| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/27/2013 | WO2013092387A1 Method for producing optoelectronic semiconductor components, leadframe assemblage, and optoelectronic semiconductor component |
| 06/27/2013 | WO2013092098A1 Circuit carrier with a separate rf circuit and method for populating such a circuit carrier |
| 06/27/2013 | WO2013091962A1 Transmission control module |
| 06/27/2013 | WO2013091441A1 Pop encapsulation structure |
| 06/27/2013 | WO2013091298A1 Liquid crystal display device, low-temperature polysilicon display device and manufacturing method thereof |
| 06/27/2013 | WO2013091143A1 Microchannel direct bonded copper substrate and packaging structure and process of power device thereof |
| 06/27/2013 | WO2013091142A1 Lead frame pad containing microchannels for packaging high-power electronic component, packaging structure and process |
| 06/27/2013 | WO2013091141A1 Packaging structure and packaging process of power device |
| 06/27/2013 | WO2013040418A3 High precision self aligning die for embedded die packaging |
| 06/27/2013 | US20130164921 High-density nonvolatile memory and methods of making the same |
| 06/27/2013 | US20130163852 Rotational multi-layer overlay marks, apparatus, and methods |
| 06/27/2013 | US20130163306 One-Time Programmable Memory Cell, Memory and Manufacturing Method Thereof |
| 06/27/2013 | US20130162346 Interconnection device in a multi-layer shielding mesh |
| 06/27/2013 | US20130161841 Alignment mark and method of manufacturing the same |
| 06/27/2013 | US20130161839 Semiconductor device and method of manufacturing the same |
| 06/27/2013 | US20130161838 Anisotropic conductive film and semiconductor device |
| 06/27/2013 | US20130161837 Semiconductor package, packaging substrate and fabrication method thereof |
| 06/27/2013 | US20130161836 Semiconductor package having interposer comprising a plurality of segments |
| 06/27/2013 | US20130161835 Multilayer connection structure |
| 06/27/2013 | US20130161833 Semiconductor Device and Method of Forming Extended Semiconductor Device with Fan-Out Interconnect Structure to Reduce Complexity of Substrate |
| 06/27/2013 | US20130161832 Semiconductor device with buried bit line and method for fabricating the same |
| 06/27/2013 | US20130161831 Three-dimensional semiconductor devices |
| 06/27/2013 | US20130161830 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same |
| 06/27/2013 | US20130161829 Wafer-to-wafer stack with supporting post |
| 06/27/2013 | US20130161828 Tsv via provided with a stress release structure and its fabrication method |
| 06/27/2013 | US20130161827 Semiconductor chip having plural penetration electrode penetrating therethrough |
| 06/27/2013 | US20130161826 Semiconductor chip and stacked semiconductor package having the same |
| 06/27/2013 | US20130161825 Through substrate via structure and method for fabricating the same |
| 06/27/2013 | US20130161824 Semiconductor Device and Method of Forming Insulating Layer in Notches Around Conductive TSV for Stress Relief |
| 06/27/2013 | US20130161823 Semiconductor Device and Method of Manufacturing the Same |
| 06/27/2013 | US20130161822 Controlling density of particles within underfill surrounding solder bump contacts |
| 06/27/2013 | US20130161821 Nonvolatile memory device and method of manufacturing the same |
| 06/27/2013 | US20130161820 Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates |
| 06/27/2013 | US20130161819 Semiconductor device stacked structure |
| 06/27/2013 | US20130161818 3-d nonvolatile memory device and method of manufacturing the same |
| 06/27/2013 | US20130161817 Techniques for wafer-level processing of qfn packages |
| 06/27/2013 | US20130161816 Semiconductor package |
| 06/27/2013 | US20130161815 Semiconductor device |
| 06/27/2013 | US20130161814 Semiconductor chip with offset pads |
| 06/27/2013 | US20130161813 Semiconductor device, semiconductor package, and method for manufacturing semiconductor device |
| 06/27/2013 | US20130161812 Die packages and systems having the die packages |
| 06/27/2013 | US20130161811 3d ic configuration with contactless communication |
| 06/27/2013 | US20130161810 Semiconductor package |
| 06/27/2013 | US20130161809 Substrate structure, semiconductor package device, and manufacturing method of substrate structure |
| 06/27/2013 | US20130161808 Semiconductor package and method of manufacturing semiconductor package |
| 06/27/2013 | US20130161807 Method for jointing metal member and resin and jointed body thereof |
| 06/27/2013 | US20130161806 Window clamp top plate for integrated circuit packaging |
| 06/27/2013 | US20130161805 Integrated circuit (ic) leadframe design |
| 06/27/2013 | US20130161804 Integrated circuit (ic) leadframe design |
| 06/27/2013 | US20130161803 Semiconductor Package with Conductive Heat Spreader |
| 06/27/2013 | US20130161802 Semiconductor package having electrical connecting structures and fabrication method thereof |
| 06/27/2013 | US20130161801 Module Including a Discrete Device Mounted on a DCB Substrate |
| 06/27/2013 | US20130161800 Pcb for muf and molding structure of the pcb |
| 06/27/2013 | US20130161796 Through silicon via and method of forming the same |
| 06/27/2013 | US20130161795 Manufacturing method of semiconductor device, processing method of semiconductor wafer, semiconductor wafer |
| 06/27/2013 | US20130161788 Semiconductor Package Including Stacked Semiconductor Chips and a Redistribution Layer |
