Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2013
07/03/2013EP2610314A1 Phosphor-containing sheet, led light emitting device using same, and method for manufacturing led light emitting device
07/03/2013EP2609634A2 Light source mount
07/03/2013EP2609622A2 Wide input output memory with low density, low latency and high density, high latency blocks
07/03/2013EP2609621A1 Electrical circuit having circuit components to be cooled, heat sink, and method for sealingly embedding an electrical circuit
07/03/2013EP2609620A1 Method for producing an electrical circuit and electrical circuit
07/03/2013CN203040098U Structure of temperature-uniforming plate
07/03/2013CN203040084U Heat radiation combination device and fastener thereof
07/03/2013CN203038929U Veneering packaging diode
07/03/2013CN203038928U Large current/ high voltage diode
07/03/2013CN203038922U Bipolar capacitance structure
07/03/2013CN203038918U Flat package structure without outer lead on four sides
07/03/2013CN203038917U CPI test structure
07/03/2013CN203038916U TO220 packaging lead frame
07/03/2013CN203038915U TO-252-3LB lead frame structure
07/03/2013CN203038914U SOT26-3LB packaging lead frame
07/03/2013CN203038913U EMMC memory integrated with NANDFLASH flash memory function
07/03/2013CN203038912U LGA package storage device based on standard of SD/USB2.0/USB3.0
07/03/2013CN203038911U Heat radiation device based on liquid metal
07/03/2013CN203038910U Liquid-cooled cooling device
07/03/2013CN203038909U 半导体模块 Semiconductor Modules
07/03/2013CN203038908U Semiconductor module
07/03/2013CN203038907U Novel packaging sheet structure
07/03/2013CN203038906U Semiconductor packaging structure with two layers of substrates
07/03/2013CN203038905U Electronic device packaged by white casting glue
07/03/2013CN103190205A Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board-module
07/03/2013CN103190082A Electronic component
07/03/2013CN103190010A Optoelectronic semiconductor component comprising a semiconductor chip, a carrier substrate and a film and a method for producing said component
07/03/2013CN103190008A LED-element mounting lead frame, resin-attached lead frame, method of manufacturing semiconductor device, and semiconductor-element mounting lead frame
07/03/2013CN103189979A Package inductance compensating tunable capacitor circuit
07/03/2013CN103189978A Apparatus and method for thermal interfacing
07/03/2013CN103189977A Laminate comprising an integrated electronic component
07/03/2013CN103189976A Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies
07/03/2013CN103189975A Package for storing electronic component elements
07/03/2013CN103189974A Electronic-part package and piezoelectric vibration device
07/03/2013CN103189973A Integrated circuit chip customization using backside access
07/03/2013CN103189972A Method for forming isolation structure
07/03/2013CN103189960A Treatment, before the bonding of a mixed copper oxide surface, by a plasma containing nitrogen and hydrogen
07/03/2013CN103189464A Adhesive composition, method for producing semiconductor device, and semiconductor device
07/03/2013CN103189421A Organosiloxane block copolymer
07/03/2013CN103188920A Radiating device
07/03/2013CN103188917A Heat radiation structure of radiator
07/03/2013CN103188912A Lotus-type regular porous metal microchannel heat sink using liquid metal working medium
07/03/2013CN103187491A Manufacturing method for chip-level led structure and led chip
07/03/2013CN103187404A Semiconductor chip stacking and packaging structure and process thereof
07/03/2013CN103187403A Semiconductor failure analysis structure, forming method of semiconductor failure analysis structure and failure time detection method thereof
07/03/2013CN103187402A Testing structure, forming method of testing structure and washing time judging method of washing process
07/03/2013CN103187401A Wafer heater and electronic mobility detector
07/03/2013CN103187400A Silicon through hole detection structure and detection method
07/03/2013CN103187399A Through-silicon via (TSV) testing structure and TSV testing method
07/03/2013CN103187398A Silicon through hole detection structure and detection method
