Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2013
06/20/2013US20130154074 Semiconductor stack packages and methods of fabricating the same
06/20/2013US20130154073 Method of forming a semiconductor device and leadframe therefor
06/20/2013US20130154072 Integrated circuit packaging system with pad and method of manufacture thereof
06/20/2013US20130154071 Isolation Barrier Device and Methods of Use
06/20/2013US20130154070 Semiconductor package
06/20/2013US20130154069 Semiconductor package
06/20/2013US20130154068 Packaged leadless semiconductor device
06/20/2013US20130154067 Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnect Structure on Leadframe
06/20/2013US20130154066 Semiconductor package and manufacturing method thereof
06/20/2013US20130154063 Driving substrate, display device, planarizing method, and method of manufacturing driving substrate
06/20/2013US20130154062 Die Structure and Method of Fabrication Thereof
06/20/2013US20130154055 Capacitor and register of semiconductor device, memory system including the semiconductor device, and method of manufacturing the semiconductor device
06/20/2013US20130154018 Semiconductor device comprising self-aligned contact bars and metal lines with increased via landing regions
06/20/2013US20130154015 Three-dimension circuit structure and semiconductor device
06/20/2013US20130154008 Isolated epitaxial modulation device
06/20/2013US20130153960 Anti-Fuses on Semiconductor Fins
06/20/2013US20130153930 Phenyl group-containing organic/inorganic hybrid prepolymer, heat resistant organic/inorganic hybrid material, and element encapsulation structure
06/20/2013US20130153900 Semiconductor device
06/20/2013US20130153899 Semiconductor device having plural semiconductor chips
06/20/2013US20130153645 Process for Hybrid Integration of Focal Plane Arrays
06/20/2013US20130153030 Encapsulated flexible electronic device, and corresponding manufacturing method
06/20/2013DE112007000175B9 Feldeffekttransistor eines Mehrfingertyps Field effect transistor of a multi-finger type
06/20/2013DE10323238B4 Leistungselement, welches einen großen elektrischen Strom durchlässt Power element that transmits a large electric current
06/20/2013DE102012220127A1 Halbleiterschaltvorrichtung A semiconductor switching device
06/20/2013DE102012112682A1 Halbleitervorrichtung und Herstellungsverfahren A semiconductor device and manufacturing method
06/20/2013DE102012112328A1 Packaging integrated circuit by fabricating package module from successive build-up layers having circuit interconnections, and forming cavity on top-side of package module
06/20/2013DE102012112327A1 Packaging integrated circuit by fabricating package module from successive build-up layers having circuit interconnections, and forming cavity on top-side of package module
06/20/2013DE102012111929A1 Protection device for electronic device, has heat energy conductor provided to exploit thermal conduction for conducting heat energy used in/from housing so as to protect electronic devices from overload and prevent possible risks
06/20/2013DE102012111705A1 Datenspeichervorrichtung und Verfahren zum Herstellen derselben Data storage device and method for manufacturing the same
06/20/2013DE102012105153A1 Halbleiter-package The semiconductor package
06/20/2013DE102012023644A1 Verfahren zum Herstellen von elektronischen Vorrichtungen vom DSC-Typ unter Verwendung eines Abstandshalteeinsatzes A method of manufacturing of electronic devices from the DSC-type using a spacer insert
06/20/2013DE102012005787A1 Halbleiter-Package The semiconductor package
06/20/2013DE102011121064A1 Cascadeable cooling system for high speed semiconductor component, has base body whose top surface is realized such that electronic power component is directly connected to coolant, and displacement unit arranged in liquid space
06/20/2013DE102011088617A1 Elektrisch abstimmbares Impedanzanpassnetzwerk eines HF-Leistungstransistors Electrically tunable Impedanzanpassnetzwerk of an RF power transistor
06/20/2013DE102011056515A1 Elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements An electrical component and method for manufacturing an electrical component
06/20/2013DE102008033465B4 Leistungshalbleitermodulsystem und leistungshalbleitermodul mit einem gehause sowie verfahren zur herstellung einer leis- tungshalbleiteranordnung Power semiconductor module system and power semiconductor module with a housing and process for manufacturing a power semiconductors arrangement
06/20/2013DE102007063820B3 Vertikaler Halbleiterleistungsschalter und Verfahren zu dessen Herstellung Vertical semiconductor power switch and process for its preparation
06/20/2013DE102005051571B4 Photodioden-Chip hoher Grenzfrequenz Photodiode chip high cut-off frequency
06/20/2013CA2856833A1 Electronic device with cooling by a liquid metal spreader
