| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/03/2013 | CN102074560B Semiconductor device |
| 07/03/2013 | CN102067293B Semiconductor device and method for manufacturing the same |
| 07/03/2013 | CN102047412B Three-dimensional semiconductor device structures and methods |
| 07/03/2013 | CN101952772B Active matrix substrate, liquid crystal panel, television receiver, and liquid crystal panel manufacturing method |
| 07/03/2013 | CN101873787B Fan fixing device |
| 07/03/2013 | CN101854790B Cooling device |
| 07/03/2013 | CN101848624B Liquid cooling heat radiator |
| 07/03/2013 | CN101848622B Radiator and electronic device |
| 07/03/2013 | CN101819952B Semiconductor device |
| 07/03/2013 | CN101742885B Radiator fixing device |
| 07/03/2013 | CN101608784B LED lamp |
| 07/03/2013 | CN101604667B Semiconductor arrangement having specially fashioned bond wires and method for fabricating such an arrangement |
| 07/03/2013 | CN101567342B Soaking plate heat dissipating device |
| 07/03/2013 | CN101533852B Organic light-emitting display apparatus and method of manufacturing the same |
| 07/03/2013 | CN101522812B Resin composition, insulating sheet with base, prepreg, multilayer printed wiring board and semiconductor device |
| 07/03/2013 | CN101426359B Heat exchanger |
| 07/03/2013 | CN101226944B Thin film transistor substrate capable of preventing opening from reducing |
| 07/02/2013 | US8477239 Integrated lens and chip assembly for a digital camera |
| 07/02/2013 | US8476776 Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus |
| 07/02/2013 | US8476775 Integrated circuit packaging system with embedded interconnect and method of manufacture thereof |
| 07/02/2013 | US8476774 Off-chip VIAS in stacked chips |
| 07/02/2013 | US8476773 Electrical interconnect structure |
| 07/02/2013 | US8476772 Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die |
| 07/02/2013 | US8476771 Configuration of connections in a 3D stack of integrated circuits |
| 07/02/2013 | US8476770 Apparatus and methods for forming through vias |
| 07/02/2013 | US8476767 Stacked layer type semiconductor device |
| 07/02/2013 | US8476766 Semiconductor memory device and method for manufacturing the same |
| 07/02/2013 | US8476764 Bonding pad structure for semiconductor devices |
| 07/02/2013 | US8476763 Semiconductor device conductive pattern structures including dummy conductive patterns |
| 07/02/2013 | US8476762 Ni plating of a BLM edge for Pb-free C4 undercut control |
| 07/02/2013 | US8476761 Semiconductor device and method of confining conductive bump material during reflow with solder mask patch |
| 07/02/2013 | US8476760 Electroplated posts with reduced topography and stress |
| 07/02/2013 | US8476759 Electrical connection structure |
| 07/02/2013 | US8476758 Airgap-containing interconnect structure with patternable low-k material and method of fabricating |
| 07/02/2013 | US8476757 Flip chip interconnect method and design for GaAs MMIC applications |
| 07/02/2013 | US8476756 Semiconductor device and heat sink with 3-dimensional thermal conductivity |
| 07/02/2013 | US8476755 High frequency ceramic package and fabrication method for the same |
| 07/02/2013 | US8476754 Wiring substrate and method of manufacturing the same |
| 07/02/2013 | US8476753 Process for enhanced 3D integration and structures generated using the same |
| 07/02/2013 | US8476752 Package structure for DC-DC converter |
| 07/02/2013 | US8476751 Stacked semiconductor package and method for manufacturing the same |
| 07/02/2013 | US8476750 Printed circuit board having embedded dies and method of forming same |
| 07/02/2013 | US8476749 High-bandwidth ramp-stack chip package |
| 07/02/2013 | US8476748 Exposed die overmolded flip chip package and fabrication method |
| 07/02/2013 | US8476747 Leadframe, leadframe type package and lead lane |
| 07/02/2013 | US8476746 Package structure enhancing molding compound bondability |
| 07/02/2013 | US8476745 Integrated circuit chip with reduced IR drop |
| 07/02/2013 | US8476743 C-rich carbon boron nitride dielectric films for use in electronic devices |
| 07/02/2013 | US8476742 Fluid ejection device comprising substrate contact via |
| 07/02/2013 | US8476741 Semiconductor device |
| 07/02/2013 | US8476740 Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet |
| 07/02/2013 | US8476739 Graphene grown substrate and electronic/photonic integrated circuits using same |
| 07/02/2013 | US8476737 Environment-resistant module, micropackage and methods of manufacturing same |
| 07/02/2013 | US8476735 Programmable semiconductor interposer for electronic package and method of forming |
