| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/11/2013 | WO2013074454A3 Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
| 07/11/2013 | WO2013072897A3 Active shield with electrically configurable interconnections |
| 07/11/2013 | WO2013062397A4 Design for a support for mounting a microelectronic chip for a 5x3.2 mm half-etched dfn housing with a ground pin |
| 07/11/2013 | WO2013052672A3 Power management applications of interconnect substrates |
| 07/11/2013 | WO2013052320A4 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate |
| 07/11/2013 | US20130176682 Power electronic system with a cooling device |
| 07/11/2013 | US20130176073 Back-end electrically programmable fuse |
| 07/11/2013 | US20130175709 Integrated circuit package and method of assembling an integrated circuit package |
| 07/11/2013 | US20130175708 Semiconductor device with a semiconductor chip connected in a flip chip manner |
| 07/11/2013 | US20130175707 Substrate structure, semiconductor package device, and manufacturing method of semiconductor package |
| 07/11/2013 | US20130175705 Stress Compensation Layer for 3D Packaging |
| 07/11/2013 | US20130175704 Discrete power transistor package having solderless dbc to leadframe attach |
| 07/11/2013 | US20130175703 Semiconductor device and method of manufacturing semiconductor device |
| 07/11/2013 | US20130175702 Semiconductor package |
| 07/11/2013 | US20130175701 Semiconductor Device and Method of Forming Reduced Surface Roughness in Molded Underfill for Improved C-SAM Inspection |
| 07/11/2013 | US20130175700 Semiconductor die connection system and method |
| 07/11/2013 | US20130175699 Stackable microelectronic package structures |
| 07/11/2013 | US20130175698 Integrated Circuit Constructions Having Through Substrate Vias And Methods Of Forming Integrated Circuit Constructions Having Through Substrate Vias |
| 07/11/2013 | US20130175697 Interlevel Dielectric Stack for Interconnect Structures |
| 07/11/2013 | US20130175696 Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief |
| 07/11/2013 | US20130175695 Semiconductor device structures and memory devices including a uniform pattern of conductive material |
| 07/11/2013 | US20130175694 Packages and Method of Forming the Same |
| 07/11/2013 | US20130175693 Semiconductor devices |
| 07/11/2013 | US20130175692 Semiconductor device having groove-shaped via-hole |
| 07/11/2013 | US20130175691 Semiconductor device having groove-shaped via-hole |
| 07/11/2013 | US20130175690 Power Semiconductor Device with Reduced Contact Resistance |
| 07/11/2013 | US20130175689 Bonding pad and method of making same |
| 07/11/2013 | US20130175688 Tin-based solder ball and semiconductor package including the same |
| 07/11/2013 | US20130175687 Package stack device and fabrication method thereof |
| 07/11/2013 | US20130175686 Enhanced Flip Chip Package |
| 07/11/2013 | US20130175685 UBM Formation for Integrated Circuits |
| 07/11/2013 | US20130175684 Integrated Circuit Packaging With Ball Grid Array Having Differential Pitch To Enhance Thermal Performance |
| 07/11/2013 | US20130175683 Semiconductor Device And Bump Formation Process |
| 07/11/2013 | US20130175682 Semiconductor device and information processing system including the same |
| 07/11/2013 | US20130175681 Chip package structure |
| 07/11/2013 | US20130175680 Dielectric material with high mechanical strength |
| 07/11/2013 | US20130175679 Optoisolator leadframe assembly |
| 07/11/2013 | US20130175678 Power Semiconductor Module and Manufacturing Method Thereof |
| 07/11/2013 | US20130175677 Integrated Circuit Device With Wire Bond Connections |
| 07/11/2013 | US20130175676 High frequency circuit comprising graphene and method of operating the same |
| 07/11/2013 | US20130175673 Integrated circuit devices including through-silicon-vias having integral contact pads |
| 07/11/2013 | US20130175658 Tone inversion with partial underlayer etch for semiconductor device formation |
| 07/11/2013 | US20130175563 Led chip structure, packaging substrate, package structure and fabrication method thereof |
| 07/11/2013 | US20130175528 Chip on film package including test pads and semiconductor devices including the same |
| 07/11/2013 | US20130175527 Sensor arrangement, a measurement circuit, chip-packages and a method for forming a sensor arrangement |
| 07/11/2013 | US20130174891 Photovoltaic array system, photovoltaic device thereof, and frame element of photovoltaic device thereof |
| 07/11/2013 | DE112011103323T5 Kunststoffzusammensetzung Plastic composition |
| 07/11/2013 | DE112011103222T5 Verfahren zum Ausbilden vollständig eingelassener, kontakthöckerfreier Aufbauschichtverpackungen und dadurch ausgebildete Strukturen A method of forming completely sunken, contact bump-free design layer packaging and thus formed structures |
| 07/11/2013 | DE102013100160A1 Sensoranordnung, Messschaltkreis, Chipgehäuse und Verfahren zum Herstellen einer Sensoranordnung Sensor arrangement, measurement circuit, chip package and method for manufacturing a sensor arrangement |