07/03/2013CN103187397A 微加热装置 Micro-heating device
07/03/2013CN103187396A Semiconductor package with ultra-thin interposer without through-semiconductor vias
07/03/2013CN103187395A Interconnection structure of semiconductors and formation method
07/03/2013CN103187394A Packages with passive devices and methods of forming same
07/03/2013CN103187393A Structure and method for transformer with magnetic features
07/03/2013CN103187392A Metal line structure and forming method of
07/03/2013CN103187391A Semiconductor device and manufacturing method thereof
07/03/2013CN103187390A Through hole array with improved arrangement mode and semiconductor device comprising through hole array
07/03/2013CN103187389A Multilayer electronic structure with stair-stepping holes
07/03/2013CN103187388A Packaged semiconductor device and method of packaging the semiconductor device
07/03/2013CN103187387A Bump structure and electronic packaging solder joint structure and fabricating method thereof
07/03/2013CN103187386A Substrate structure, packaging structure and manufacturing method thereof
07/03/2013CN103187385A Substrate for chip-on-film (COF) package
07/03/2013CN103187384A Metal dielectric layer, manufacturing method thereof and circuit board
07/03/2013CN103187383A Package structure of Schottky diode
07/03/2013CN103187382A Aluminum alloy lead frame applied to power semiconductor component
07/03/2013CN103187381A 导线架封装结构 Lead frame package structure
07/03/2013CN103187380A Semiconductor device having a through-substrate via
07/03/2013CN103187379A Semiconductor stack structure and fabrication method thereof
07/03/2013CN103187378A Power semiconductor device and manufacturing method thereof
07/03/2013CN103187377A Semiconductor package with a bridge interposer
07/03/2013CN103187376A Integrated circuit packages having redistribution structures
07/03/2013CN103187375A Device and method for manufacturing an electronic device
07/03/2013CN103187374A Power component encapsulation structure
07/03/2013CN103187373A Heat-dissipation device
07/03/2013CN103187372A Chip package structure
07/03/2013CN103187371A Semiconductor structure and method for manufacturing the same
07/03/2013CN103187370A Side packaging structure of electronic module
07/03/2013CN103187365A Interlayer alignment of multi-layer support structure
07/03/2013CN103187324A Preparation method and structure of welding spot
07/03/2013CN103187323A Semiconductor chip and thickening manufacture method of pressure welding block metal layer of semiconductor chip
07/03/2013CN103187322A Fully molded fan-out
07/03/2013CN103187314A Package carrier and manufacturing method thereof
07/03/2013CN103187312A Fabrication method of rewiring layer in wafer level packaging structure and wafer level packaging structure
07/03/2013CN103187131A High heat conductivity insulation composite and preparation method thereof
07/03/2013CN103186208A Radiating device
07/03/2013CN103186059A Mask overlay method, mask, and semiconductor device using the same
07/03/2013CN103186039A Photosensitive novolac resin, positive photosensitive resin composition including same
07/03/2013CN103185476A Radiating structure of radiating unit
07/03/2013CN103184362A Alloy wire and methods for manufacturing the same
07/03/2013CN103184014A Adhesive composition for semiconductor, adhesive film and semiconductor device
07/03/2013CN103183925A Liquid resin composition used for electronic component and manufacturing method thereof, and electronic component device
07/03/2013CN103182817A Resin sheet for electronic component, manufacturing method of resin sheet for electronic component, and manufacturing method for semiconductor device
07/03/2013CN103182598A High-power automobile rectifier bridge soldering method and lug thereof
07/03/2013CN102244045B Diode chip and processing technology thereof
07/03/2013CN102237339B Metal electroplating layer structure on back of chip and preparation method thereof
07/03/2013CN102176444B High integration level system in package (SIP) structure
07/03/2013CN102169872B Power module of integrated inductor
07/03/2013CN102159060B Heat spreader for emissive display device
07/03/2013CN102074567B Backside illuminated imaging sensor with reinforced pad structure