| 06/27/2013 | US20130161749 Semiconductor integrated circuit |
| 06/27/2013 | US20130161636 Methods of fabricating semiconductor structures using thermal spray processes, and semiconductor structures fabricated using such methods |
| 06/27/2013 | US20130161616 Substrate for Chip on Film |
| 06/27/2013 | US20130161615 Measuring current and resistance using combined diodes/resistor structure to monitor integrated circuit manufacturing process variations |
| 06/27/2013 | US20130160830 Thick-film conductive paste composition |
| 06/27/2013 | DE202013002411U1 Wärmeverteiler mit Flachrohrkühlelement Heat spreader with flat-tube cooling element |
| 06/27/2013 | DE10205870B4 Moduleinheit mit SiC-Halbleiterbauelement mit Schottky-Kontakten Module unit with SiC semiconductor device with Schottky contacts |
| 06/27/2013 | DE102012224047A1 Verbundhalbleiterbauelement mt vergrabener Feldplatte und Verfahren zum Herstellen eines Halbleiterbauelements Composite semiconductor device mt buried field plate and method for manufacturing a semiconductor device |
| 06/27/2013 | DE102012223362A1 Lichtemittierende Vorrichtung und Herstellungsverfahren dafür A light emitting device and manufacturing method thereof |
| 06/27/2013 | DE102012222504A1 Messen von Stromstärke und Widerstand unter Verwendung einer kombinierten Dioden/Widerstands-Struktur zum Überwachen von Abweichungen im Herstellungsverfahren für integrierte Schaltungen Measurement of current, and resistance using a combined diode / resistor structure for monitoring variations in the manufacturing process for integrated circuits |
| 06/27/2013 | DE102012221334A1 Flux used for bonding silicon-based solar cells, contains metal powder and glass powder which is sulfate-containing glass powder containing sulfur trioxide |
| 06/27/2013 | DE102012201890A1 Electrical power module for use in e.g. insulated gate bipolar transistor, has control device controlling electronic components, arranged at side of component and electrically coupled with contact element at another side of component |
| 06/27/2013 | DE102012112769A1 Modul mit einer diskreten Vorrichtung, die auf einem DCB-Substrat montiert ist Module with a discrete device that is mounted on a DCB substrate |
| 06/27/2013 | DE102011089740A1 Power module for use in inverter for three-phase alternating-current motor utilized as drive motor in e.g. electric car, has strip conductors partially overlapped along direction of vertical axis, and insulation layer made of ceramic |
| 06/27/2013 | DE102011089550A1 Lotkugelanordnung, Gehäuse mit einer Lotkugelanordnung sowie Herstellungsverfahren für eine Lotkugelanordnung Lotkugelanordnung, housing with a Lotkugelanordnung and manufacturing method for a Lotkugelanordnung |
| 06/27/2013 | DE102011056890A1 Anschlussträger, optoelektronische Bauelementanordnung und Beleuchtungsvorrichtung Connection carrier, optoelectronic component arrangement and lighting device |
| 06/27/2013 | DE102011056848A1 Leistungshalbleitermodul oder Ansteuermodul hierfür Power semiconductor module or control module therefor |
| 06/27/2013 | DE102009031388B4 Elektronische Trägervorrichtung Electronic support device |
| 06/27/2013 | DE102007015293B4 Metall/Keramik-Verbindungssubstrat mit Wärmeabstrahlkörper Metal / ceramic bonding substrate having heat radiating body |
| 06/27/2013 | DE102006001792B4 Halbleitermodul mit Halbleiterchipstapel und Verfahren zur Herstellung desselben The same semiconductor module with the semiconductor chip stack, and process for preparing |
| 06/26/2013 | EP2608261A2 Semiconductor device |
| 06/26/2013 | EP2608260A2 Heterogeneous Chip Integration with Low Loss Interconnection Through Adaptive Patterning |
| 06/26/2013 | EP2608259A2 Cooling device and electronic apparatus using same |
| 06/26/2013 | EP2608258A1 A package |
| 06/26/2013 | EP2608257A1 Semiconductor device and method for manufacturing same |
| 06/26/2013 | EP2608256A1 Multi chip modules for downhole equipment |
| 06/26/2013 | EP2608255A1 Method of bonding two substrates and device manufactured thereby |
| 06/26/2013 | EP2608254A2 Semiconductor power module or actuation module for same |
| 06/26/2013 | EP2608253A2 TSV provided with a stress-release structure and method for manufacturing same |
| 06/26/2013 | EP2608207A1 Semiconductor device with through-silicon vias |
| 06/26/2013 | EP2607403A1 Phenyl group-containing organic/inorganic hybrid prepolymer, heat resisitant organic/inorganic hybrid material, and element encapsulation structure |
| 06/26/2013 | EP2288244B1 Wiring circuit substrate |
| 06/26/2013 | CN203026511U IGBT layout |
| 06/26/2013 | CN203026502U Ultrathin miniature bridge rectifier |
| 06/26/2013 | CN203026501U Plane single-row or matrix type multi-carrier IC (Integrated Circuit) chip packaging piece |
| 06/26/2013 | CN203026500U Stack packaging device |
| 06/26/2013 | CN203026499U Chip double-sided packaging structure |
| 06/26/2013 | CN203026498U Chip stacked layer packaging structure |
| 06/26/2013 | CN203026497U Electric leakage test structure |
| 06/26/2013 | CN203026496U Multi-power supply IC (Integrated Circuit) chip packaging piece |
| 06/26/2013 | CN203026495U Chip packaging structure |
| 06/26/2013 | CN203026494U Lead frame structure |
| 06/26/2013 | CN203026493U Sealed circulating water cooling device with conductivity protection function |
| 06/26/2013 | CN103180943A Electronic component module |