Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2013
06/19/2013CN103165581A Test structures, methods of manufacturing thereof, test methods, and mram arrays
06/19/2013CN103165580A Metal coil and current detection structure
06/19/2013CN103165579A Monitoring structure and monitoring method for silicon wet etching depth
06/19/2013CN103165578A Test component used in complementary metal-oxide-semiconductor transistor (CMOS) component and manufacture method and using method thereof
06/19/2013CN103165577A Semiconductor detection structure and detection method
06/19/2013CN103165576A Semiconductor device and manufacturing method of the same
06/19/2013CN103165575A Semiconductor device with transistor local interconnects
06/19/2013CN103165574A Integrated circuit and method of forming an integrated circuit
06/19/2013CN103165573A Vertical parasitic PNP device in Bipolar CMOS (BiCMOS) technology and manufacturing method thereof
06/19/2013CN103165572A Anti-fuses on semiconductor fins
06/19/2013CN103165571A Novel silicon substrate low resistance inductance structure and wafer level encapsulating method thereof
06/19/2013CN103165570A Semiconductor device with transistor local interconnects
06/19/2013CN103165569A Hermetic semiconductor package structure and method for manufacturing the same
06/19/2013CN103165568A Structure of passive component
06/19/2013CN103165567A Inductors with through vias
06/19/2013CN103165566A Substrate structure, semiconductor package device, and manufacturing method of semiconductor package
06/19/2013CN103165565A 半导体器件 Semiconductor devices
06/19/2013CN103165564A Chip card contact array arrangement
06/19/2013CN103165563A Semiconductor packaging piece and producing method thereof
06/19/2013CN103165562A Packaged leadless semiconductor device
06/19/2013CN103165561A Encapsulation structure of silicon substrate pinboard
06/19/2013CN103165560A Substrate and semiconductor structure applying the same
06/19/2013CN103165559A Tin-based solder ball and semiconductor package including the same
06/19/2013CN103165558A Package structure and the method to manufacture thereof
06/19/2013CN103165557A 半导体装置 Semiconductor device
06/19/2013CN103165556A Semiconductor device, semiconductor device manufacturing method, and electronic device
06/19/2013CN103165555A Stack package structure and fabrication method thereof
06/19/2013CN103165554A Grid array land grid array (LGA) sealing module
06/19/2013CN103165553A Semiconductor wafer and semiconductor sealing structure
06/19/2013CN103165552A Semiconductor device package
06/19/2013CN103165551A Semiconductor package and fabrication method thereof
06/19/2013CN103165550A Semiconductor structure
06/19/2013CN103165549A 半导体封装 The semiconductor package
06/19/2013CN103165548A 散热器 Heat sink
06/19/2013CN103165547A Microgroove group composite phase change radiator
06/19/2013CN103165546A Super-power brushless motor control actuating arm module
06/19/2013CN103165545A Chip package and method for forming the same
06/19/2013CN103165544A Laminated sheet and method of manufacturing semiconductor device using the laminated sheet
06/19/2013CN103165543A Semiconductor element and manufacture method thereof and sealing structure thereof
06/19/2013CN103165542A Chip back coating in flip chip package
06/19/2013CN103165541A Joint method of chip and wafer, and three-dimensional integrated semiconductor device
06/19/2013CN103165531A Die structure and method of fabrication thereof
06/19/2013CN103165522A Semiconductor structure and forming method of semiconductor structure
06/19/2013CN103165518A Manufacturing method of interconnected structure
06/19/2013CN103165514A Semiconductor structure and forming method thereof
06/19/2013CN103165505A Methods of fabricating fan-out wafer level packages and packages formed by the methods
06/19/2013CN103165484A Stacked package and manufacturing method thereof
06/19/2013CN103165481A Bump manufacture technology and structure thereof
06/19/2013CN103165480A Preparation method for flip chip salient point
06/19/2013CN103165477A Method for forming vertical interconnect structure and semiconductor device
06/19/2013CN103165476A Integrated circuit package and packaging method
06/19/2013CN103165472A Fiber channel (FC)-ball grid array (BGA) packaging bump distributed heat dissipation novel method
