Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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06/26/2013 | CN103180942A 半导体模块 Semiconductor Modules |
06/26/2013 | CN103180941A Wiring board |
06/26/2013 | CN103180940A Package |
06/26/2013 | CN103180939A Photonics module and method of manufacturing |
06/26/2013 | CN103180938A Capacitance array body and signal processing device comprising same |
06/26/2013 | CN103180387A Thermosetting crosslinked cycloolefin resin film and manufacturing process therefor |
06/26/2013 | CN103180355A Phenol-type oligomer and process for production thereof |
06/26/2013 | CN103179839A 电子装置 Electronic devices |
06/26/2013 | CN103179780A Multi-layer wiring substrate and manufacturing method thereof |
06/26/2013 | CN103179779A Circuit substrate |
06/26/2013 | CN103178106A Shield wrap for heterostructure field effect transistor |
06/26/2013 | CN103178071A Cog pakage and camera module having the same |
06/26/2013 | CN103178056A Semiconductor package including multiple chips and memory system having the same |
06/26/2013 | CN103178054A Semiconductor Package Including Stacked Semiconductor Chips and a Redistribution Layer |
06/26/2013 | CN103178053A Wafer level test structure and method |
06/26/2013 | CN103178052A Wafer to wafer connection structure |
06/26/2013 | CN103178051A semiconductor device stacked structure |
06/26/2013 | CN103178050A Semiconductor package structure and manufacturing method thereof |
06/26/2013 | CN103178049A Self-aligned contact hole insulating layer structure and preparation method |
06/26/2013 | CN103178048A Semiconductor device and method of manufacturing same |
06/26/2013 | CN103178047A Semiconductor device and method for manufacturing the same |
06/26/2013 | CN103178046A Semiconductor device |
06/26/2013 | CN103178045A Semiconductor devices and methods of manufacturing the same |
06/26/2013 | CN103178044A Multilayer electronic supporting structure having integrated metal core |
06/26/2013 | CN103178043A Wiring board and method of manufacturing the same |
06/26/2013 | CN103178042A Nut capable of achieving ultrathin packaging of power module |
06/26/2013 | CN103178041A Lead frame strip and glue sealing method |
06/26/2013 | CN103178040A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing |
06/26/2013 | CN103178039A Semiconductor package and manufacturing method thereof |
06/26/2013 | CN103178038A Chip device package and fabrication method thereof |
06/26/2013 | CN103178037A 电子部件与电子装置 The electronic component and the electronic device |
06/26/2013 | CN103178036A Semiconductor and manufacturing method thereof |
06/26/2013 | CN103178035A 半导体封装 The semiconductor package |
06/26/2013 | CN103178034A Semiconductor package, packaging substrate and fabrication method thereof |
06/26/2013 | CN103178033A Semiconductor devices connected by anisotropic conductive film comprising conductive microspheres |
06/26/2013 | CN103178032A Semiconductor packaging process using through silicon vias |
06/26/2013 | CN103178031A Chip connection method |
06/26/2013 | CN103178030A Module including discrete device mounted on dcb substrate and method for manufacturing the same |
06/26/2013 | CN103178029A Semiconductor chip and stacked semiconductor package having the same |
06/26/2013 | CN103178028A Fixing structure of radiating module |
06/26/2013 | CN103178027A Heat-dissipating structure and electronic device using same |
06/26/2013 | CN103178026A Heat-dissipating structure and electronic device using same |
06/26/2013 | CN103178025A Semiconductor device and fabrication method |
06/26/2013 | CN103178024A Substrate with composite dielectric constant and production method thereof |
06/26/2013 | CN103178023A Mixed substrate encapsulation method and mixed substrate encapsulation structure for semiconductor device |
06/26/2013 | CN103178022A Semiconductor power module or actuation module for same |
06/26/2013 | CN103178007A Scribing method, chip manufacturing method and convex glass packaging diode |
06/26/2013 | CN103178002A Air gap, air gap forming method and semiconductor device |
06/26/2013 | CN103178000A Semiconductor device and forming method thereof |
06/26/2013 | CN103177977A Exposing connectors in packages through selective treatment |
06/26/2013 | CN103177974A Process for manufacturing discrete electronic component of copper sheet electrode |
