| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/10/2013 | CN103199085A Dual DNW isolation structures for reducing RF noise on high voltage semiconductor devices |
| 07/10/2013 | CN103199084A Substrate align marks and manufacturing method thereof and substrate |
| 07/10/2013 | CN103199083A Composite copper spreading retaining layer and manufacturing method thereof |
| 07/10/2013 | CN103199082A Semiconductor device |
| 07/10/2013 | CN103199081A Mim capacitor and manufacturing method thereof |
| 07/10/2013 | CN103199080A Interlevel dielectric stack for interconnect structures and formation method therefor |
| 07/10/2013 | CN103199079A Multilayer electronic structure with a through-thickness coaxial structure |
| 07/10/2013 | CN103199078A Multilayer electronic support structure with integrated structure constituent |
| 07/10/2013 | CN103199077A Molded interposer package and method for fabricating the same |
| 07/10/2013 | CN103199076A Packaging structure and manufacturing method thereof |
| 07/10/2013 | CN103199075A Wafer level semiconductor encapsulation structure with stacking chips and manufacturing method thereof |
| 07/10/2013 | CN103199074A Semiconductor device including semiconductor chip mounted on lead frame |
| 07/10/2013 | CN103199073A Silver palladium alloy monocrystal bonding wire and manufacturing method thereof |
| 07/10/2013 | CN103199072A Gold-plated palladium-copper single-crystal bonding wire and manufacturing method thereof |
| 07/10/2013 | CN103199071A Stacking type packaging structure and manufacturing method thereof |
| 07/10/2013 | CN103199070A Semiconductor element with passivation segment and manufacturing method thereof |
| 07/10/2013 | CN103199069A Device including two power semiconductor chips and manufacturing thereof |
| 07/10/2013 | CN103199068A Integration circuit integrated structure |
| 07/10/2013 | CN103199067A Low-thermal-resistance bridge rectifier with main heat-conducting surface made of aluminum-base copper-clad plates |
| 07/10/2013 | CN103199066A Rib-line-type radiator and manufacturing method |
| 07/10/2013 | CN103199065A Semiconductor stacked package and method of fabricating the same |
| 07/10/2013 | CN103199063A Semiconductor devices having dielectric caps on contacts and related fabrication methods |
| 07/10/2013 | CN103199056A Dielectric material with high mechanical strength |
| 07/10/2013 | CN103199055A Packages and method of forming the same |
| 07/10/2013 | CN103199027A UBM formation for integrated circuits |
| 07/10/2013 | CN103198944A Electric tool switch with diode |
| 07/10/2013 | CN103198878A Circuit connection structure |
| 07/10/2013 | CN103196595A A sensor arrangement and a method for forming the sensor arrangement, a measurement circuit, and chip-packages |
| 07/10/2013 | CN103194712A High-heat-conductivity tungsten-copper heat sink and electronic packaging material, and preparation method thereof |
| 07/10/2013 | CN103194043A Photosemiconductor package sealing resin material |
| 07/10/2013 | CN102376677B Semiconductor encapsulating structure and manufacturing method thereof |
| 07/10/2013 | CN102376610B Integrated circuit module and methods of manufacturing the same |
| 07/10/2013 | CN102315213B SRAM cell and semiconductor structure |
| 07/10/2013 | CN102281702B Substrate layout and forming method thereof |
| 07/10/2013 | CN102176431B Semiconductor assembly and semiconductor packaging structure having the semiconductor assembly |
| 07/10/2013 | CN102110685B 像素结构以及显示面板 The pixel structure and a display panel |
| 07/10/2013 | CN102097427B Laminate electronic device |
| 07/10/2013 | CN102066045B Gold-tin-indium solder for processing compatibility with lead-free tin-based solder |
| 07/10/2013 | CN102034721B Method for encapsulating chip |
| 07/10/2013 | CN102027585B Circuit module and method of manufacturing the same |
| 07/10/2013 | CN101946317B Electronic component, electronic apparatus, and base member manufacturing method |
| 07/10/2013 | CN101772775B Tamper-resistant semiconductor device and methods of manufacturing thereof |
| 07/10/2013 | CN101749656B LED lamp |
| 07/10/2013 | CN101728354B Electronic device and manufacturing method for electronic device |
| 07/10/2013 | CN101673728B Model and method for measuring resistance of contact holes or through holes in bipolar transistor components |
| 07/10/2013 | CN101597475B Encapsulation material composition and encapsulation material manufacture method |
