| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/04/2015 | EP2831913A1 Method of providing a via hole and routing structure |
| 02/04/2015 | EP2831912A1 Conduction cooling of multi-channel flip chip based panel array circuits |
| 02/04/2015 | EP2831175A1 Curable silicone composition, cured product thereof, and optical semiconductor device |
| 02/04/2015 | EP2831078A2 Novel fused naphthalene cyclohetero ring compounds, and methods and uses thereof |
| 02/04/2015 | CN204144255U 两只脚引脚式光敏触发闪灯led Two feet led flash trigger pin type photosensitive |
| 02/04/2015 | CN204144253U 一种快恢复二极管模块 In fast recovery diode module |
| 02/04/2015 | CN204144249U Goi_tddb测试电路结构 Goi_tddb test circuit structure |
| 02/04/2015 | CN204144248U 一种测试结构 A test structure |
| 02/04/2015 | CN204144247U 三维封装结构 Three-dimensional packaging structure |
| 02/04/2015 | CN204144246U 一种射频功放模块、射频模块及基站 A radio frequency power amplifier module, RF module and base station |
| 02/04/2015 | CN204144245U 多芯片堆叠倒正装有基岛复合式平脚金属框架结构 Are equipped with multi-chip stack fall flat foot base island composite metal frame structure |
| 02/04/2015 | CN204144244U 多芯片堆叠倒装有基岛复合式平脚金属框架结构 There are more flip chip stacking base island composite flat foot metal frame structure |
| 02/04/2015 | CN204144243U 一种贴片式二极管的结构 A patch diode structure |
| 02/04/2015 | CN204144242U 一种新型服务器芯片热管液冷散热装置 A new server chip heat pipe liquid cooling device |
| 02/04/2015 | CN204144241U 四只脚引脚式封装用于控制喇叭的ic Four legs pin package is used to control the speaker ic |
| 02/04/2015 | CN204144240U 一种Ka波段T/R组件封装结构 One kind of Ka-band T / R module package structure |
| 02/04/2015 | CN204144239U 一种等面积大功率裸芯片的叠层装配结构 One kind of equal-area power stacked die assembly structure |
| 02/04/2015 | CN204144238U 大功率半导体芯片的封装组件 High-power semiconductor chip package assembly |
| 02/04/2015 | CN204144237U 输入输出构件以及电子部件收纳用封装件以及电子装置 Input and output member, and with the package housing an electronic component and an electronic device |
| 02/04/2015 | CN204143793U 一种led集成像素封装模组及其高清显示屏 One kind of led module and integrated package pixel HD display |
| 02/04/2015 | CN104335374A 热电变换装置的制造方法、具备热电变换装置的电子装置的制造方法、热电变换装置 Thermoelectric conversion device manufacturing method, a method of manufacturing a thermoelectric conversion apparatus comprising an electronic device, the thermoelectric conversion device |
| 02/04/2015 | CN104335346A 用于esd保护的半导体器件 Esd protection for semiconductor devices |
| 02/04/2015 | CN104335345A 布线基板以及电子装置 A printed circuit board and an electronic device |
| 02/04/2015 | CN104335344A 复合模块 Composite Modules |
| 02/04/2015 | CN104335343A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/04/2015 | CN104335342A 反向微电子封装上的微电子器件附着 Reverse microelectronic packaging microelectronic device on the attachment |
| 02/04/2015 | CN104335341A 具有布置在内插器与衬底之间的微电子装置的微电子结构 Having a microelectronic structure is arranged between the interposer and the substrate microelectronic device |
| 02/04/2015 | CN104335335A 半导体构造及形成半导体构造的方法 The semiconductor structure and a method of forming a semiconductor structure |
| 02/04/2015 | CN104333971A 一种印刷电路板及显示装置 A printed circuit board and display device |
| 02/04/2015 | CN104332465A 一种3d封装结构及其工艺方法 One kind of 3d package structure and process methods |
| 02/04/2015 | CN104332463A 多芯片器件 Multi-chip device |
| 02/04/2015 | CN104332461A 一种多片式高压驱动电路 A multi-chip high-voltage driver circuit |
