Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2013
06/13/2013US20130147025 Method of stacking flip-chip on wire-bonded chip
06/13/2013US20130147024 Balanced leadframe package structure and method of manufacturing the same
06/13/2013US20130147023 Integrated circuit ground shielding structure
06/13/2013US20130147020 Component Having a Via and Method for Manufacturing It
06/13/2013US20130147019 Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die
06/13/2013US20130147018 Structure for Reducing Integrated Circuit Corner Peeling
06/13/2013US20130147016 Semiconductor Package Having Internal Shunt and Solder Stop Dimples
06/13/2013US20130147013 Semiconductor device and method for manufacturing the same
06/13/2013US20130147011 Semiconductor device
06/13/2013US20130147010 Semiconductor device
06/13/2013US20130147009 Semiconductor device and method for manufacturing the same
06/13/2013US20130147008 Metal E-Fuse With Intermetallic Compound Programming Mechanism and Methods of Making Same
06/13/2013US20130146991 Device Including Two Power Semiconductor Chips and Manufacturing Thereof
06/13/2013US20130146961 Three dimensional semiconductor memory device and method of manufacturing the same
06/13/2013US20130146955 Electronic chip having channels through which a heat transport coolant can flow, electronic components and communication arm incorporating said chip
06/13/2013US20130146873 Integrated Mechanical Device for Electrical Switching
06/13/2013US20130146872 Semiconductor Device and Method of Forming Conductive Pillars Having Recesses or Protrusions to Detect Interconnect Continuity Between Semiconductor Die and Substrate
06/13/2013US20130146646 Semiconductor light-emitting apparatus and method of fabricating the same
06/13/2013US20130146549 Solar panel assembly kit and method of assembly
06/13/2013DE112011100491T5 Bonddraht aus Au-Legierung mit hoher Festigkeit und hoher Dehnungsrate Bonding wire made of Au-alloy with high strength and high strain rate
06/13/2013DE102012222651A1 Anchoring structure for metal structure of semiconductor device e.g. vertical power transistor, comprises anchoring recess structure comprising overhanging sidewall, which is formed by substrate of device having metal structure
06/13/2013DE102012219376A1 Halbleitervorrichtung mit lokalen Transistorverbindungsleitungen A semiconductor device having transistor local connection lines
06/13/2013DE102012219375A1 Halbleitervorrichtung mit lokalen Transistorverbindungsleitungen A semiconductor device having transistor local connection lines
06/13/2013DE102012201612B3 Kühlelement für Leistungshalbleiter-Bauelemente Cooling element for power semiconductor devices
06/13/2013DE102012111910A1 Halbleitervorrichtung, die ein erstes und ein zweites Halbleiterelement aufweist A semiconductor device comprising a first and a second semiconductor element
06/13/2013DE102012111831A1 Integrierte Schaltung und Verfahren zum Herstellen einer integrierten Schaltung Integrated circuit and method for fabricating an integrated circuit
06/13/2013DE102012111788A1 Vorrichtung mit zwei Leistungshalbleiterchips und Verfahren für ihre Herstellung Device with two power semiconductor chips and methods for their preparation
06/13/2013DE102012111702A1 Elektroplattierungs-Verfahren zum Herstellen von integrierten Halbleiterschaltungs-Vorrichtungen und damit hergestellte Vorrichtungen An electroplating method for producing semiconductor integrated circuit devices and devices produced thereby
06/13/2013DE102012022794A1 Hochfestes Kupferlegierungsblech mit hervorragendem Oxidfilmhaftvermögen High-strength copper alloy sheet with excellent Oxidfilmhaftvermögen
06/13/2013DE102011088418A1 Bond for forming connection between semiconductor component and metallic connector, has connector consisting of copper, where semiconductor component having metallization layer containing copper is formed at connector facing side
06/13/2013DE102011088218A1 Electronic power module for use in circuit module of e.g. engine control unit of motor car, has laminate comprising thermally conductive insulation sheet, where module lower side is fixed with copper strip conductor on laminate
06/13/2013DE102011088216A1 Motorsteuergerät mit Opferstruktur Engine control unit with sacrificial structure
06/13/2013DE102011088197A1 Method for manufacturing e.g. anisotropic magneto resistive effect sensor, involves assembling and contacting sensor chip on contacting surface of signal processing after signal processing chip is mounted on carrier frame
06/13/2013DE102011088043A1 Heat dissipation optimized package i.e. cup-shaped container, for integrated into transmission control unit of motor car, has heat sink comprising heat conductive material that exhibits better heat conductivity than insulative material
06/13/2013DE102011087886A1 Halbleiterleuchte Semiconductor light