06/19/2013EP2605345A1 Thermal management of photonics assemblies
06/19/2013EP2605279A1 Stacked packaging using reconstituted wafers
06/19/2013EP2605278A1 Lead Frame with Die Attach Bleeding Control Features
06/19/2013EP2605277A2 Heat sink
06/19/2013EP2605276A2 Packaged leadless semiconductor device
06/19/2013EP2605275A2 Load distributed heat sink system
06/19/2013EP2605274A1 Electronic component
06/19/2013EP2605273A2 Method for forming isolation trenches in micro-bump interconnect structures and devices obtained thereof
06/19/2013EP2604638A1 Curable resin composition and cured article thereof
06/19/2013EP2603929A2 Stitch bump stacking design for overall package size reduction for multiple stack
06/19/2013EP2603928A2 Apparatus and method for thermal interfacing
06/19/2013CN203015366U Heat radiation structure for integral type flat television COF chip
06/19/2013CN203015365U Cooling fin
06/19/2013CN203015335U Vehicle-mounted equipment
06/19/2013CN203014688U A rotating rectifier used for a brushless synchronous motor
06/19/2013CN203013718U Photovoltaic bypass diode
06/19/2013CN203013717U Three-dimensional integration power hybrid integrated circuit
06/19/2013CN203013716U High-reliability homogeneous bonding system multi-chip module
06/19/2013CN203013715U Ferroelectric film capacitor
06/19/2013CN203013714U Electrostatic protection element and package structure using same
06/19/2013CN203013713U Three-dimensional multi-chip module boards broadband transition structure
06/19/2013CN203013712U Metal bonding structure of three-dimensional chip
06/19/2013CN203013711U Smart card package frame
06/19/2013CN203013710U Packaging element of semiconductor device
06/19/2013CN203013709U 半导体装置 Semiconductor device
06/19/2013CN203013708U Semiconductor die package
06/19/2013CN203013707U Semiconductor die package
06/19/2013CN203013706U Flip-chip bonding structure possessing preforming solder tin cavity
06/19/2013CN203013705U Thin integrated circuit packaging structure based on silicon substrate
06/19/2013CN203013704U High-efficiency thermal and electrical conduction structure of line layer and metal base layer of metal substrate
06/19/2013CN203013703U Heat radiation element and communication apparatus using same
06/19/2013CN203013702U Packaging structure
06/19/2013CN203013701U Packaging structure of gallium arsenide chip of power amplifier module
06/19/2013CN203013700U Light transmission packaging structure based on silicon substrate and glass seal cover
06/19/2013CN1775656B Interconnection of high-density nano structure
06/19/2013CN103168358A Embedded structures and methods of manufacture thereof
06/19/2013CN103168357A Configurable power switch cells and methodology
06/19/2013CN103168356A 半导体模块 Semiconductor Modules
06/19/2013CN103168355A Circuit board for large-capacity module peripheral circuit and large-capacity module containing peripheral circuit using said circuit board
06/19/2013CN103168348A Method for performing interconnection or redirection lines of at least an integrated circuit component
06/19/2013CN103168210A Cooling device and method for producing same
06/19/2013CN103168078A Encapsulating agent for optical semiconductor devices, and optical semiconductor device using same
06/19/2013CN103168074A 固化性环氧树脂组合物 The curable epoxy resin composition
06/19/2013CN103168061A Sealing resin composition and electronic component device
06/19/2013CN103168060A 固化性环氧树脂组合物 The curable epoxy resin composition
06/19/2013CN103167783A Radiator
06/19/2013CN103167774A 电子装置 Electronic devices
06/19/2013CN103167725A Three-dimension circuit structure and semiconductor device
06/19/2013CN103165966A Waveguide, interposer substrate including the same, module, and electronic apparatus
06/19/2013CN103165656A Semiconductor device and method of manufacturing the same
06/19/2013CN103165626A Display panel and display device
06/19/2013CN103165619A Capacitor and register of semiconductor device, memory system including the semiconductor device, and method of manufacturing the semiconductor device
06/19/2013CN103165605A Semiconductor device and method of manufacturing the semiconductor device
06/19/2013CN103165599A Integrated circuit and method of providing electrostatic discharge protection within such an integrated circuit
06/19/2013CN103165588A Insulated gate bipolar transistor (IGBT) module
06/19/2013CN103165587A 半导体封装 The semiconductor package
06/19/2013CN103165586A Semiconductor stack packages and methods of fabricating the same
06/19/2013CN103165585A Stacked packaging using reconstituted wafers
06/19/2013CN103165584A Circuit generating reverse current of interconnection line
06/19/2013CN103165583A Test pattern of semiconductor device and manufacturing method thereof
06/19/2013CN103165582A Structure and method for e-beam in-chip overlay mark