| 07/10/2013 | CN101188238B Semiconductor component |
| 07/09/2013 | USRE44355 Method of forming a bump-on-lead flip chip interconnection having higher escape routing density |
| 07/09/2013 | US8484595 Semiconductor integrated circuit device, design method, design apparatus, and program |
| 07/09/2013 | US8482957 Three dimensionally stacked non volatile memory units |
| 07/09/2013 | US8482139 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards |
| 07/09/2013 | US8482137 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same |
| 07/09/2013 | US8482136 Fan-out chip scale package |
| 07/09/2013 | US8482135 Method for producing a component and device having a component |
| 07/09/2013 | US8482134 Stackable package and method |
| 07/09/2013 | US8482133 Semiconductor package |
| 07/09/2013 | US8482132 Pad bonding employing a self-aligned plated liner for adhesion enhancement |
| 07/09/2013 | US8482131 Via structure |
| 07/09/2013 | US8482130 Interconnect structure comprising blind vias intended to be metalized |
| 07/09/2013 | US8482129 Wafer-level stack package and method of fabricating the same |
| 07/09/2013 | US8482128 Flash memory storage apparatus |
| 07/09/2013 | US8482127 Post passivation interconnection schemes on top of IC chip |
| 07/09/2013 | US8482126 Semiconductor device |
| 07/09/2013 | US8482125 Conductive sidewall for microbumps |
| 07/09/2013 | US8482123 Stress reduction in chip packaging by using a low-temperature chip-package connection regime |
| 07/09/2013 | US8482122 Conductive pad structure, chip package structure and device substrate |
| 07/09/2013 | US8482121 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus |
| 07/09/2013 | US8482120 Combined heat sink multi-configuration processor memory substrate device |
| 07/09/2013 | US8482119 Semiconductor chip assembly |
| 07/09/2013 | US8482118 Integrated circuit micro-module |
| 07/09/2013 | US8482117 Semiconductor device with electronic component incorporation substrate |
| 07/09/2013 | US8482116 Semiconductor device having stacked components |
| 07/09/2013 | US8482115 Integrated circuit packaging system with dual side connection and method of manufacture thereof |
| 07/09/2013 | US8482114 Impedance optimized chip system |
| 07/09/2013 | US8482113 Semiconductor device |
| 07/09/2013 | US8482112 Semiconductor package |
| 07/09/2013 | US8482111 Stackable molded microelectronic packages |
| 07/09/2013 | US8482109 Integrated circuit packaging system with dual connection and method of manufacture thereof |
| 07/09/2013 | US8482107 Circular shield of a circuit-substrate laminated module and electronic apparatus |
| 07/09/2013 | US8482106 Method for producing ceramic passivation layers on silicon for solar cell manufacture |
| 07/09/2013 | US8482072 Semiconductor die with integrated electro-static discharge device |
| 07/09/2013 | US8482071 Diode biased ESD protection device and method |
| 07/09/2013 | US8482058 Semiconductor device including a power MISFET |
| 07/09/2013 | US8482039 Memory and interconnect design in fine pitch |
| 07/09/2013 | US8482026 Optoelectronic component |
| 07/09/2013 | US8482023 Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method |
| 07/09/2013 | US8482015 LED light emitting apparatus and vehicle headlamp using the same |
| 07/09/2013 | US8482003 Image display unit |
| 07/09/2013 | US8482002 Semiconductor device including bonding pads and semiconductor package including the semiconductor device |
| 07/09/2013 | US8481995 Image display panel and image display apparatus having one adhesive formed around another adhesive of predetermined volume resistance |
| 07/09/2013 | US8481993 Semiconductor composite film, method for forming semiconductor composite film, thin film transistor, method for manufacturing thin film transistor, and electronic apparatus |
| 07/09/2013 | US8481868 Junction box |
| 07/09/2013 | US8481656 Silicone resin composition and optical semiconductor device using the composition |
| 07/09/2013 | US8481416 Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same |
| 07/09/2013 | US8481370 Semiconductor device and method for manufacturing the same |
| 07/09/2013 | US8481365 MEMS devices |
| 07/09/2013 | US8481364 Flexible micro-system and fabrication method thereof |
| 07/09/2013 | US8480580 Analyte monitoring device and methods of use |
| 07/09/2013 | US8479804 Heat dissipation device with two spring fastners |
| 07/09/2013 | CA2484653C Method and apparatus for two dimensional assembly of particles |