06/13/2013DE102011056295A1 Epoxidharzsystem, Verwendung des Epoxidharzsystems, alterungsbeständiger Epoxidharzformstoff und Bauelement mit dem Epoxidharzformstoff Epoxy resin, using epoxy resin, epoxy resin molded and age-resistant component with the epoxy resin molded
06/13/2013DE102011004544B4 Schaltungsanordnung Circuitry
06/12/2013EP2602820A1 Solid-state image pickup device
06/12/2013EP2602819A1 Chip-packaging structure, packaging method and electronic device
06/12/2013EP2602818A1 An interposer device
06/12/2013EP2602289A2 Epoxy resin composition for electronic parts encapsulation and electronic parts-equipped device using the same
06/12/2013EP2601674A1 Vertical capacitors formed on semiconducting substrates
06/12/2013EP2601501A1 Systems and methods of coupling digitizing sensors to a structure
06/12/2013CN202996843U Novel solar diode assembly structure
06/12/2013CN202996833U Compound packaged IGBT device
06/12/2013CN202996831U Power electronic system possessing cooling device
06/12/2013CN202996830U 集成电路 IC
06/12/2013CN202996829U Wiring pin for silicon controlled rectifier radiating seat of water heater
06/12/2013CN202996828U Chip electromagnetic shielding structure
06/12/2013CN202996827U Wafer capable of realizing simultaneous test for multiple chip
06/12/2013CN202996826U 集成电路以及多芯片模块 Integrated circuits and multi-chip modules
06/12/2013CN202996825U Mini moulding packaging handset card
06/12/2013CN202996824U Minisize moulding packaging handset card framework and framework ribbon
06/12/2013CN202996823U Rewiring plane-array FCQFN package device
06/12/2013CN202996822U Lead frame
06/12/2013CN202996821U 半导体装置 Semiconductor device
06/12/2013CN202996820U Rewiring QFN package device
06/12/2013CN202996819U Rewiring thermally-enhanced AAQFN package device
06/12/2013CN202996818U Semiconductor device
06/12/2013CN202996817U Chip structure
06/12/2013CN202996816U Fixing device
06/12/2013CN202996815U Phase-controlled rectification power module based on thyristor
06/12/2013CN202996814U Heat-dissipation type semiconductor packaging structure
06/12/2013CN202996813U Increased safety type rotating diode module
06/12/2013CN202996812U Diode with three-layer medium passivation structure
06/12/2013CN202996811U Rewiring FCQFN package device
06/12/2013CN202996810U Rewiring multi-chip QFN package device
06/12/2013CN202996809U Rewiring AAQFN package device
06/12/2013CN202996808U Alumina ceramic substrate group
06/12/2013CN202996807U Insulated gate bipolar transistor installation structure
06/12/2013CN202996806U PPTC surface mounting structure
06/12/2013CN202996805U Stretching formed chip box with good welding performance
06/12/2013CN202996248U AMOLED (active matrix/organic light emitting diode) pixel drive circuit and capacitor structure thereof
06/12/2013CN202993946U Micro conical tower array heat exchange plate
06/12/2013CN1667801B Semiconductor device and manufacturing method for same
06/12/2013CN103155735A Cooling structure
06/12/2013CN103155722A Method for dividing a large substrate into smaller ones and method for controllably selectively depositing a sealant material
06/12/2013CN103155310A Semiconductor laser device
06/12/2013CN103155183A Light emitting device with reduced epi stress
06/12/2013CN103155149A Shield-modulated tunable inductor device
06/12/2013CN103155148A Bi-directional back-to-back stacked SCR for high-voltage pin ESD protection, methods of manufacture and design structures
06/12/2013CN103155145A Method and apparatus for improving substrate warpage
06/12/2013CN103155144A Electronic module and method for producing same
06/12/2013CN103155143A Waterfall wire bonding
06/12/2013CN103155142A Cooling device
06/12/2013CN103155141A Mounting board and mounting structure thereof
06/12/2013CN103155140A Disaster resistant server enclosure with cold thermal storage device and server cooling device
06/12/2013CN103155131A Semiconductor module and method of manufacturing a semiconductor module
06/12/2013CN103155115A Method for producing semiconductor device
06/12/2013CN103155109A Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device
06/12/2013CN103155098A 3D via capacitor with a floating conductive plate for improved reliability
06/12/2013CN103154144A Curable polyorganosiloxane composition
06/12/2013CN103154090A Epoxy silicone condensate, curable composition comprising epoxy silicone condensate, and cured product thereof
06/12/2013CN103154073A 固化性环氧树脂组合物 Curable epoxy resin composition
06/12/2013CN103154072A 固化性环氧树脂组合物 Curable epoxy resin composition
06/12/2013CN103153453A Dispensable polymeric precursor composition for transparent composite sorber materials
06/12/2013CN103152974A Printed circuit board using metal circuit sheets and electronic packaging module of printed circuit board
06/12/2013CN103151393A Electrode structure of PIN diode
06/12/2013CN103151348A Integrated circuit including a power transistor and an auxiliary transistor
06/12/2013CN103151342A VMOS (V-groove Metal Oxide Semiconductor) mixed membrane integrated chip for driving multiple paths of valves
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