| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/05/2013 | EP2600516A1 Power converter |
| 06/05/2013 | EP2600404A2 GaN high voltage HFET with passivation plus gate dielectric multilayer structure |
| 06/05/2013 | EP2600399A2 Power semiconductor device |
| 06/05/2013 | EP2600398A1 Power semiconductor unit, power module, production method for power semiconductor unit and production method for power module |
| 06/05/2013 | EP2600397A1 Method for manufacturing interposer |
| 06/05/2013 | EP2600396A1 Component for accommodating electronic component, electronic module, and electronic device |
| 06/05/2013 | EP2600145A1 Conductive adhesive bond |
| 06/05/2013 | EP2599836A1 Curable composition for semiconductor encapsulation |
| 06/05/2013 | EP2599812A1 Curing resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material |
| 06/05/2013 | EP2599579A1 Method for manufacturing semiconductor device |
| 06/05/2013 | EP2599119A1 Compensation for stress induced resistance variations |
| 06/05/2013 | CN202979561U Heat radiation module and fasteners thereof |
| 06/05/2013 | CN202978690U Novel passive Crowbar SCR module |
| 06/05/2013 | CN202978271U Active filter with heat radiation function |
| 06/05/2013 | CN202977417U Carrier plate encapsulation structure with sensing device |
| 06/05/2013 | CN202977414U Sheet type switch clad tube |
| 06/05/2013 | CN202977413U Chip type difference clad pipe |
| 06/05/2013 | CN202977412U Semiconductor chip packaging structure |
| 06/05/2013 | CN202977411U Semiconductor chip packaging structure |
| 06/05/2013 | CN202977410U Semiconductor part |
| 06/05/2013 | CN202977409U Waterproof lead frame |
| 06/05/2013 | CN202977408U Lead wire support for light string IC packaging |
| 06/05/2013 | CN202977407U Semiconductor module |
| 06/05/2013 | CN202977406U A multi-wafer stacking encapsulating structure preventing wafer fracture caused by wire bonding |
| 06/05/2013 | CN202977405U Packaging structure |
| 06/05/2013 | CN202977404U Semiconductor device possessing silicon through hole structure |
| 06/05/2013 | CN202977403U Multi cell high power thyristor control electrode wire structure and thyristor |
| 06/05/2013 | CN202977402U Water cooling system for thyristor valve group |
| 06/05/2013 | CN202977401U Liquid-cooled heat dissipation module |
| 06/05/2013 | CN202977400U Power semiconductor module cooling device |
| 06/05/2013 | CN202977399U Microgroove column group heat sink |
| 06/05/2013 | CN202977398U Novel intelligent radiator |
| 06/05/2013 | CN202977397U PPTC surface mounting structure improvement |
| 06/05/2013 | CN202975946U Semiconductor water cooling CPU heat radiator |
| 06/05/2013 | CN202975550U Array substrate, liquid crystal panel and display device |
| 06/05/2013 | CN103141162A Composite build-up materials for embedding of active components |
| 06/05/2013 | CN103140929A Staggered thin film transistor and method of forming the same |
| 06/05/2013 | CN103140923A 半导体封装 The semiconductor package |
| 06/05/2013 | CN103140561A Phase change energy storage in ceramic nanotube composites |
| 06/05/2013 | CN103140121A Heat dissipation device and adaptor having same |
| 06/05/2013 | CN103140117A Heat dissipation module |
| 06/05/2013 | CN103140113A Multi-media refrigeration device |
| 06/05/2013 | CN103140027A Circuit board module, stack of circuit board module and manufacturing method thereof |
| 06/05/2013 | CN103137707A Composition of organic insulating layer and thin film transistor substrate and display device using the same |
| 06/05/2013 | CN103137613A Package substrate of active chip and preparation method thereof |
| 06/05/2013 | CN103137611A Crystal plate stacked structure and manufacturing method thereof |
| 06/05/2013 | CN103137610A Micro-heating device and forming method |
| 06/05/2013 | CN103137609A Integrated circuit package structure with electromagnetic shielding structure |
| 06/05/2013 | CN103137608A System-level encapsulation module part and manufacturing method thereof |
| 06/05/2013 | CN103137607A Conductor failure detection structure, a forming method, and a method of detecting failure time |
| 06/05/2013 | CN103137606A Resistance test structure and method |
| 06/05/2013 | CN103137605A Test structure and manufacturing method of monitoring leakage source polycrystalline silicon and pipe side wall stray capacitance |
