Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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06/19/2013 | CN103165581A Test structures, methods of manufacturing thereof, test methods, and mram arrays |
06/19/2013 | CN103165580A Metal coil and current detection structure |
06/19/2013 | CN103165579A Monitoring structure and monitoring method for silicon wet etching depth |
06/19/2013 | CN103165578A Test component used in complementary metal-oxide-semiconductor transistor (CMOS) component and manufacture method and using method thereof |
06/19/2013 | CN103165577A Semiconductor detection structure and detection method |
06/19/2013 | CN103165576A Semiconductor device and manufacturing method of the same |
06/19/2013 | CN103165575A Semiconductor device with transistor local interconnects |
06/19/2013 | CN103165574A Integrated circuit and method of forming an integrated circuit |
06/19/2013 | CN103165573A Vertical parasitic PNP device in Bipolar CMOS (BiCMOS) technology and manufacturing method thereof |
06/19/2013 | CN103165572A Anti-fuses on semiconductor fins |
06/19/2013 | CN103165571A Novel silicon substrate low resistance inductance structure and wafer level encapsulating method thereof |
06/19/2013 | CN103165570A Semiconductor device with transistor local interconnects |
06/19/2013 | CN103165569A Hermetic semiconductor package structure and method for manufacturing the same |
06/19/2013 | CN103165568A Structure of passive component |
06/19/2013 | CN103165567A Inductors with through vias |
06/19/2013 | CN103165566A Substrate structure, semiconductor package device, and manufacturing method of semiconductor package |
06/19/2013 | CN103165565A 半导体器件 Semiconductor devices |
06/19/2013 | CN103165564A Chip card contact array arrangement |
06/19/2013 | CN103165563A Semiconductor packaging piece and producing method thereof |
06/19/2013 | CN103165562A Packaged leadless semiconductor device |
06/19/2013 | CN103165561A Encapsulation structure of silicon substrate pinboard |
06/19/2013 | CN103165560A Substrate and semiconductor structure applying the same |
06/19/2013 | CN103165559A Tin-based solder ball and semiconductor package including the same |
06/19/2013 | CN103165558A Package structure and the method to manufacture thereof |
06/19/2013 | CN103165557A 半导体装置 Semiconductor device |
06/19/2013 | CN103165556A Semiconductor device, semiconductor device manufacturing method, and electronic device |
06/19/2013 | CN103165555A Stack package structure and fabrication method thereof |
06/19/2013 | CN103165554A Grid array land grid array (LGA) sealing module |
06/19/2013 | CN103165553A Semiconductor wafer and semiconductor sealing structure |
06/19/2013 | CN103165552A Semiconductor device package |
06/19/2013 | CN103165551A Semiconductor package and fabrication method thereof |
06/19/2013 | CN103165550A Semiconductor structure |
06/19/2013 | CN103165549A 半导体封装 The semiconductor package |
06/19/2013 | CN103165548A 散热器 Heat sink |
06/19/2013 | CN103165547A Microgroove group composite phase change radiator |
06/19/2013 | CN103165546A Super-power brushless motor control actuating arm module |
06/19/2013 | CN103165545A Chip package and method for forming the same |
06/19/2013 | CN103165544A Laminated sheet and method of manufacturing semiconductor device using the laminated sheet |
06/19/2013 | CN103165543A Semiconductor element and manufacture method thereof and sealing structure thereof |
06/19/2013 | CN103165542A Chip back coating in flip chip package |
06/19/2013 | CN103165541A Joint method of chip and wafer, and three-dimensional integrated semiconductor device |
06/19/2013 | CN103165531A Die structure and method of fabrication thereof |
06/19/2013 | CN103165522A Semiconductor structure and forming method of semiconductor structure |
06/19/2013 | CN103165518A Manufacturing method of interconnected structure |
06/19/2013 | CN103165514A Semiconductor structure and forming method thereof |
06/19/2013 | CN103165505A Methods of fabricating fan-out wafer level packages and packages formed by the methods |
06/19/2013 | CN103165484A Stacked package and manufacturing method thereof |
06/19/2013 | CN103165481A Bump manufacture technology and structure thereof |
06/19/2013 | CN103165480A Preparation method for flip chip salient point |
06/19/2013 | CN103165477A Method for forming vertical interconnect structure and semiconductor device |
06/19/2013 | CN103165476A Integrated circuit package and packaging method |
