Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2013
06/26/2013CN103180942A 半导体模块 Semiconductor Modules
06/26/2013CN103180941A Wiring board
06/26/2013CN103180940A Package
06/26/2013CN103180939A Photonics module and method of manufacturing
06/26/2013CN103180938A Capacitance array body and signal processing device comprising same
06/26/2013CN103180387A Thermosetting crosslinked cycloolefin resin film and manufacturing process therefor
06/26/2013CN103180355A Phenol-type oligomer and process for production thereof
06/26/2013CN103179839A 电子装置 Electronic devices
06/26/2013CN103179780A Multi-layer wiring substrate and manufacturing method thereof
06/26/2013CN103179779A Circuit substrate
06/26/2013CN103178106A Shield wrap for heterostructure field effect transistor
06/26/2013CN103178071A Cog pakage and camera module having the same
06/26/2013CN103178056A Semiconductor package including multiple chips and memory system having the same
06/26/2013CN103178054A Semiconductor Package Including Stacked Semiconductor Chips and a Redistribution Layer
06/26/2013CN103178053A Wafer level test structure and method
06/26/2013CN103178052A Wafer to wafer connection structure
06/26/2013CN103178051A semiconductor device stacked structure
06/26/2013CN103178050A Semiconductor package structure and manufacturing method thereof
06/26/2013CN103178049A Self-aligned contact hole insulating layer structure and preparation method
06/26/2013CN103178048A Semiconductor device and method of manufacturing same
06/26/2013CN103178047A Semiconductor device and method for manufacturing the same
06/26/2013CN103178046A Semiconductor device
06/26/2013CN103178045A Semiconductor devices and methods of manufacturing the same
06/26/2013CN103178044A Multilayer electronic supporting structure having integrated metal core
06/26/2013CN103178043A Wiring board and method of manufacturing the same
06/26/2013CN103178042A Nut capable of achieving ultrathin packaging of power module
06/26/2013CN103178041A Lead frame strip and glue sealing method
06/26/2013CN103178040A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
06/26/2013CN103178039A Semiconductor package and manufacturing method thereof
06/26/2013CN103178038A Chip device package and fabrication method thereof
06/26/2013CN103178037A 电子部件与电子装置 The electronic component and the electronic device
06/26/2013CN103178036A Semiconductor and manufacturing method thereof
06/26/2013CN103178035A 半导体封装 The semiconductor package
06/26/2013CN103178034A Semiconductor package, packaging substrate and fabrication method thereof
06/26/2013CN103178033A Semiconductor devices connected by anisotropic conductive film comprising conductive microspheres
06/26/2013CN103178032A Semiconductor packaging process using through silicon vias
06/26/2013CN103178031A Chip connection method
06/26/2013CN103178030A Module including discrete device mounted on dcb substrate and method for manufacturing the same
06/26/2013CN103178029A Semiconductor chip and stacked semiconductor package having the same
06/26/2013CN103178028A Fixing structure of radiating module
06/26/2013CN103178027A Heat-dissipating structure and electronic device using same
06/26/2013CN103178026A Heat-dissipating structure and electronic device using same
06/26/2013CN103178025A Semiconductor device and fabrication method
06/26/2013CN103178024A Substrate with composite dielectric constant and production method thereof
06/26/2013CN103178023A Mixed substrate encapsulation method and mixed substrate encapsulation structure for semiconductor device
06/26/2013CN103178022A Semiconductor power module or actuation module for same
06/26/2013CN103178007A Scribing method, chip manufacturing method and convex glass packaging diode
06/26/2013CN103178002A Air gap, air gap forming method and semiconductor device
06/26/2013CN103178000A Semiconductor device and forming method thereof
06/26/2013CN103177977A Exposing connectors in packages through selective treatment
06/26/2013CN103177974A Process for manufacturing discrete electronic component of copper sheet electrode
06/26/2013CN103177959A Diode for preventing stress from being acted on chip and manufacture method thereof
06/26/2013CN103176363A Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film
06/26/2013CN103173144A Composition for anisotropic conductive adhesive film, anisotropic conductive adhesive film and semiconductor device
06/26/2013CN103173143A Anisotropic conductive film and semiconductor device
06/26/2013CN102446892B High-performance metal-oxide-metal capacitor and manufacturing method thereof
06/26/2013CN102437146B Optimization method of through hole key size detection territory
06/26/2013CN102437015B Method for increasing metal-insulating layer-metal (MIM) capacitor density in semiconductor device and structure thereof
06/26/2013CN102376674B Packaging structure with embedded semi-conductor element
06/26/2013CN102324414B Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof
06/26/2013CN102323682B Liquid crystal panel and wound tape base plate with chip-on-flex (COF) structure
06/26/2013CN102231376B Multi-cycle arrangement carrier-free double-integrated chip (IC) package and production method
06/26/2013CN102208409B 集成电路结构 Integrated circuit structure
06/26/2013CN102110668B Lead frame for packaging member to accommodate electronic component
06/26/2013CN102054817B Antifuse and method of making the antifuse
06/26/2013CN102005474B Semiconductor device and method for manufacturing the same
06/26/2013CN101989598B Multi-die package
06/26/2013CN101908526B Alignment mark arrangement and alignment mark structure
06/26/2013CN101827713B Method for marking valuable articles
06/26/2013CN101754645B Heat pipe type heat radiator and manufacturing method thereof
06/26/2013CN101752325B Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutions
06/26/2013CN101697348B Small-carrier flat-four-side pin-less packaging part and preparation method thereof
06/26/2013CN101409279B Semiconductor device including electronic component coupled to a backside of a chip
06/26/2013CN101339929B Ultra-thin wafer-level contact grid array
06/26/2013CN101256977B Semiconductor structure and forming method of semiconductor structure
06/25/2013US8473762 Power delivery in a heterogeneous 3-D stacked apparatus
06/25/2013US8473021 Analyte monitoring device and methods of use
06/25/2013US8472911 Wireless communication system
06/25/2013US8472195 Electronic device
06/25/2013US8471394 Integrated circuit packaging system with package-on-package and method of manufacture thereof
06/25/2013US8471393 Semiconductor component including a semiconductor chip and a passive component
06/25/2013US8471392 Semiconductor apparatus and endoscope apparatus
06/25/2013US8471391 Methods for multi-wire routing and apparatus implementing same
06/25/2013US8471390 Power MOSFET contact metallization
06/25/2013US8471389 Multiple selectable function integrated circuit module
06/25/2013US8471388 Integrated circuit and method for fabricating the same
06/25/2013US8471386 Junction body, semiconductor module, and manufacturing method for junction body
06/25/2013US8471385 Method for the connection of two wafers, and a wafer arrangement
06/25/2013US8471384 Top layers of metal for high performance IC's
06/25/2013US8471383 Semiconductor package and fabrication method thereof
06/25/2013US8471382 Package and high frequency terminal structure for the same
06/25/2013US8471381 Complete power management system implemented in a single surface mount package
06/25/2013US8471380 Fluid cooled encapsulated microelectronic package
06/25/2013US8471379 Semiconductor device
06/25/2013US8471378 Power semiconductor device and method therefor
06/25/2013US8471377 Semiconductor device and semiconductor circuit substrate
06/25/2013US8471376 Integrated circuit packaging configurations
06/25/2013US8471375 High-density fine line structure and method of manufacturing the same
06/25/2013US8471374 Integrated circuit package system with L-shaped leadfingers
06/25/2013US8471373 Resin-sealed semiconductor device and method for fabricating the same