Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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06/20/2013 | US20130154074 Semiconductor stack packages and methods of fabricating the same |
06/20/2013 | US20130154073 Method of forming a semiconductor device and leadframe therefor |
06/20/2013 | US20130154072 Integrated circuit packaging system with pad and method of manufacture thereof |
06/20/2013 | US20130154071 Isolation Barrier Device and Methods of Use |
06/20/2013 | US20130154070 Semiconductor package |
06/20/2013 | US20130154069 Semiconductor package |
06/20/2013 | US20130154068 Packaged leadless semiconductor device |
06/20/2013 | US20130154067 Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnect Structure on Leadframe |
06/20/2013 | US20130154066 Semiconductor package and manufacturing method thereof |
06/20/2013 | US20130154063 Driving substrate, display device, planarizing method, and method of manufacturing driving substrate |
06/20/2013 | US20130154062 Die Structure and Method of Fabrication Thereof |
06/20/2013 | US20130154055 Capacitor and register of semiconductor device, memory system including the semiconductor device, and method of manufacturing the semiconductor device |
06/20/2013 | US20130154018 Semiconductor device comprising self-aligned contact bars and metal lines with increased via landing regions |
06/20/2013 | US20130154015 Three-dimension circuit structure and semiconductor device |
06/20/2013 | US20130154008 Isolated epitaxial modulation device |
06/20/2013 | US20130153960 Anti-Fuses on Semiconductor Fins |
06/20/2013 | US20130153930 Phenyl group-containing organic/inorganic hybrid prepolymer, heat resistant organic/inorganic hybrid material, and element encapsulation structure |
06/20/2013 | US20130153900 Semiconductor device |
06/20/2013 | US20130153899 Semiconductor device having plural semiconductor chips |
06/20/2013 | US20130153645 Process for Hybrid Integration of Focal Plane Arrays |
06/20/2013 | US20130153030 Encapsulated flexible electronic device, and corresponding manufacturing method |
06/20/2013 | DE112007000175B9 Feldeffekttransistor eines Mehrfingertyps Field effect transistor of a multi-finger type |
06/20/2013 | DE10323238B4 Leistungselement, welches einen großen elektrischen Strom durchlässt Power element that transmits a large electric current |
06/20/2013 | DE102012220127A1 Halbleiterschaltvorrichtung A semiconductor switching device |
06/20/2013 | DE102012112682A1 Halbleitervorrichtung und Herstellungsverfahren A semiconductor device and manufacturing method |
06/20/2013 | DE102012112328A1 Packaging integrated circuit by fabricating package module from successive build-up layers having circuit interconnections, and forming cavity on top-side of package module |
06/20/2013 | DE102012112327A1 Packaging integrated circuit by fabricating package module from successive build-up layers having circuit interconnections, and forming cavity on top-side of package module |
06/20/2013 | DE102012111929A1 Protection device for electronic device, has heat energy conductor provided to exploit thermal conduction for conducting heat energy used in/from housing so as to protect electronic devices from overload and prevent possible risks |
06/20/2013 | DE102012111705A1 Datenspeichervorrichtung und Verfahren zum Herstellen derselben Data storage device and method for manufacturing the same |
06/20/2013 | DE102012105153A1 Halbleiter-package The semiconductor package |
06/20/2013 | DE102012023644A1 Verfahren zum Herstellen von elektronischen Vorrichtungen vom DSC-Typ unter Verwendung eines Abstandshalteeinsatzes A method of manufacturing of electronic devices from the DSC-type using a spacer insert |
06/20/2013 | DE102012005787A1 Halbleiter-Package The semiconductor package |
06/20/2013 | DE102011121064A1 Cascadeable cooling system for high speed semiconductor component, has base body whose top surface is realized such that electronic power component is directly connected to coolant, and displacement unit arranged in liquid space |
06/20/2013 | DE102011088617A1 Elektrisch abstimmbares Impedanzanpassnetzwerk eines HF-Leistungstransistors Electrically tunable Impedanzanpassnetzwerk of an RF power transistor |
06/20/2013 | DE102011056515A1 Elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements An electrical component and method for manufacturing an electrical component |
06/20/2013 | DE102008033465B4 Leistungshalbleitermodulsystem und leistungshalbleitermodul mit einem gehause sowie verfahren zur herstellung einer leis- tungshalbleiteranordnung Power semiconductor module system and power semiconductor module with a housing and process for manufacturing a power semiconductors arrangement |
06/20/2013 | DE102007063820B3 Vertikaler Halbleiterleistungsschalter und Verfahren zu dessen Herstellung Vertical semiconductor power switch and process for its preparation |
06/20/2013 | DE102005051571B4 Photodioden-Chip hoher Grenzfrequenz Photodiode chip high cut-off frequency |
06/20/2013 | CA2856833A1 Electronic device with cooling by a liquid metal spreader |
