Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2013
06/11/2013US8461051 Cluster jet processing method, semiconductor element, microelectromechanical element, and optical component
06/11/2013US8461036 Multiple surface finishes for microelectronic package substrates
06/11/2013US8461021 Multiple seal ring structure
06/11/2013US8460971 Semiconductor device packaging structure and packaging method
06/11/2013US8459336 Heat dissipation device with guiding line and soldered heat pipe
06/11/2013US8459112 Systems and methods for three dimensional sensors
06/10/2013DE202012004532U1 Halbleiterschaltung mit elektrischen Anschlüssen mit mehrfacher Signal- oder Potentialbelegung Semiconductor circuit with electrical connections with multiple signal or potential availability
06/06/2013WO2013082194A1 Energy harvesting in integrated circuit packages
06/06/2013WO2013081698A1 Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device
06/06/2013WO2013081601A1 Method of fabricating a heat sink
06/06/2013WO2013081306A1 Lead frame and semiconductor package including the same
06/06/2013WO2013081156A1 Image pickup element housing package, and image pickup device
06/06/2013WO2013080759A1 Semiconductor device and method for manufacturing same
06/06/2013WO2013080732A1 One-pack type epoxy resin composition
06/06/2013WO2013080611A1 Heat exchanger and method for manufacturing same
06/06/2013WO2013080588A1 Structure for attaching diode
06/06/2013WO2013080584A1 Semiconductor device fabrication method
06/06/2013WO2013080560A1 Wireless module
06/06/2013WO2013080442A1 Power conversion device
06/06/2013WO2013080441A1 Power conversion device
06/06/2013WO2013080440A1 Power conversion device
06/06/2013WO2013080317A1 Semiconductor device, and on-board power conversion device
06/06/2013WO2013079335A1 Tag forgery protection
06/06/2013WO2013079011A1 Lead frame for encapsulating integrated circuit and corresponding encapsulation device
06/06/2013WO2013078844A1 Closed circulating water cooling apparatus and method
06/06/2013WO2013078843A1 Closed circulating water cooling apparatus and method therefor
06/06/2013WO2013078753A1 Barrel-plating quad flat no-lead(qfn) package structure and method for manufacturing the same
06/06/2013WO2013078752A1 No-exposed-pad quad flat no-lead (qfn) packaging structures and method for manufacturing the same
06/06/2013WO2013078751A1 No-exposed-pad ball grid array (bga) packaging structures and method for manufacturing the same
06/06/2013WO2013078750A1 First-plating-then-etching quad flat no-lead (qfn) packaging structures and method for manufacturing the same
06/06/2013WO2013078674A1 Tape substrate of chip-on-film structure of liquid crystal panel, and liquid crystal panel using the tape substrate
06/06/2013WO2013078572A1 High-voltage alternating current light-emitting diode structure
06/06/2013WO2013078538A1 Interposer for stacked semiconductor devices
06/06/2013WO2013055423A3 Method and design of an rf thru-via interconnect
06/06/2013WO2013013956A3 Layer composite composed of a layer arrangement and an electrical or electronic component
06/06/2013WO2012054335A8 Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
06/06/2013US20130143365 Resin Sealed Semiconductor Device And Manufacturing Method Therefor
06/06/2013US20130143361 Packaging Process Tools and Systems, and Packaging Methods for Semiconductor Devices
06/06/2013US20130141845 Module rail for photovoltaic system
06/06/2013US20130140720 Void free interlayer dielectric
06/06/2013US20130140719 Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers
06/06/2013US20130140718 Chip identification for organic laminate packaging and methods of manufacture
06/06/2013US20130140717 Semiconductor device
06/06/2013US20130140715 Integrated Circuit Having Stress Tuning Layer and Methods of Manufacturing Same
06/06/2013US20130140714 Semiconductor device
06/06/2013US20130140713 Interposer Wafer Bonding Method and Apparatus
06/06/2013US20130140712 Array Substrate, LCD Device, and Method for Manufacturing Array Substrate
06/06/2013US20130140711 Semiconductor device
06/06/2013US20130140710 Semiconductor device including a protective film
06/06/2013US20130140709 Semiconductor device and method of manufacturing the same
06/06/2013US20130140708 Semiconductor device and method of fabricating the same
06/06/2013US20130140707 Semiconductor device and layout design method for the same
06/06/2013US20130140706 UBM Structures for Wafer Level Chip Scale Packaging
06/06/2013US20130140705 Circuit connector apparatus and method therefor
06/06/2013US20130140704 Low Frequency CMUT with Thick Oxide
06/06/2013US20130140702 Fastening device
06/06/2013US20130140701 Solderable Contact and Passivation for Semiconductor Dies
06/06/2013US20130140700 Method of manufacturing a semiconductor device and semiconductor device