| 07/11/2013 | DE102013100156A1 Semiconductor package useful in e.g. current sensors and thermal sensors, comprises isolating container e.g. glass having a recess, semiconductor chip disposed in recess, and backplane disposed under membrane portion of isolating container |
| 07/11/2013 | DE102013100042A1 Halbleitervorrichtung, Halbleitersystem, und Verfahren zur Herstellung der Halbleitervorrichtung A semiconductor device, semiconductor system, and method for manufacturing the semiconductor device |
| 07/11/2013 | DE102012200278A1 Unpackaged power semiconductor e.g. FET for use in circuit carrier, has electrical conductive individual-conductors extending transverse to surface area, where part of each conductor is connected with surface area in end region |
| 07/11/2013 | DE102012200273A1 Elektronisches Bauteil mit korrosionsgeschützter Bondverbindung und Verfahren zur Herstellung des Bauteils Electronic component with a corrosion-resistant bond, and methods of producing the component |
| 07/11/2013 | DE102009005915B4 Leistungshalbleitermodul in Druckkontaktausführung Power semiconductor module in pressure contact design |
| 07/11/2013 | DE102008008920B4 Verfahren zur Herstellung eines vertikalen Leistungstransistors Process for the preparation of a vertical power transistor |
| 07/11/2013 | DE102005061553B4 Chipmodul Chip module |
| 07/10/2013 | EP2613372A1 Light emitting device, and package array for light emitting device |
| 07/10/2013 | EP2613353A1 Cooling device, printed circuit board unit, and electronic device |
| 07/10/2013 | EP2613352A2 Discrete power transistor package having solderless dbc to leadframe attach |
| 07/10/2013 | EP2613351A1 Semiconductor module |
| 07/10/2013 | EP2613350A1 Semiconductor module |
| 07/10/2013 | EP2613349A1 Semiconductor package with improved thermal properties |
| 07/10/2013 | EP2613348A1 Mounting structure for electronic component |
| 07/10/2013 | EP2612884A1 Thermosetting epoxy resin composition and uses thereof |
| 07/10/2013 | EP2612879A1 Polyimide resin composition and laminate including same |
| 07/10/2013 | EP2612755A1 Thermally conductive sheet |
| 07/10/2013 | EP2612356A2 Ramp-stack chip package with static bends |
| 07/10/2013 | EP2612355A2 Manufacturing fixture for a ramp-stack chip package |
| 07/10/2013 | EP2612354A2 A light emitting apparatus |
| 07/10/2013 | EP2612347A2 Treatment, before the bonding of a mixed copper oxide surface, by a plasma containing nitrogen and hydrogen |
| 07/10/2013 | CN203056341U Electric connector assembly and holding apparatus thereof |
| 07/10/2013 | CN203055905U Thyristor radiator of excitation device |
| 07/10/2013 | CN203055904U Power hybrid integrated circuit with high integrated level |
| 07/10/2013 | CN203055903U Multilayer packaging substrate structure |
| 07/10/2013 | CN203055902U Packaging piece for lead framework with additional auxiliary pad pasting pins |
| 07/10/2013 | CN203055901U Single-chip package capable of realizing SMT (surface mount technology) based on frame |
| 07/10/2013 | CN203055900U Semiconductor encapsulation mechanism |
| 07/10/2013 | CN203055899U Wafer-thinning single-chip encapsulation piece with copper pillars |
| 07/10/2013 | CN203055898U FCAAQFN packaging member for re-wiring on lead wire frame |
| 07/10/2013 | CN203055897U Stacked forced refrigeration thyristor air channels |
| 07/10/2013 | CN203055896U Heat pipe pin fin type IGBT heat radiation device |
| 07/10/2013 | CN203055895U IGBT apparatus |
| 07/10/2013 | CN203055894U Improved radiator |
| 07/10/2013 | CN203055893U Re-wiring thermal enhanced FCQFN packaging device |
| 07/10/2013 | CN203055892U Double row lead quad flat non-leaded package through insulation by green paint |
| 07/10/2013 | CN203055891U PCB carrier and carrier tape used for small-size molding-package card |
| 07/10/2013 | CN203055890U Cavity direct-inserted power housing |
| 07/10/2013 | CN203055889U Apparatus for increasing IGBT creepage distance |
| 07/10/2013 | CN103201898A Electromagnetic resonance coupler |
| 07/10/2013 | CN103201862A Water resistant surface mount device package |
| 07/10/2013 | CN103201836A Stackable molded microelectronic packages with area array unit connectors |
| 07/10/2013 | CN103201835A Microelectronic package with dual or multiple - etched flip -chip connectors and corresponding manufacturing method |
| 07/10/2013 | CN103201834A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 07/10/2013 | CN103201833A Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic package |
| 07/10/2013 | CN103201829A Circuit device and method for manufacturing same |
| 07/10/2013 | CN103201318A Process for preparing resin-linear organosiloxane block copolymers |
| 07/10/2013 | CN103200765A Electronic package structure |
| 07/10/2013 | CN103199713A Environment-friendly type bridge rectifier |
| 07/10/2013 | CN103199170A System-level photoelectric structure and manufacturing method thereof |
| 07/10/2013 | CN103199086A Silicon substrate pinboard with micro-channel structure with shielding function and manufacturing method thereof |