| 06/05/2013 | CN103137604A Test structure of resistance penetrating through contacting holes of silicon wafer and test method |
| 06/05/2013 | CN103137603A Test structure and method for monitoring light dope injection stability under side walls of polycrystalline silicon |
| 06/05/2013 | CN103137602A Interposer and semiconductor package with noise suppression features |
| 06/05/2013 | CN103137601A Semiconductor device and method for manufacturing the same |
| 06/05/2013 | CN103137600A 变压器 Transformer |
| 06/05/2013 | CN103137599A Mechanisms of forming damascene interconnected structures |
| 06/05/2013 | CN103137598A Semiconductor device and manufacturing method thereof |
| 06/05/2013 | CN103137597A Semiconductor structure and method for manufacture same |
| 06/05/2013 | CN103137596A Bump structures for multi-chip packaging |
| 06/05/2013 | CN103137595A System-level encapsulation module part and manufacturing method thereof |
| 06/05/2013 | CN103137594A Novel semiconductor lead frame |
| 06/05/2013 | CN103137593A Lead frame for packaging integrated circuit and corresponding packaging components |
| 06/05/2013 | CN103137592A 半导体器件 Semiconductor devices |
| 06/05/2013 | CN103137591A Electronic device and a method for fabricating an electronic device |
| 06/05/2013 | CN103137590A Fastening device |
| 06/05/2013 | CN103137589A Package-on-package (PoP) structure and method |
| 06/05/2013 | CN103137588A Electrical connection structure |
| 06/05/2013 | CN103137587A Planarized bumps for underfill control |
| 06/05/2013 | CN103137586A Circuit connector apparatus and method therefor |
| 06/05/2013 | CN103137585A Mechanisms for forming fine-pitch copper bump structures |
| 06/05/2013 | CN103137584A Through silicon via (TSV) packaging structure of semiconductor chip and packaging method thereof |
| 06/05/2013 | CN103137583A Chip-on-wafer structures and methods for forming the same |
| 06/05/2013 | CN103137582A Bump-on-trace structures in packaging |
| 06/05/2013 | CN103137581A Electric conduction bulge-equipped semiconductor device, packaging structure and manufacture method |
| 06/05/2013 | CN103137580A Heat exchange apparatus |
| 06/05/2013 | CN103137579A Water-cooling heat dissipation substrate |
| 06/05/2013 | CN103137578A Semiconductor packages usable with a mobile device |
| 06/05/2013 | CN103137577A Thermoelectric cooling packages and thermal management methods thereof |
| 06/05/2013 | CN103137576A 功率半导体装置 Power semiconductor device |
| 06/05/2013 | CN103137575A Package for mounting electronic components, electronic apparatus, and method for manufacturing the package |
| 06/05/2013 | CN103137574A Semiconductor device and method for fabricating the same |
| 06/05/2013 | CN103137573A Power module package |
| 06/05/2013 | CN103137572A Chip-package and a method for forming a chip-package |
| 06/05/2013 | CN103137571A Semiconductor encapsulation structure and manufacturing method thereof |
| 06/05/2013 | CN103137570A Substrate structure, semiconductor package device, and manufacturing method of substrate structure |
| 06/05/2013 | CN103137569A Chip-carrier, a method for forming a chip-carrier and a method for forming a chip package |
| 06/05/2013 | CN103137568A Packaging substrate with support body and manufacturing method thereof |
| 06/05/2013 | CN103137567A Wafer structure for reducing damage of wafer cutting stress and layout design method |
| 06/05/2013 | CN103137566A Method for forming an integrated circuit |
| 06/05/2013 | CN103137561A Buried word line and method for forming buried word line |
| 06/05/2013 | CN103137553A Integrated circuits with electrical fuses and methods of forming the same |
| 06/05/2013 | CN103137549A Formation method of barrier layer and semiconductor device |
| 06/05/2013 | CN103137545A Semiconductor device and forming method thereof |
| 06/05/2013 | CN103137544A Semi-conductor chip structure and manufacture method of metal fuse in chip |
| 06/05/2013 | CN103137511A Silicon through-hole test structure and corresponding test method |
| 06/05/2013 | CN103137507A Manufacturing method of semiconductor structure and semiconductor structure manufactured by applying of manufacturing method |
| 06/05/2013 | CN103137498A Semiconductor package structure and manufacturing method thereof |
| 06/05/2013 | CN103137237A 3N copper wires with trace additions for bonding in microelectronics devices |