06/19/2013CN103165306A Electric tool switch with metal oxide semiconductor (MOS) transistor
06/19/2013CN103165027A Transparent light-emitting diode (LED) display screen and application thereof
06/19/2013CN103160238A Adhesive composition, film-like adhesive, adhesive sheet, connection structure and method for producing connection structure
06/19/2013CN103160237A Adhesive composition, film-like adhesive, adhesive sheet and connection structure
06/19/2013CN103160221A Anisotropic conductive film and semiconductor device bonded by the same
06/19/2013CN103160220A Adhesive film and electronic device including the same
06/19/2013CN103160219A Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same
06/19/2013CN103160218A Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device
06/19/2013CN103160217A Anisotropic conductive film composition, the anisotropic conductive film thereof and semiconductor device
06/19/2013CN103160216A Anisotropic conductive film and semiconductor device
06/19/2013CN103160076A Sheet-shaped epoxy resin composition for encapsulating electronic components and electronic component device using the same
06/19/2013CN102449034B Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductor
06/19/2013CN102376678B Chip scale package and manufacturing method thereof
06/19/2013CN102368482B High-efficiency heat sink of porous metal structure
06/19/2013CN102356014B Heat sink
06/19/2013CN102339814B Method and structure for testing metal-oxide-semiconductor field-effect transistor (MOSFET)
06/19/2013CN102280439B Internally matching network for microwave power transistor and manufacturing method of internally matching network
06/19/2013CN102194821B Three-dimensional storing array with improved serial selection line and bit line contact distribution
06/19/2013CN102184903B Encapsulated semiconductor chip and manufacturing method of through holes thereof
06/19/2013CN102176452B High-density chip system-in-package structure
06/19/2013CN102176440B Improved addressable test chip arranged in scribing slot and manufacturing method thereof
06/19/2013CN102142412B Input/output pad circuit having electrostatic discharge tolerance and comprising encircling well
06/19/2013CN102082143B Figure filler structure inserted about inductor
06/19/2013CN102056452B Heat radiator device and module using same
06/19/2013CN102024810B Integrated circuit and electronic apparatus
06/19/2013CN102024803B 功率模块 Power Modules
06/19/2013CN102017112B Electrical bond connection arrangement
06/19/2013CN101971486B Semiconductor device, and communication apparatus and electronic apparatus provided with semiconductor device
06/19/2013CN101908517B Bonding pad, manufacturing method and bonding method thereof
06/19/2013CN101807651B Light emitting device package
06/19/2013CN101777548B Substrate with built-in chip and manufacturing method thereof
06/19/2013CN101752208B Semiconductor high-voltage terminal structure and production method thereof
06/19/2013CN101674715B Device and method for radiating
06/19/2013CN101615620B Semiconductor device and electronic device
06/19/2013CN101582398B Ball-bump bonded ribbon-wire interconnect
06/19/2013CN101521169B Semiconductor device and a method of manufacturing the same
06/19/2013CN101359660B Semiconductor apparatus with thin semiconductor film
06/19/2013CN101083234B Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use
06/18/2013USRE44303 Passivation layer for a circuit device and method of manufacture
06/18/2013US8466997 Fan-out wafer level package for an optical sensor and method of manufacture thereof
06/18/2013US8466569 Increasing exposure tool alignment signal strength for a ferroelectric capacitor layer
06/18/2013US8466568 Multi-component device integrated into a matrix
06/18/2013US8466567 Integrated circuit packaging system with stack interconnect and method of manufacture thereof
06/18/2013US8466566 Semiconductor device, method for manufacturing of semiconductor device, and switching circuit
06/18/2013US8466565 Substrate and semiconductor device
06/18/2013US8466564 Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
06/18/2013US8466563 Apparatus and methods for 3-D stacking of thinned die
06/18/2013US8466562 Layered chip package