06/19/2013 | CN103165472A Fiber channel (FC)-ball grid array (BGA) packaging bump distributed heat dissipation novel method |
06/19/2013 | CN103165306A Electric tool switch with metal oxide semiconductor (MOS) transistor |
06/19/2013 | CN103165027A Transparent light-emitting diode (LED) display screen and application thereof |
06/19/2013 | CN103160238A Adhesive composition, film-like adhesive, adhesive sheet, connection structure and method for producing connection structure |
06/19/2013 | CN103160237A Adhesive composition, film-like adhesive, adhesive sheet and connection structure |
06/19/2013 | CN103160221A Anisotropic conductive film and semiconductor device bonded by the same |
06/19/2013 | CN103160220A Adhesive film and electronic device including the same |
06/19/2013 | CN103160219A Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same |
06/19/2013 | CN103160218A Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device |
06/19/2013 | CN103160217A Anisotropic conductive film composition, the anisotropic conductive film thereof and semiconductor device |
06/19/2013 | CN103160216A Anisotropic conductive film and semiconductor device |
06/19/2013 | CN103160076A Sheet-shaped epoxy resin composition for encapsulating electronic components and electronic component device using the same |
06/19/2013 | CN102449034B Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductor |
06/19/2013 | CN102376678B Chip scale package and manufacturing method thereof |
06/19/2013 | CN102368482B High-efficiency heat sink of porous metal structure |
06/19/2013 | CN102356014B Heat sink |
06/19/2013 | CN102339814B Method and structure for testing metal-oxide-semiconductor field-effect transistor (MOSFET) |
06/19/2013 | CN102280439B Internally matching network for microwave power transistor and manufacturing method of internally matching network |
06/19/2013 | CN102194821B Three-dimensional storing array with improved serial selection line and bit line contact distribution |
06/19/2013 | CN102184903B Encapsulated semiconductor chip and manufacturing method of through holes thereof |
06/19/2013 | CN102176452B High-density chip system-in-package structure |
06/19/2013 | CN102176440B Improved addressable test chip arranged in scribing slot and manufacturing method thereof |
06/19/2013 | CN102142412B Input/output pad circuit having electrostatic discharge tolerance and comprising encircling well |
06/19/2013 | CN102082143B Figure filler structure inserted about inductor |
06/19/2013 | CN102056452B Heat radiator device and module using same |
06/19/2013 | CN102024810B Integrated circuit and electronic apparatus |
06/19/2013 | CN102024803B 功率模块 Power Modules |
06/19/2013 | CN102017112B Electrical bond connection arrangement |
06/19/2013 | CN101971486B Semiconductor device, and communication apparatus and electronic apparatus provided with semiconductor device |
06/19/2013 | CN101908517B Bonding pad, manufacturing method and bonding method thereof |
06/19/2013 | CN101807651B Light emitting device package |
06/19/2013 | CN101777548B Substrate with built-in chip and manufacturing method thereof |
06/19/2013 | CN101752208B Semiconductor high-voltage terminal structure and production method thereof |
06/19/2013 | CN101674715B Device and method for radiating |
06/19/2013 | CN101615620B Semiconductor device and electronic device |
06/19/2013 | CN101582398B Ball-bump bonded ribbon-wire interconnect |
06/19/2013 | CN101521169B Semiconductor device and a method of manufacturing the same |
06/19/2013 | CN101359660B Semiconductor apparatus with thin semiconductor film |
06/19/2013 | CN101083234B Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use |
06/18/2013 | USRE44303 Passivation layer for a circuit device and method of manufacture |
06/18/2013 | US8466997 Fan-out wafer level package for an optical sensor and method of manufacture thereof |
06/18/2013 | US8466569 Increasing exposure tool alignment signal strength for a ferroelectric capacitor layer |
06/18/2013 | US8466568 Multi-component device integrated into a matrix |
06/18/2013 | US8466567 Integrated circuit packaging system with stack interconnect and method of manufacture thereof |
06/18/2013 | US8466566 Semiconductor device, method for manufacturing of semiconductor device, and switching circuit |
06/18/2013 | US8466565 Substrate and semiconductor device |
06/18/2013 | US8466564 Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution |
06/18/2013 | US8466563 Apparatus and methods for 3-D stacking of thinned die |
06/18/2013 | US8466562 Layered chip package |