Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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07/03/2013 | EP2610314A1 Phosphor-containing sheet, led light emitting device using same, and method for manufacturing led light emitting device |
07/03/2013 | EP2609634A2 Light source mount |
07/03/2013 | EP2609622A2 Wide input output memory with low density, low latency and high density, high latency blocks |
07/03/2013 | EP2609621A1 Electrical circuit having circuit components to be cooled, heat sink, and method for sealingly embedding an electrical circuit |
07/03/2013 | EP2609620A1 Method for producing an electrical circuit and electrical circuit |
07/03/2013 | CN203040098U Structure of temperature-uniforming plate |
07/03/2013 | CN203040084U Heat radiation combination device and fastener thereof |
07/03/2013 | CN203038929U Veneering packaging diode |
07/03/2013 | CN203038928U Large current/ high voltage diode |
07/03/2013 | CN203038922U Bipolar capacitance structure |
07/03/2013 | CN203038918U Flat package structure without outer lead on four sides |
07/03/2013 | CN203038917U CPI test structure |
07/03/2013 | CN203038916U TO220 packaging lead frame |
07/03/2013 | CN203038915U TO-252-3LB lead frame structure |
07/03/2013 | CN203038914U SOT26-3LB packaging lead frame |
07/03/2013 | CN203038913U EMMC memory integrated with NANDFLASH flash memory function |
07/03/2013 | CN203038912U LGA package storage device based on standard of SD/USB2.0/USB3.0 |
07/03/2013 | CN203038911U Heat radiation device based on liquid metal |
07/03/2013 | CN203038910U Liquid-cooled cooling device |
07/03/2013 | CN203038909U 半导体模块 Semiconductor Modules |
07/03/2013 | CN203038908U Semiconductor module |
07/03/2013 | CN203038907U Novel packaging sheet structure |
07/03/2013 | CN203038906U Semiconductor packaging structure with two layers of substrates |
07/03/2013 | CN203038905U Electronic device packaged by white casting glue |
07/03/2013 | CN103190205A Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board-module |
07/03/2013 | CN103190082A Electronic component |
07/03/2013 | CN103190010A Optoelectronic semiconductor component comprising a semiconductor chip, a carrier substrate and a film and a method for producing said component |
07/03/2013 | CN103190008A LED-element mounting lead frame, resin-attached lead frame, method of manufacturing semiconductor device, and semiconductor-element mounting lead frame |
07/03/2013 | CN103189979A Package inductance compensating tunable capacitor circuit |
07/03/2013 | CN103189978A Apparatus and method for thermal interfacing |
07/03/2013 | CN103189977A Laminate comprising an integrated electronic component |
07/03/2013 | CN103189976A Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies |
07/03/2013 | CN103189975A Package for storing electronic component elements |
07/03/2013 | CN103189974A Electronic-part package and piezoelectric vibration device |
07/03/2013 | CN103189973A Integrated circuit chip customization using backside access |
07/03/2013 | CN103189972A Method for forming isolation structure |
07/03/2013 | CN103189960A Treatment, before the bonding of a mixed copper oxide surface, by a plasma containing nitrogen and hydrogen |
07/03/2013 | CN103189464A Adhesive composition, method for producing semiconductor device, and semiconductor device |
07/03/2013 | CN103189421A Organosiloxane block copolymer |
07/03/2013 | CN103188920A Radiating device |
07/03/2013 | CN103188917A Heat radiation structure of radiator |
07/03/2013 | CN103188912A Lotus-type regular porous metal microchannel heat sink using liquid metal working medium |
07/03/2013 | CN103187491A Manufacturing method for chip-level led structure and led chip |
07/03/2013 | CN103187404A Semiconductor chip stacking and packaging structure and process thereof |
07/03/2013 | CN103187403A Semiconductor failure analysis structure, forming method of semiconductor failure analysis structure and failure time detection method thereof |
07/03/2013 | CN103187402A Testing structure, forming method of testing structure and washing time judging method of washing process |
07/03/2013 | CN103187401A Wafer heater and electronic mobility detector |
07/03/2013 | CN103187400A Silicon through hole detection structure and detection method |
07/03/2013 | CN103187399A Through-silicon via (TSV) testing structure and TSV testing method |
07/03/2013 | CN103187398A Silicon through hole detection structure and detection method |