06/06/2013US20130140699 Semiconductor device and method for production of semiconductor device
06/06/2013US20130140698 Doped Tantalum Nitride for Copper Barrier Applications
06/06/2013US20130140697 Electrode Connecting Structures Containing Copper
06/06/2013US20130140696 Semiconductor device
06/06/2013US20130140695 Solder bump connections
06/06/2013US20130140694 Flip chip package utilizing trace bump trace interconnection
06/06/2013US20130140693 Method for forming an integrated circuit
06/06/2013US20130140692 Wiring substrate, manufacturing method of wiring substrate, and semiconductor package including wiring substrate
06/06/2013US20130140691 Semiconductor Device and Method of Forming Patterned Repassivation Openings Between RDL and UBM to Reduce Adverse Effects of Electro-Migration
06/06/2013US20130140690 TSV Structures and Methods for Forming the Same
06/06/2013US20130140689 Bump-on-Trace Structures in Packaging
06/06/2013US20130140688 Through Silicon Via and Method of Manufacturing the Same
06/06/2013US20130140687 Semiconductor device
06/06/2013US20130140686 Semiconductor package structure and manufacturing method thereof
06/06/2013US20130140685 Electronic Device and a Method for Fabricating an Electronic Device
06/06/2013US20130140684 Semiconductor Device Assembly Utilizing a DBC Substrate
06/06/2013US20130140683 Semiconductor Device and Method of Forming Cavity in Build-Up Interconnect Structure for Short Signal Path Between Die
06/06/2013US20130140681 Superfilled metal contact vias for semiconductor devices
06/06/2013US20130140680 Semiconductor device
06/06/2013US20130140673 Monolithic semiconductor switches and method for manufacturing
06/06/2013US20130140671 Compound semiconductor integrated circuit with three-dimensionally formed components
06/06/2013US20130140579 Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device
06/06/2013US20130140564 Electrical Test Structure for Devices Employing High-K Dielectrics or Metal Gates
06/06/2013US20130140563 Plating Process and Structure
06/06/2013US20130140057 Carbon Nanotube Contact Structures For Use With Semiconductor Dies And Other Electronic Devices
06/06/2013US20130139870 Pier connection sytem for pier caps of photovoltaic system
06/06/2013US20130139869 Clip fastener for photovoltaic system
06/06/2013DE112011102815T5 Verbindungsanschluss und Schaltungsbauteil Connection terminal and circuit component
06/06/2013DE102012220825A1 Verbesserung des polysilicium/metall- kontaktwiderstands in einem tiefen graben Dig improving the polysilicon / metal-contact resistor in a deep
06/06/2013DE102012111832A1 Integrierte Schaltung mit einem Leistungstransistor und einem Hilfstransistor Integrated circuit having a power transistor and an auxiliary transistor
06/06/2013DE102012111654A1 Elektronisches Bauelement und ein Verfahren zur Herstellung eines elektronischen Bauelements Electronic component and a method for manufacturing an electronic component
06/06/2013DE102012023503A1 Legierter 2N-Kupferdraht zum Bonden in Mikroelektronikgeräten Alloy 2N copper wire for bonding in microelectronic devices
06/06/2013DE102012023501A1 Sekundär legierter 1N-Kupferdraht zum Bonden in Mikroelektronikgeräten Secondary alloy 1N copper wire for bonding in microelectronic devices
06/06/2013DE102012023500A1 3N-Kupferdraht mit Spurenmengen von Zusatzstoffen zum Bonden in Mikroelektronikgeräten 3N copper wire with trace amounts of additives for bonding in microelectronic devices
06/06/2013DE102012023499A1 Dotierter 4N-Kupferdraht zum Bonden in Mikroelektronikgeräten Doped 4N copper wire for bonding in microelectronic devices
06/06/2013DE102011119957A1 Befestigungsvorrichtung Fastening device
06/06/2013DE102011119903A1 Method for cooling glow plug control device in motor car, involves connecting heat shunt with heat sink such that forced convection occurs for outward dissipation of heat by heat sink from housing using heat shunt
06/06/2013DE102011087709A1 Semiconductor device, has heat transfer body for transferring heat released from semiconductor units, where sides of device are surrounded by body and surface pressure is applied on lateral surface of portion of semiconductor units
06/06/2013DE102010020900C5 Verfahren zur Herstellung von Leistungshalbleitersubstraten A process for producing power semiconductor substrates
06/06/2013DE102004016399B4 Hochfrequenzmodul und Funkvorrichtung RF module and radio device
06/06/2013DE10120517B4 Elektrischer Vielschicht-Kaltleiter und Verfahren zu dessen Herstellung Electrical multilayer PTC thermistor and process for its preparation
06/05/2013EP2600525A2 Wireless communication device and semiconductor package device having a power amplifier therefor
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