06/19/2013 | EP2605345A1 Thermal management of photonics assemblies |
06/19/2013 | EP2605279A1 Stacked packaging using reconstituted wafers |
06/19/2013 | EP2605278A1 Lead Frame with Die Attach Bleeding Control Features |
06/19/2013 | EP2605277A2 Heat sink |
06/19/2013 | EP2605276A2 Packaged leadless semiconductor device |
06/19/2013 | EP2605275A2 Load distributed heat sink system |
06/19/2013 | EP2605274A1 Electronic component |
06/19/2013 | EP2605273A2 Method for forming isolation trenches in micro-bump interconnect structures and devices obtained thereof |
06/19/2013 | EP2604638A1 Curable resin composition and cured article thereof |
06/19/2013 | EP2603929A2 Stitch bump stacking design for overall package size reduction for multiple stack |
06/19/2013 | EP2603928A2 Apparatus and method for thermal interfacing |
06/19/2013 | CN203015366U Heat radiation structure for integral type flat television COF chip |
06/19/2013 | CN203015365U Cooling fin |
06/19/2013 | CN203015335U Vehicle-mounted equipment |
06/19/2013 | CN203014688U A rotating rectifier used for a brushless synchronous motor |
06/19/2013 | CN203013718U Photovoltaic bypass diode |
06/19/2013 | CN203013717U Three-dimensional integration power hybrid integrated circuit |
06/19/2013 | CN203013716U High-reliability homogeneous bonding system multi-chip module |
06/19/2013 | CN203013715U Ferroelectric film capacitor |
06/19/2013 | CN203013714U Electrostatic protection element and package structure using same |
06/19/2013 | CN203013713U Three-dimensional multi-chip module boards broadband transition structure |
06/19/2013 | CN203013712U Metal bonding structure of three-dimensional chip |
06/19/2013 | CN203013711U Smart card package frame |
06/19/2013 | CN203013710U Packaging element of semiconductor device |
06/19/2013 | CN203013709U 半导体装置 Semiconductor device |
06/19/2013 | CN203013708U Semiconductor die package |
06/19/2013 | CN203013707U Semiconductor die package |
06/19/2013 | CN203013706U Flip-chip bonding structure possessing preforming solder tin cavity |
06/19/2013 | CN203013705U Thin integrated circuit packaging structure based on silicon substrate |
06/19/2013 | CN203013704U High-efficiency thermal and electrical conduction structure of line layer and metal base layer of metal substrate |
06/19/2013 | CN203013703U Heat radiation element and communication apparatus using same |
06/19/2013 | CN203013702U Packaging structure |
06/19/2013 | CN203013701U Packaging structure of gallium arsenide chip of power amplifier module |
06/19/2013 | CN203013700U Light transmission packaging structure based on silicon substrate and glass seal cover |
06/19/2013 | CN1775656B Interconnection of high-density nano structure |
06/19/2013 | CN103168358A Embedded structures and methods of manufacture thereof |
06/19/2013 | CN103168357A Configurable power switch cells and methodology |
06/19/2013 | CN103168356A 半导体模块 Semiconductor Modules |
06/19/2013 | CN103168355A Circuit board for large-capacity module peripheral circuit and large-capacity module containing peripheral circuit using said circuit board |
06/19/2013 | CN103168348A Method for performing interconnection or redirection lines of at least an integrated circuit component |
06/19/2013 | CN103168210A Cooling device and method for producing same |
06/19/2013 | CN103168078A Encapsulating agent for optical semiconductor devices, and optical semiconductor device using same |
06/19/2013 | CN103168074A 固化性环氧树脂组合物 The curable epoxy resin composition |
06/19/2013 | CN103168061A Sealing resin composition and electronic component device |
06/19/2013 | CN103168060A 固化性环氧树脂组合物 The curable epoxy resin composition |
06/19/2013 | CN103167783A Radiator |
06/19/2013 | CN103167774A 电子装置 Electronic devices |
06/19/2013 | CN103167725A Three-dimension circuit structure and semiconductor device |
06/19/2013 | CN103165966A Waveguide, interposer substrate including the same, module, and electronic apparatus |
06/19/2013 | CN103165656A Semiconductor device and method of manufacturing the same |
06/19/2013 | CN103165626A Display panel and display device |
06/19/2013 | CN103165619A Capacitor and register of semiconductor device, memory system including the semiconductor device, and method of manufacturing the semiconductor device |
06/19/2013 | CN103165605A Semiconductor device and method of manufacturing the semiconductor device |
06/19/2013 | CN103165599A Integrated circuit and method of providing electrostatic discharge protection within such an integrated circuit |
06/19/2013 | CN103165588A Insulated gate bipolar transistor (IGBT) module |
06/19/2013 | CN103165587A 半导体封装 The semiconductor package |
06/19/2013 | CN103165586A Semiconductor stack packages and methods of fabricating the same |
06/19/2013 | CN103165585A Stacked packaging using reconstituted wafers |
06/19/2013 | CN103165584A Circuit generating reverse current of interconnection line |
06/19/2013 | CN103165583A Test pattern of semiconductor device and manufacturing method thereof |
06/19/2013 | CN103165582A Structure and method for e-beam in-chip overlay mark |