| 02/04/2015 | CN104332460A 沟槽形貌监控方法以及沟槽形貌监控结构制作方法 Trench morphology monitoring methods and method of making the trench structure morphology monitoring |
| 02/04/2015 | CN104332459A 一种接触孔可靠性测试装置 A contact hole reliability testing device |
| 02/04/2015 | CN104332458A 功率芯片互连结构及其互连方法 Power chip interconnect structure and interconnection method |
| 02/04/2015 | CN104332457A 高密度IO互连PoP堆叠封装结构及其制造工艺 High-density IO Interconnect PoP stacked package structure and manufacturing process |
| 02/04/2015 | CN104332456A 晶圆级扇出型堆叠封装结构及其制造工艺 Fan-out wafer level stacked package structure and manufacturing process |
| 02/04/2015 | CN104332455A 一种基于硅通孔的片上半导体器件结构及其制备方法 An on-chip silicon vias semiconductor device structure based on its preparation method |
| 02/04/2015 | CN104332454A 半导体装置 Semiconductor device |
| 02/04/2015 | CN104332453A 基于塑封式ipm引线框架的双边固定散热结构 Based on bilateral fixed thermal structure of the lead frame plastic type ipm |
| 02/04/2015 | CN104332452A 芯片封装模组 Chip package module |
| 02/04/2015 | CN104332451A 一种光耦封装支架 One kind of optocoupler package bracket |
| 02/04/2015 | CN104332450A 用于玻璃胶涂布的掩膜板和采用该掩膜板的涂布方法 Mask for glass, plastic coating and the coating method using the mask plate |
| 02/04/2015 | CN104332449A 一种to-126型封装件 One kind of to-126-type package |
| 02/04/2015 | CN104332448A 溢出通路 Overflow passage |
| 02/04/2015 | CN104332447A 电极的构造,构成材料及其制造方法 Electrode configuration, the constituent material and manufacturing method thereof |
| 02/04/2015 | CN104332446A Dbc基板 Dbc board |
| 02/04/2015 | CN104332445A Igbt模块封装结构的固定装置 Fixtures Igbt module package structure |
| 02/04/2015 | CN104332444A 在3d管芯对管芯堆叠过程中管芯翘曲的解决方案 In 3d die stack of die during die warpage solution |
| 02/04/2015 | CN104332418A 芯片级封装方法 Chip-level packaging method |
| 02/04/2015 | CN104332412A 封装基板、封装结构以及封装基板的制作方法 The method of making a package substrate, the package structure and the package substrate |
| 02/04/2015 | CN103361528B 镁合金led灯泡散热器压铸件及其制造方法 Magnesium alloy die casting radiator led bulb and its manufacturing method |
| 02/04/2015 | CN103021978B 集成电路芯片上供封装的焊垫结构 Pad structure integrated circuit chip package altar |
| 02/04/2015 | CN102956477B 锗硅hbt发射极光刻对准精度优化的方法 SiGe hbt auroral emission optimization method engraved alignment accuracy |
| 02/04/2015 | CN102954903B 锗硅薄膜监控片的制备方法及采用该片进行监控的方法 Preparation SiGe film sheet and monitoring method to monitor the use of the sheet |
| 02/04/2015 | CN102938382B 阵列基板制造方法及阵列基板、显示装置 Array substrate and method of manufacturing an array substrate, a display device |
| 02/04/2015 | CN102911501B 树脂组合物及其应用的基板 Base resin composition and application of |
| 02/04/2015 | CN102832190B 一种倒装芯片的半导体器件及制造方法 Semiconductor device and method of manufacturing a flip chip |
| 02/04/2015 | CN102790033B 封装结构及其制作方法 Package structure and manufacturing method thereof |
| 02/04/2015 | CN102779811B 一种芯片封装及封装方法 A chip packaging and packaging methods |
| 02/04/2015 | CN102730617B 集成磁和加速度传感器的封装结构及其封装方法 Package and packaging method integrated magnetic and acceleration sensors |
| 02/04/2015 | CN102714189B 用于穿通硅通路的完整空隙填充 For through-silicon vias complete void fill |
| 02/04/2015 | CN102709273B 用于连接平板显示设备的信号线的短路线结构 Short route for connecting flat panel display device structure of signal lines |
| 02/04/2015 | CN102683308B 穿硅通孔结构及其形成方法 Through silicon vias structure and method of forming |
| 02/04/2015 | CN102656684B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/04/2015 | CN102623421B 微均温板结构 Micro average temperature board structure |