07/03/2013 | CN103187397A 微加热装置 Micro-heating device |
07/03/2013 | CN103187396A Semiconductor package with ultra-thin interposer without through-semiconductor vias |
07/03/2013 | CN103187395A Interconnection structure of semiconductors and formation method |
07/03/2013 | CN103187394A Packages with passive devices and methods of forming same |
07/03/2013 | CN103187393A Structure and method for transformer with magnetic features |
07/03/2013 | CN103187392A Metal line structure and forming method of |
07/03/2013 | CN103187391A Semiconductor device and manufacturing method thereof |
07/03/2013 | CN103187390A Through hole array with improved arrangement mode and semiconductor device comprising through hole array |
07/03/2013 | CN103187389A Multilayer electronic structure with stair-stepping holes |
07/03/2013 | CN103187388A Packaged semiconductor device and method of packaging the semiconductor device |
07/03/2013 | CN103187387A Bump structure and electronic packaging solder joint structure and fabricating method thereof |
07/03/2013 | CN103187386A Substrate structure, packaging structure and manufacturing method thereof |
07/03/2013 | CN103187385A Substrate for chip-on-film (COF) package |
07/03/2013 | CN103187384A Metal dielectric layer, manufacturing method thereof and circuit board |
07/03/2013 | CN103187383A Package structure of Schottky diode |
07/03/2013 | CN103187382A Aluminum alloy lead frame applied to power semiconductor component |
07/03/2013 | CN103187381A 导线架封装结构 Lead frame package structure |
07/03/2013 | CN103187380A Semiconductor device having a through-substrate via |
07/03/2013 | CN103187379A Semiconductor stack structure and fabrication method thereof |
07/03/2013 | CN103187378A Power semiconductor device and manufacturing method thereof |
07/03/2013 | CN103187377A Semiconductor package with a bridge interposer |
07/03/2013 | CN103187376A Integrated circuit packages having redistribution structures |
07/03/2013 | CN103187375A Device and method for manufacturing an electronic device |
07/03/2013 | CN103187374A Power component encapsulation structure |
07/03/2013 | CN103187373A Heat-dissipation device |
07/03/2013 | CN103187372A Chip package structure |
07/03/2013 | CN103187371A Semiconductor structure and method for manufacturing the same |
07/03/2013 | CN103187370A Side packaging structure of electronic module |
07/03/2013 | CN103187365A Interlayer alignment of multi-layer support structure |
07/03/2013 | CN103187324A Preparation method and structure of welding spot |
07/03/2013 | CN103187323A Semiconductor chip and thickening manufacture method of pressure welding block metal layer of semiconductor chip |
07/03/2013 | CN103187322A Fully molded fan-out |
07/03/2013 | CN103187314A Package carrier and manufacturing method thereof |
07/03/2013 | CN103187312A Fabrication method of rewiring layer in wafer level packaging structure and wafer level packaging structure |
07/03/2013 | CN103187131A High heat conductivity insulation composite and preparation method thereof |
07/03/2013 | CN103186208A Radiating device |
07/03/2013 | CN103186059A Mask overlay method, mask, and semiconductor device using the same |
07/03/2013 | CN103186039A Photosensitive novolac resin, positive photosensitive resin composition including same |
07/03/2013 | CN103185476A Radiating structure of radiating unit |
07/03/2013 | CN103184362A Alloy wire and methods for manufacturing the same |
07/03/2013 | CN103184014A Adhesive composition for semiconductor, adhesive film and semiconductor device |
07/03/2013 | CN103183925A Liquid resin composition used for electronic component and manufacturing method thereof, and electronic component device |
07/03/2013 | CN103182817A Resin sheet for electronic component, manufacturing method of resin sheet for electronic component, and manufacturing method for semiconductor device |
07/03/2013 | CN103182598A High-power automobile rectifier bridge soldering method and lug thereof |
07/03/2013 | CN102244045B Diode chip and processing technology thereof |
07/03/2013 | CN102237339B Metal electroplating layer structure on back of chip and preparation method thereof |
07/03/2013 | CN102176444B High integration level system in package (SIP) structure |
07/03/2013 | CN102169872B Power module of integrated inductor |
07/03/2013 | CN102159060B Heat spreader for emissive display device |
07/03/2013 | CN102074567B Backside illuminated imaging sensor with reinforced pad structure |