| 07/02/2013 | US8476726 Semiconductor device and method of manufacturing the semiconductor device |
| 07/02/2013 | US8476712 Surge-current-resistant semiconductor diode with soft recovery behavior and methods for producing a semiconductor diode |
| 07/02/2013 | US8476710 Vertical complementary FET |
| 07/02/2013 | US8476709 ESD protection device and method |
| 07/02/2013 | US8476679 System of dynamic and end-user configurable electrical interconnects |
| 07/02/2013 | US8476160 Sublithographic patterning employing image transfer of a controllably damaged dielectric sidewall |
| 07/02/2013 | US8476120 Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors |
| 07/02/2013 | US8476092 Fabricating method of a thin film transistor substrate for liquid crystal display device of minimizing defects due to static electricity |
| 07/02/2013 | US8475923 Heat transfer film, semiconductor device, and electronic apparatus |
| 06/27/2013 | WO2013096880A1 Capacitive blind-mate module interconnection |
| 06/27/2013 | WO2013096715A1 Solar cell pastes for low resistance contacts |
| 06/27/2013 | WO2013096273A1 Graphene-based metal diffusion barrier |
| 06/27/2013 | WO2013095855A1 Method for packaging semiconductors at a wafer level |
| 06/27/2013 | WO2013095692A2 Electrical fuse and method of making the same |
| 06/27/2013 | WO2013095676A1 Separate microchannel voltage domains in stacked memory architecture |
| 06/27/2013 | WO2013095673A1 Self-repair logic for stacked memory architecture |
| 06/27/2013 | WO2013095670A1 Hybrid low metal loading flux |
| 06/27/2013 | WO2013095546A1 3d integrated circuit package with through-mold first level interconnects |
| 06/27/2013 | WO2013095544A1 3d integrated circuit package with window interposer |
| 06/27/2013 | WO2013095522A1 Electrostatic discharge compatible dicing tape with laser scribe capability |
| 06/27/2013 | WO2013095492A1 Interconnect arrangement for hexagonal attachment configurations |
| 06/27/2013 | WO2013095457A1 Ridged integrated heat spreader |
| 06/27/2013 | WO2013095444A1 Packaged semiconductor die and cte-engineering die pair |
| 06/27/2013 | WO2013095442A1 Dense interconnect with solder cap (disc) formation with laser ablation and resulting semiconductor structures and packages |
| 06/27/2013 | WO2013095405A1 Enabling package-on-package (pop) pad surface finishes on bumpless build-up layer (bbul) package |
| 06/27/2013 | WO2013095402A1 Low profile zero/low insertion force package top side flex cable connector architecture |
| 06/27/2013 | WO2013095363A1 Microelectronic package and stacked microelectronic assembly and computing system containing same |
| 06/27/2013 | WO2013095362A1 High performance transient uniform cooling solution for thermal compression bonding process |
| 06/27/2013 | WO2013095339A1 Pin grid interposer |
| 06/27/2013 | WO2013095147A1 Method of bonding two substrates and device manufactured thereby |
| 06/27/2013 | WO2013094952A1 Method of manufacturing thermoelectric device and thermoelectric cooling module and device using the same |
| 06/27/2013 | WO2013094759A1 Polymer powder, curable resin composition, and cured product thereof |
| 06/27/2013 | WO2013094755A1 Wiring board and electronic device |
| 06/27/2013 | WO2013094684A1 Package for housing electronic components, and electronic device |
| 06/27/2013 | WO2013094625A1 Curable resin composition and curable product thereof |
| 06/27/2013 | WO2013094613A1 Thermally conductive sheet and method for manufacturing thermally conductive sheet |
| 06/27/2013 | WO2013094495A1 Insulation-layer material for electronic device, and electronic device |
| 06/27/2013 | WO2013094395A1 Semiconductor device, optical semiconductor device, and heat-dissipating member |
| 06/27/2013 | WO2013094246A1 Method for manufacturing liquid cooling jacket |
| 06/27/2013 | WO2013094213A1 Ceramic copper circuit board and semiconductor device employing same |
| 06/27/2013 | WO2013094101A1 Semiconductor package, method and mold for producing same, input and output terminals of semiconductor package |
| 06/27/2013 | WO2013094028A1 Semiconductor module |
| 06/27/2013 | WO2013093958A1 Resin-molded semiconductor module |
| 06/27/2013 | WO2013093590A1 Methods of fabricating semiconductor structures using thermal spray processes, and semiconductor structures fabricated using such methods |
| 06/27/2013 | WO2013092535A1 A heat bus |
| 06/27/2013 | WO2013092395A1 Method for producing optoelectronic semiconductor components, leadframe assemblage, and optoelectronic semiconductor component |