| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/03/2015 | US8946904 Substrate vias for heat removal from semiconductor die |
| 02/03/2015 | US8946903 Electrically conductive laminate structure containing graphene region |
| 02/03/2015 | US8946902 Device and method for manufacturing a device |
| 02/03/2015 | US8946901 Microelectronic package and method of manufacture thereof |
| 02/03/2015 | US8946900 X-line routing for dense multi-chip-package interconnects |
| 02/03/2015 | US8946899 Via in substrate with deposited layer |
| 02/03/2015 | US8946898 Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus |
| 02/03/2015 | US8946897 Semiconductor device having metal lines with slits |
| 02/03/2015 | US8946896 Extended liner for localized thick copper interconnect |
| 02/03/2015 | US8946895 Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus |
| 02/03/2015 | US8946894 Package for high-power semiconductor devices |
| 02/03/2015 | US8946893 Apparatus for dicing interposer assembly |
| 02/03/2015 | US8946892 Semiconductor package |
| 02/03/2015 | US8946891 Mushroom shaped bump on repassivation |
| 02/03/2015 | US8946890 Power/ground layout for chips |
| 02/03/2015 | US8946889 Semiconductor module with cooling mechanism and production method thereof |
| 02/03/2015 | US8946888 Package on packaging structure and methods of making same |
| 02/03/2015 | US8946887 3DIC packages with heat dissipation structures |
| 02/03/2015 | US8946886 Shielded electronic component package and method |
| 02/03/2015 | US8946885 Semiconductor arrangement and method for producing a semiconductor arrangement |
| 02/03/2015 | US8946884 Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) product |
| 02/03/2015 | US8946883 Wafer level fan-out package with a fiducial die |
| 02/03/2015 | US8946882 Semiconductor module and semiconductor device |
| 02/03/2015 | US8946881 High-voltage packaged device |
| 02/03/2015 | US8946880 Packaged semiconductor device having multilevel leadframes configured as modules |
| 02/03/2015 | US8946879 Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die |
| 02/03/2015 | US8946878 Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor |
| 02/03/2015 | US8946877 Semiconductor package including cap |
| 02/03/2015 | US8946876 Semiconductor device |
| 02/03/2015 | US8946875 Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems |
| 02/03/2015 | US8946874 IC in-process solution to reduce thermal neutrons soft error rate |
| 02/03/2015 | US8946873 Redistribution structures for microfeature workpieces |
| 02/03/2015 | US8946871 Thermal improvement of integrated circuit packages |
| 02/03/2015 | US8946870 Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die |
| 02/03/2015 | US8946869 Integrated circuit for detecting defects of through chip via |
| 02/03/2015 | US8946868 Multiple die layout for facilitating the combining of an individual die into a single die |
| 02/03/2015 | US8946864 Systems and methods for preparing films comprising metal using sequential ion implantation, and films formed using same |
| 02/03/2015 | US8946859 Device for detecting an attack in an integrated circuit chip |
| 02/03/2015 | US8946857 Semiconductor device for effectively disperse heat generated from heat generating device |
| 02/03/2015 | US8946854 Metal-insulator-metal capacitor structure and method for manufacturing the same |
| 02/03/2015 | US8946852 Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or photosensitive resin composition film |
| 02/03/2015 | US8946851 Integrated MOS power transistor with thin gate oxide and low gate charge |
| 02/03/2015 | US8946825 Integrated circuit structure to resolve deep-well plasma charging problem and method of forming the same |
| 02/03/2015 | US8946824 Semiconductor device |
| 02/03/2015 | US8946823 Electrostatic discharge protection element and electrostatic discharge protection chip and method of producing the same |
| 02/03/2015 | US8946822 Apparatus and method for protection of precision mixed-signal electronic circuits |
| 02/03/2015 | US8946778 Active area shaping of III-nitride devices utilizing steps of source-side and drain-side field plates |
| 02/03/2015 | US8946770 Semiconductor device with output circuit and pad |
| 02/03/2015 | US8946767 Monolithic semiconductor switches and method for manufacturing |
| 02/03/2015 | US8946765 Gallium nitride devices |
| 02/03/2015 | US8946763 Semiconductor light-emitting device |
