Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2013
07/04/2013WO2013102146A1 Die up fully molded fan-out wafer level packaging
07/04/2013WO2013102137A2 Fully molded fan-out
07/04/2013WO2013101941A1 Field emission device
07/04/2013WO2013101919A1 Techniques for wafer-level processing of qfn packages
07/04/2013WO2013101910A1 Failure protection for a power delivery system
07/04/2013WO2013101849A1 Embedded through-silicon-via
07/04/2013WO2013101815A1 Embedded heat spreader for microelectronic package
07/04/2013WO2013101668A1 Barrier tape for keep-out zone management
07/04/2013WO2013101428A1 Heat exchange assembly and methods of assembling same
07/04/2013WO2013101365A1 Heat exchange assembly for use with electrical devices and methods of assembling an electrical device
07/04/2013WO2013101249A1 Fully integrated voltage regulators for multi-stack integrated circuit architectures
07/04/2013WO2013101242A1 Bbul top side substrate layer enabling dual sided silicon interconnect and stacking flexibility
07/04/2013WO2013101241A1 Organic thin film passivation of metal interconnections
07/04/2013WO2013101212A1 Direct air impingement cooling of package structures
07/04/2013WO2013101161A1 Bbul material integration in-plane with embedded die for warpage control
07/04/2013WO2013101156A1 Integration of laminate mems in bbul coreless package
07/04/2013WO2013101131A1 Integrated inductor for integrated circuit devices
07/04/2013WO2013101127A1 Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects
07/04/2013WO2013101102A1 Inductor design with metal dummy features
07/04/2013WO2013100995A1 Photonic package architecture
07/04/2013WO2013100951A1 Backside bulk silicon mems
07/04/2013WO2013100861A1 Miniature passive structures, high frequency electrostatic discharge protection networks, and high frequency electrostatic discharge protection schemes
07/04/2013WO2013098629A1 Semiconductor device
07/04/2013WO2013052411A4 Stub minimization for wirebond assemblies without windows
07/04/2013WO2013044094A8 Methods for reducing thermal resistance of carbon nanotube arrays or sheets
07/04/2013WO2012174449A3 Microelectronic device, stacked die package and computing system containing same, method of manufacturing a multi¬ channel communication pathway in same, and method of enabling electrical communication between components of a stacked-die package
07/04/2013US20130173214 Method and structure for inline electrical fin critical dimension measurement
07/04/2013US20130171776 Semiconductor device and method for manufacturing the same
07/04/2013US20130171760 Solid state image pickup device and method of producing solid state image pickup device
07/04/2013US20130171748 Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state
07/04/2013US20130168877 Mask overlay method, mask, and semiconductor device using the same
07/04/2013US20130168876 Module package and production method
07/04/2013US20130168875 Semiconductor device and package
07/04/2013US20130168874 Die up fully molded fan-out wafer level packaging
07/04/2013US20130168873 Power semiconductor device and manufacturing method thereof
07/04/2013US20130168872 Via arrangement and semiconductor device with the via arrangement
07/04/2013US20130168871 Semiconductor package with package on package structure
07/04/2013US20130168870 Device and method for manufacturing an electronic device
07/04/2013US20130168869 Metal Layout of an Integrated Power Transistor and the Method Thereof
07/04/2013US20130168868 Semiconductor stack structure and fabrication method thereof
07/04/2013US20130168867 Method for forming metal line in semiconductor device
07/04/2013US20130168866 Chip-on-lead package and method of forming
07/04/2013US20130168865 Semiconductor device having groove-shaped via-hole
07/04/2013US20130168864 Method for producing ultra-thin tungsten layers with improved step coverage
07/04/2013US20130168863 Enhanced diffusion barrier for interconnect structures
07/04/2013US20130168862 Method of manufacturing barrier layer patterns of a semiconductor memory device and structure of barrier layer patterns of semiconductor memory device
07/04/2013US20130168861 Electrically conductive device and manufacturing method thereof
07/04/2013US20130168860 Semiconductor Package with Ultra-Thin Interposer Without Through-Semiconductor Vias
07/04/2013US20130168858 Embedded wafer level ball grid array bar systems and methods
07/04/2013US20130168857 Molded interposer package and method for fabricating the same
07/04/2013US20130168856 Package on Package Devices and Methods of Packaging Semiconductor Dies
07/04/2013US20130168855 Methods and Apparatus for Package On Package Devices with Reduced Strain
07/04/2013US20130168854 Semiconductor Package with a Bridge Interposer
07/04/2013US20130168853 Package substrate and method of fabricating the same
