control metal semiconductor micro-structure |
| 06/04/2013 | US8456010 Semiconductor device |
| 06/04/2013 | US8456008 Structure and process for the formation of TSVs |
| 06/04/2013 | US8456007 Chemical vapor deposition of titanium |
| 06/04/2013 | US8456005 Transparent conductive film and method for producing the same |
| 06/04/2013 | US8456004 Template wafer and process for small pitch flip-chip interconnect hybridization |
| 06/04/2013 | US8456002 Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief |
| 06/04/2013 | US8456000 Semiconductor module and an electronic system including the same |
| 06/04/2013 | US8455999 Method for reducing chip warpage |
| 06/04/2013 | US8455998 Method and package for circuit chip packaging |
| 06/04/2013 | US8455997 High power semiconductor device |
| 06/04/2013 | US8455996 Wafer level packaging method and a packaging structure using thereof |
| 06/04/2013 | US8455995 TSVs with different sizes in interposers for bonding dies |
| 06/04/2013 | US8455994 Electronic module with feed through conductor between wiring patterns |
| 06/04/2013 | US8455993 Integrated circuit packaging system with multiple row leads and method of manufacture thereof |
| 06/04/2013 | US8455992 Semiconductor package and method of fabricating the same |
| 06/04/2013 | US8455990 Systems and methods of tamper proof packaging of a semiconductor device |
| 06/04/2013 | US8455989 Package substrate having die pad with outer raised portion and interior recessed portion |
| 06/04/2013 | US8455988 Integrated circuit package system with bumped lead and nonbumped lead |
| 06/04/2013 | US8455987 Electrically isolated power semiconductor package with optimized layout |
| 06/04/2013 | US8455986 Mosfet package |
| 06/04/2013 | US8455984 Integrated circuit structure and method of forming the same |
| 06/04/2013 | US8455978 Semiconductor circuit structure and method of making the same |
| 06/04/2013 | US8455976 Semiconductor device and method of blowing fuse thereof |
| 06/04/2013 | US8455970 Lead frame assembly, package structure and LED package structure |
| 06/04/2013 | US8455936 Configurable memory sheet and package assembly |
| 06/04/2013 | US8455925 Semiconductor device and method for manufacturing the same |
| 06/04/2013 | US8455899 Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit |
| 06/04/2013 | US8455872 Electronic devices having plastic substrates |
| 06/04/2013 | US8455772 Open back junction box and method for pre-fab wiring |
| 06/04/2013 | US8455357 Method of plating through wafer vias in a wafer for 3D packaging |
| 06/04/2013 | US8455307 FINFET integrated circuits and methods for their fabrication |
| 06/04/2013 | US8455300 Integrated circuit package system with embedded die superstructure and method of manufacture thereof |
| 06/04/2013 | US8454845 High speed interconnect and method of manufacture |
| 06/04/2013 | US8453715 Synthetic jet embedded heat sink |
| 06/04/2013 | US8453323 Printed circuit board manufacturing method |
| 05/31/2013 | DE202013100427U1 Kühlkörper-Modul Heat sink module |
| 05/30/2013 | WO2013078323A1 Micro surface mount device packaging |
| 05/30/2013 | WO2013078260A1 Hold down for retaining a heat sink |
| 05/30/2013 | WO2013078069A1 3d non-volatile memory with metal silicide interconnect |