| 02/04/2015 | CN102610587B 缓冲元件及应用此缓冲元件的倒装芯片软膜接合方法 Flip-chip soft cushion membrane components and apply this cushion engagement element method |
| 02/04/2015 | CN102610584B 用于基板的交错布置的引脚结构 Staggered board structure for the pin arrangement |
| 02/04/2015 | CN102590579B 用于di/dt电流感测的方法及装置 Methods for di / dt and current sensing means |
| 02/04/2015 | CN102569171B 改善冠状缺陷的线路结构及其制作方法 Improving the structure and method of making the coronal line defect |
| 02/04/2015 | CN102549739B 具有非均匀介电层厚度的ic封装 Ic package with a non-uniform thickness of the dielectric layer |
| 02/04/2015 | CN102543775B 半导体装置的制造方法及制造装置 The method of manufacturing a semiconductor device manufacturing apparatus and |
| 02/04/2015 | CN102142401B 层压电子器件 Laminated electronic devices |
| 02/04/2015 | CN102074536B 功率半导体装置及其制造方法 The power semiconductor device and manufacturing method thereof |
| 02/04/2015 | CN102034780B 集成电路芯片、具有该芯片的倒装芯片封装和其制造方法 IC chip, the chip flip chip package and method for manufacturing |
| 02/04/2015 | CN102005433B 带连接端子的基板 Tape substrate connecting terminal |
| 02/04/2015 | CN101944523B 具有连接端子的基板 A substrate having a connecting terminal |
| 02/04/2015 | CN101924097B 用于检测集成电路芯片的衬底变薄的器件 The substrate for detecting the integrated circuit chip thinned device |
| 02/04/2015 | CN101907922B 一种触感触控系统 One kind of touch-touch system |
| 02/04/2015 | CN101803014B 形成用于改进微电子封装中的第一级互连和环氧树脂底部填料之间的粘结的纳米涂层的方法以及由此形成的结构 The method of forming a nano coating layer for improving the adhesion of a first stage in microelectronic packaging and interconnection between the epoxy underfill, and the structure thus formed |
| 02/04/2015 | CN101740623B 具有槽屏蔽电极结构的半导体器件 Having a groove shield electrode structure for a semiconductor device |
| 02/03/2015 | US8947889 Conformal electromagnetic (EM) detector |
| 02/03/2015 | US8947887 Package assembly and method of tuning a natural resonant frequency of a package |
| 02/03/2015 | US8947886 Electronic component |
| 02/03/2015 | US8947883 Low profile wire bonded USB device |
| 02/03/2015 | US8947679 Portable handheld device with multi-core microcoded image processor |
| 02/03/2015 | US8947592 Handheld imaging device with image processor provided with multiple parallel processing units |
| 02/03/2015 | US8947117 Signal transmission circuit device, semiconductor device, method and apparatus for inspecting semiconductor device, signal transmission device, and motor drive apparatus using signal transmission device |
| 02/03/2015 | US8947109 Protection device, corresponding method and computer software product |
| 02/03/2015 | US8946988 Display device and method for manufacturing the same |
| 02/03/2015 | US8946983 Phosphor-containing sheet, LED light emitting device using the same, and method for manufacturing LED |
| 02/03/2015 | US8946914 Contact power rail |
| 02/03/2015 | US8946913 Short and low loop wire bonding |
| 02/03/2015 | US8946912 Active area bonding compatible high current structures |
| 02/03/2015 | US8946911 Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board |
| 02/03/2015 | US8946909 Semiconductor package having gap-filler injection-friendly structure |
| 02/03/2015 | US8946908 Dual-metal self-aligned wires and vias |
| 02/03/2015 | US8946907 Self-aligned nano-structures |
| 02/03/2015 | US8946906 Multilayer wiring substrate and method of manufacturing the same |
| 02/03/2015 | US8946905 Via structure for integrated circuits |