07/04/2013US20130168852 MEMS Devices and Methods of Forming Same
07/04/2013US20130168851 Bump structure and electronic packaging solder joint structure and fabricating method thereof
07/04/2013US20130168850 Semiconductor device having a through-substrate via
07/04/2013US20130168849 Fully Molded Fan-Out
07/04/2013US20130168848 Packaged semiconductor device and method of packaging the semiconductor device
07/04/2013US20130168847 Anisotropic conductive film and electronic device including the same
07/04/2013US20130168846 Underfill process and materials for singulated heat spreader stiffener for thin core panel processing
07/04/2013US20130168845 Semiconductor module
07/04/2013US20130168844 Metal injection molded heat dissipation device
07/04/2013US20130168843 Embedded heat spreader for package with multiple microelectronic elements and face-down connection
07/04/2013US20130168842 Integrated circuit packages having redistribution structures
07/04/2013US20130168841 Programmable Interposer with Conductive Particles
07/04/2013US20130168840 Semiconductor integrated device with mechanically decoupled active area and related manufacturing process
07/04/2013US20130168839 Apparatus for integrated circuit packaging
07/04/2013US20130168838 Inserts for directing molding compound flow and semiconductor die assemblies
07/04/2013US20130168837 Esd protection device
07/04/2013US20130168835 High resistivity silicon-on-insulator substrate and method of forming
07/04/2013US20130168832 Semiconductor device
07/04/2013US20130168831 Laser beam machining method and semiconductor chip
07/04/2013US20130168830 Semiconductor wafer plating bus
07/04/2013US20130168809 Structure and method for a transformer with magnetic features
07/04/2013US20130168807 Interconnect structure containing various capping materials for electrical fuse and other related applications, and design structure thereof
07/04/2013US20130168806 Electrical fuse structure and method of fabricating same
07/04/2013US20130168799 Semiconductor device having groove-shaped via-hole
07/04/2013US20130168694 Super integrated circuit chip semiconductor device
07/04/2013US20130168674 Methods and Systems for Repairing Interior Device Layers in Three-Dimensional Integrated Circuits
07/04/2013US20130168673 Intra Die Variation Monitor Using Through-Silicon Via
07/04/2013US20130168672 Multichip Module with Reroutable Inter-Die Communication
07/04/2013US20130168338 Supporting apparatus
07/04/2013US20130168063 Electronic device with thermal structure
07/04/2013US20130167907 Photovoltaic Mounting Apparatus and Method of Installation
07/04/2013DE102013000057A1 Alloy wire made of material comprising silver-gold alloy, silver-palladium alloy and silver-gold-palladium alloy, useful for wire bonding of components of electronic devices, comprises base wire, and layer of plated metal coating
07/04/2013DE102012200384A1 Auf einem Träger angeordnete Schaltungsanordnung mit Temperaturüberwachung und Verfahren zum Erkennen einer Übertemperatur Arranged on a carrier circuit arrangement with temperature control and method for detecting an overtemperature
07/04/2013DE102012113139A1 Leistungshalbleitervorrichtung und Herstellungsverfahren dafür Power semiconductor device and manufacturing method thereof
07/04/2013DE102012113012A1 Elektronische Vorrichtung und Verfahren zum Herstellen einer elektronischen Vorrichtung An electronic device and method for manufacturing an electronic device
07/04/2013DE102012110694A1 Temperaturmanagementschaltung, Ein-Chip-System, welches dieselbe aufweist, und Verfahren zum Managen der Temperatur Temperature management circuit, one-chip system comprising the same, and method for managing the temperature
07/04/2013DE102012109484A1 Gepackte Halbleitervorrichtung und Verfahren zum Packen der Halbleitervorrichtung A semiconductor device package and method for packaging the semiconductor device
07/04/2013DE102009049613B4 Leistungshalbleitervorrichtung Power semiconductor device
07/04/2013DE102007046349B4 Anordnung zum Kühlen eines Leistungshalbleitermoduls An arrangement for cooling a power semiconductor module
07/04/2013DE10164502B4 Verfahren zur hermetischen Verkapselung eines Bauelements Process for hermetic encapsulation of a component
07/03/2013EP2611033A2 Gate driver with digital ground
07/03/2013EP2610908A1 Cooling device
07/03/2013EP2610907A1 Stacked electronic device and method for manufacturing such an electronic device
07/03/2013EP2610905A2 Packaging method for electronic components using a thin substrate
07/03/2013EP2610904A2 Packaging method for electronic components using a thin substrate
07/03/2013EP2610903A2 Packaging method for electronic components using a thin substrate
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