| 02/03/2015 | US8946757 Heat spreading substrate with embedded interconnects |
| 02/03/2015 | US8946746 Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same |
| 02/03/2015 | US8946742 Semiconductor package with through silicon vias |
| 02/03/2015 | US8946718 Semiconductor element and display device using the same |
| 02/03/2015 | US8946717 Semiconductor element and display device using the same |
| 02/03/2015 | US8946706 Test pattern of semiconductor device, method of manufacturing test pattern and method of testing semiconductor device by using test pattern |
| 02/03/2015 | US8946705 Semiconductor device |
| 02/03/2015 | US8946692 Graphene (multilayer) boron nitride heteroepitaxy for electronic device applications |
| 02/03/2015 | US8946668 Semiconductor device and method of manufacturing the same |
| 02/03/2015 | US8946665 Semiconductor devices and methods of fabricating the same |
| 02/03/2015 | US8946663 Soft error resistant circuitry |
| 02/03/2015 | US8946610 Semiconductor image sensor module and method of manufacturing the same |
| 02/03/2015 | US8946567 Power module, power converter device, and electrically powered vehicle |
| 02/03/2015 | US8946566 Heterogeneous encapsulation |
| 02/03/2015 | US8946564 Packaging substrate having embedded through-via interposer and method of fabricating the same |
| 02/03/2015 | US8946563 Module with exposed parts of copper foil and process for production thereof |
| 02/03/2015 | US8946371 Photo-patternable dielectric materials curable to porous dielectric materials, formulations, precursors and methods of use thereof |
| 02/03/2015 | US8946357 Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor |
| 02/03/2015 | US8946353 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device |
| 02/03/2015 | US8946350 Curable composition |
| 02/03/2015 | US8946083 In-situ formation of silicon and tantalum containing barrier |
| 02/03/2015 | US8946079 Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof |
| 02/03/2015 | US8946074 Method of making interconnect structure |
| 02/03/2015 | US8946072 No-flow underfill for package with interposer frame |
| 02/03/2015 | US8946025 Manufacturing method of thin film and metal line for display using the same, thin film transistor array panel, and method for manufacturing the same |
| 02/03/2015 | US8946019 Semiconductor device comprising a buried capacitor formed in the contact level |
| 02/03/2015 | US8946000 Method for forming an integrated circuit having a programmable fuse |
| 02/03/2015 | US8945998 Programmable semiconductor interposer for electronic package and method of forming |
| 02/03/2015 | US8945996 Methods of forming circuitry components and methods of forming an array of memory cells |
| 02/03/2015 | US8945995 Copper post solder bumps on substrates |
| 02/03/2015 | US8945994 Single layer coreless substrate |
| 02/03/2015 | US8945993 Method of manufacturing a ball grid array substrate or a semiconductor chip package |
| 02/03/2015 | US8945992 Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package |
| 02/03/2015 | US8945989 Stiffened semiconductor die package |
| 02/03/2015 | US8945988 Method for thinning, metalizing, and dicing a semiconductor wafer and, semiconductor device made using the method |
| 02/03/2015 | US8945987 Manufacture of face-down microelectronic packages |
| 02/03/2015 | US8945986 Electronic assembly with three dimensional inkjet printed traces |
| 02/03/2015 | US8945985 Semiconductor package and method of manufacturing the same |
| 02/03/2015 | US8945984 Bump-on-trace methods and structures in packaging |
| 02/03/2015 | US8945983 System and method to improve package and 3DIC yield in underfill process |
| 02/03/2015 | US8945966 Method for manufacturing semiconductor devices having gallium nitride epilayers on diamond substrates using intermediate nucleating layer |
| 02/03/2015 | US8945951 Lead frame and manufacturing method thereof |
| 02/03/2015 | US8945466 Composite material for heat dissipating plate and method of production of same |
| 02/03/2015 | US8945336 Wiring substrate and semiconductor device |
| 02/03/2015 | US8944335 Wireless IC device |
| 02/03/2015 | US8944310 Method of manufacturing a semiconductor device |
| 02/03/2015 | US8944151 Method and apparatus for chip cooling |
| 02/03/2015 | US8944150 Dissipation utilizing flow of refrigerant |
| 02/03/2015 | US8944149 Heat dissipation device with fastener and flange |