06/26/2013 | CN103177959A Diode for preventing stress from being acted on chip and manufacture method thereof |
06/26/2013 | CN103176363A Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film |
06/26/2013 | CN103173144A Composition for anisotropic conductive adhesive film, anisotropic conductive adhesive film and semiconductor device |
06/26/2013 | CN103173143A Anisotropic conductive film and semiconductor device |
06/26/2013 | CN102446892B High-performance metal-oxide-metal capacitor and manufacturing method thereof |
06/26/2013 | CN102437146B Optimization method of through hole key size detection territory |
06/26/2013 | CN102437015B Method for increasing metal-insulating layer-metal (MIM) capacitor density in semiconductor device and structure thereof |
06/26/2013 | CN102376674B Packaging structure with embedded semi-conductor element |
06/26/2013 | CN102324414B Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof |
06/26/2013 | CN102323682B Liquid crystal panel and wound tape base plate with chip-on-flex (COF) structure |
06/26/2013 | CN102231376B Multi-cycle arrangement carrier-free double-integrated chip (IC) package and production method |
06/26/2013 | CN102208409B 集成电路结构 Integrated circuit structure |
06/26/2013 | CN102110668B Lead frame for packaging member to accommodate electronic component |
06/26/2013 | CN102054817B Antifuse and method of making the antifuse |
06/26/2013 | CN102005474B Semiconductor device and method for manufacturing the same |
06/26/2013 | CN101989598B Multi-die package |
06/26/2013 | CN101908526B Alignment mark arrangement and alignment mark structure |
06/26/2013 | CN101827713B Method for marking valuable articles |
06/26/2013 | CN101754645B Heat pipe type heat radiator and manufacturing method thereof |
06/26/2013 | CN101752325B Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutions |
06/26/2013 | CN101697348B Small-carrier flat-four-side pin-less packaging part and preparation method thereof |
06/26/2013 | CN101409279B Semiconductor device including electronic component coupled to a backside of a chip |
06/26/2013 | CN101339929B Ultra-thin wafer-level contact grid array |
06/26/2013 | CN101256977B Semiconductor structure and forming method of semiconductor structure |
06/25/2013 | US8473762 Power delivery in a heterogeneous 3-D stacked apparatus |
06/25/2013 | US8473021 Analyte monitoring device and methods of use |
06/25/2013 | US8472911 Wireless communication system |
06/25/2013 | US8472195 Electronic device |
06/25/2013 | US8471394 Integrated circuit packaging system with package-on-package and method of manufacture thereof |
06/25/2013 | US8471393 Semiconductor component including a semiconductor chip and a passive component |
06/25/2013 | US8471392 Semiconductor apparatus and endoscope apparatus |
06/25/2013 | US8471391 Methods for multi-wire routing and apparatus implementing same |
06/25/2013 | US8471390 Power MOSFET contact metallization |
06/25/2013 | US8471389 Multiple selectable function integrated circuit module |
06/25/2013 | US8471388 Integrated circuit and method for fabricating the same |
06/25/2013 | US8471386 Junction body, semiconductor module, and manufacturing method for junction body |
06/25/2013 | US8471385 Method for the connection of two wafers, and a wafer arrangement |
06/25/2013 | US8471384 Top layers of metal for high performance IC's |
06/25/2013 | US8471383 Semiconductor package and fabrication method thereof |
06/25/2013 | US8471382 Package and high frequency terminal structure for the same |
06/25/2013 | US8471381 Complete power management system implemented in a single surface mount package |
06/25/2013 | US8471380 Fluid cooled encapsulated microelectronic package |
06/25/2013 | US8471379 Semiconductor device |
06/25/2013 | US8471378 Power semiconductor device and method therefor |
06/25/2013 | US8471377 Semiconductor device and semiconductor circuit substrate |
06/25/2013 | US8471376 Integrated circuit packaging configurations |
06/25/2013 | US8471375 High-density fine line structure and method of manufacturing the same |
06/25/2013 | US8471374 Integrated circuit package system with L-shaped leadfingers |
06/25/2013 | US8471373 Resin-sealed semiconductor device and method for fabricating the same |