| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/12/2013 | CN103151341A System-level packaging structure |
| 06/12/2013 | CN103151340A Antenna encapsulating module and manufacturing method thereof |
| 06/12/2013 | CN103151339A Capacitor structure and manufacturing method thereof |
| 06/12/2013 | CN103151338A Integrated circuit ground shielding structure |
| 06/12/2013 | CN103151337A Test probing structure |
| 06/12/2013 | CN103151336A Structure and manufacture method of circuit substrate |
| 06/12/2013 | CN103151335A Cobalt nitride layers for copper interconnects and methods for forming them |
| 06/12/2013 | CN103151334A Electroplating methods for fabricating integrated circuit devices and devices fabricated thereby |
| 06/12/2013 | CN103151333A Post-passivation interconnect structure |
| 06/12/2013 | CN103151332A ONO (SiO2-Si3N4-SiO2) antifuse unit structure and preparation method thereof |
| 06/12/2013 | CN103151331A Method of protecting against via failure and structure therefor |
| 06/12/2013 | CN103151330A Circuit board and circuit board manufacture method |
| 06/12/2013 | CN103151329A Passivation layer for packaged chip |
| 06/12/2013 | CN103151328A Semiconductor encapsulation element and manufacture method of semiconductor encapsulation element |
| 06/12/2013 | CN103151327A Semiconductor packaging piece and manufacturing method thereof |
| 06/12/2013 | CN103151326A Half-wave controllable full-wave bridge rectifier |
| 06/12/2013 | CN103151325A 半导体器件 Semiconductor devices |
| 06/12/2013 | CN103151324A Landing areas of bonding structures |
| 06/12/2013 | CN103151323A Flip packaging structure based on anisotropy conductive glue |
| 06/12/2013 | CN103151322A UBM structures for wafer level chip scale packaging |
| 06/12/2013 | CN103151321A Single heat pipe multi-path heat dissipation method and radiating tube |
| 06/12/2013 | CN103151320A Single loading mechanism to apply force to both cooling apparatus and integrated circuit package |
| 06/12/2013 | CN103151319A Fractal fin radiator |
| 06/12/2013 | CN103151318A Heat dissipation managing system and method between heating chip and shell in electronic equipment |
| 06/12/2013 | CN103151317A Semiconductor packaging structure and manufacturing method thereof |
| 06/12/2013 | CN103151299A Multilayer wiring aluminum interconnection technique method, aluminum wire interconnection through hole and semiconductor product |
| 06/12/2013 | CN103151274A Semiconductor component and manufacturing method thereof |
| 06/12/2013 | CN103151244A Stackable capacitor and manufacturing method thereof |
| 06/12/2013 | CN103151092A Conductive bonding material, electronic component, and electronic device |
| 06/12/2013 | CN103149753A Array substrate and fan-out line structure thereof |
| 06/12/2013 | CN103146139A Epoxy resin composition for electronic parts encapsulation and electronic parts-equipped device using the same |
| 06/12/2013 | CN102639643B Sealant for optical semiconductors and optical semiconductor device |
| 06/12/2013 | CN102412236B Layout structure for laterally diffused metal oxide semiconductor (LDMOS) array |
| 06/12/2013 | CN102376668B Flip chip package and semiconductor chip |
| 06/12/2013 | CN102337005B Resin composition, method of its composition, and cured formulation |
| 06/12/2013 | CN102323845B Trimming control circuit |
| 06/12/2013 | CN102306641B Storage module and packaging method |
| 06/12/2013 | CN102299142B Packaging structure with antenna and manufacturing method thereof |
| 06/12/2013 | CN102244051B High-performance directional heat conduction copper-base diamond composite material and preparation method thereof |
| 06/12/2013 | CN102244050B Heat radiator and manufacturing method thereof |
| 06/12/2013 | CN102237283B Flip-chip bonding method and flip-chip bonding construction of non-array bumps |
| 06/12/2013 | CN102214614B Chip package body |
| 06/12/2013 | CN102201385B QFN semiconductor package and fabricating method thereof |
| 06/12/2013 | CN102194759B Semiconductor element package, ring structure and method for manufacturing the semiconductor element package |
| 06/12/2013 | CN102142413B 半导体元件及其制法 Semiconductor components Jiqizhifa |
| 06/12/2013 | CN102122633B Method for manufacturing contact hole |
| 06/12/2013 | CN102044536B Photoelectric energy conversion device |
| 06/12/2013 | CN102017131B Die substrate with reinforcement structure |
| 06/12/2013 | CN102017105B Hermetically-sealed packages for electronic components having reduced unused areas |
| 06/12/2013 | CN101990709B Stacked power converter structure and method |
| 06/12/2013 | CN101960582B Wiring board, semiconductor device, and process for producing semiconductor device |
| 06/12/2013 | CN101930965B Structure of power grid for semiconductor devices and method of making the same |
| 06/12/2013 | CN101924080B Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module |
| 06/12/2013 | CN101877958B Electronic device having electromagnetic shielding and heat radiation and assembling method thereof |
| 06/12/2013 | CN101877341B Reworkable electronic device assembly and method |
| 06/12/2013 | CN101853826B Connection member and printed circuit board unit |
| 06/12/2013 | CN101841994B Portable electronic device and pluggable cooling device thereof |
| 06/12/2013 | CN101826489B Stress barrier structures for semiconductor chips |
| 06/12/2013 | CN101656243B Lead frame, resin package, semiconductor device and resin package manufacturing method |
| 06/12/2013 | CN101573716B Method and apparatus for making a radio frequency inlay |
| 06/12/2013 | CN101569018B A sealed photovoltaic apparatus |
| 06/12/2013 | CN101459172B 半导体器件 Semiconductor devices |
| 06/12/2013 | CN101221950B Resistor structure and its forming method |
| 06/12/2013 | CN101013707B 显示器件 Display Devices |
| 06/11/2013 | US8464107 Surrogate circuit for testing an interface |
| 06/11/2013 | US8463341 Superconducting element joint, a process for providing a superconducting element joint and a superconducting cable system |
| 06/11/2013 | US8462511 Stacked semiconductor package |
| 06/11/2013 | US8461699 Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device |
| 06/11/2013 | US8461698 PCB external ground plane via conductive coating |
| 06/11/2013 | US8461697 Semiconductor integrated circuit device |
| 06/11/2013 | US8461696 Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor package |
| 06/11/2013 | US8461695 Grain refinement by precipitate formation in Pb-free alloys of tin |
| 06/11/2013 | US8461694 Lead frame ball grid array with traces under die having interlocking features |
| 06/11/2013 | US8461693 Substrate arrangement |
| 06/11/2013 | US8461692 Semiconductor device structures including damascene trenches with conductive structures and related method |
| 06/11/2013 | US8461691 Chip-packaging module for a chip and a method for forming a chip-packaging module |
| 06/11/2013 | US8461689 Packaging structure having embedded semiconductor element |
| 06/11/2013 | US8461688 Semiconductor device and method of manufacturing the same |
| 06/11/2013 | US8461686 Post passivation interconnection schemes on top of IC chip |
| 06/11/2013 | US8461685 Substrate comprising a plurality of integrated circuitry die, and a substrate |
| 06/11/2013 | US8461684 Cobalt nitride layers for copper interconnects and methods for forming them |
| 06/11/2013 | US8461683 Self-forming, self-aligned barriers for back-end interconnects and methods of making same |
| 06/11/2013 | US8461682 Ruthenium silicide diffusion barrier layers and methods of forming same |
| 06/11/2013 | US8461681 Layered structure for corrosion resistant interconnect contacts |
| 06/11/2013 | US8461680 Integrated circuit packaging system with rounded interconnect |
| 06/11/2013 | US8461679 Method for fabricating circuit component |
| 06/11/2013 | US8461678 Structure with self aligned resist layer on an interconnect surface and method of making same |
| 06/11/2013 | US8461677 Magnetic field sensors and methods for fabricating the magnetic field sensors |
| 06/11/2013 | US8461676 Soldering relief method and semiconductor device employing same |
| 06/11/2013 | US8461675 Substrate panel with plating bar structured to allow minimum kerf width |
| 06/11/2013 | US8461674 Thermal plate with planar thermal zones for semiconductor processing |
| 06/11/2013 | US8461673 Edge connect wafer level stacking |
| 06/11/2013 | US8461672 Reconstituted wafer stack packaging with after-applied pad extensions |
| 06/11/2013 | US8461671 Miniature packaging for discrete circuit components |
| 06/11/2013 | US8461670 Semiconductor component and method of manufacture |
| 06/11/2013 | US8461669 Integrated power converter package with die stacking |
| 06/11/2013 | US8461667 Semiconductor device |
| 06/11/2013 | US8461666 Gallium nitride-based semiconductor device and method for manufacturing the same |
| 06/11/2013 | US8461589 Circuit having integrated heating structure for parametric trimming |
| 06/11/2013 | US8461588 In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit |