| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/17/2013 | CN103208463A Heat sink material element with box-type structure and manufacturing method thereof |
| 07/17/2013 | CN103208462A Semiconductor packages and methods for producing the same |
| 07/17/2013 | CN103208461A Semiconductor Device And Process For Producing Semiconductor Device |
| 07/17/2013 | CN103208460A Production method of package substrate |
| 07/17/2013 | CN103208457A Manufacturing Method Of Semiconductor Device |
| 07/17/2013 | CN103208435A Method for of bonding parts to substrate using soldering paste |
| 07/17/2013 | CN103208434A Method for forming sealed electrical feedthroughs through encapsulation package and elcapsulation package provided with at least one such electrical feedthrough |
| 07/17/2013 | CN103208431A Semiconductor package structure and manufacturing method thereof |
| 07/17/2013 | CN103208428A Package substrate and production method thereof |
| 07/17/2013 | CN103208418A Peeling process of substrate |
| 07/17/2013 | CN103208415A Capacitor and forming method thereof |
| 07/17/2013 | CN103205125A Thermosetting Resin Composition For Semiconductor Encapsulation And Encapsulated Semiconductor Device |
| 07/17/2013 | CN102471651B Electrically conductive adhesives |
| 07/17/2013 | CN102394230B Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component |
| 07/17/2013 | CN102339808B Packaging lead frame structure |
| 07/17/2013 | CN102237318B Packaging substrate fixing device and method for manufacturing semiconductor chip packaging body |
| 07/17/2013 | CN102231373B Semiconductor substrate and methods for the production thereof |
| 07/17/2013 | CN102201410B 半导体器件 Semiconductor devices |
| 07/17/2013 | CN102201379B Device packaging structure and packaging method thereof |
| 07/17/2013 | CN102176438B Double-side packaging structure and wireless communication system applying the structure |
| 07/17/2013 | CN102170118B Power supply clamping position ESD (electronic static discharge) protecting circuit |
| 07/17/2013 | CN102124563B Substrate on which element is to be mounted, semiconductor module, semiconductor device, method for producing substrate on which element is to be mounted, method for manufacturing semiconductor device, and portable device |
| 07/17/2013 | CN102117784B 集成电路组件 IC components |
| 07/17/2013 | CN101999167B Support mounted electrically interconnected die assembly |
| 07/17/2013 | CN101799627B Positive photosensitive resin composition, flat display and semiconductor device |
| 07/17/2013 | CN101740504B Display and manufacturing method thereof |
| 07/17/2013 | CN101593735B Semiconductor device, and manufacturing method therefor |
| 07/17/2013 | CN101582396B Semiconductor device and manufacturing of the same |
| 07/17/2013 | CN101546775B Semiconductor device, electrooptical apparatus, and electronic apparatus |
| 07/17/2013 | CN101495674B Method for forming porous insulating film |
| 07/17/2013 | CN101479356B Heat-resistant adhesive sheet |
| 07/16/2013 | USRE44377 Bump-on-lead flip chip interconnection |
| 07/16/2013 | US8489227 Transport method and transport apparatus |
| 07/16/2013 | US8489163 Superconducting latch system |
| 07/16/2013 | US8488325 Memory module having thermal conduits |
| 07/16/2013 | US8488324 Electric control unit having a housing part and a cooling part |
| 07/16/2013 | US8488323 Controlling minimum air inlet temperature using waste heat |
| 07/16/2013 | US8487454 Leadframe, semiconductor device, and method of manufacturing the same |
| 07/16/2013 | US8487453 Integrated circuit with pads connected by an under-bump metallization and method for production thereof |
| 07/16/2013 | US8487452 Semiconductor package having a stacked structure |
| 07/16/2013 | US8487451 Lead frame land grid array with routing connector trace under unit |
| 07/16/2013 | US8487448 Method for producing chip packages, and chip package produced in this way |
| 07/16/2013 | US8487447 Semiconductor structure having offset passivation to reduce electromigration |
| 07/16/2013 | US8487446 Method of embedding passive component within via |
| 07/16/2013 | US8487445 Semiconductor device having through electrodes protruding from dielectric layer |
| 07/16/2013 | US8487444 Three-dimensional system-in-package architecture |
| 07/16/2013 | US8487443 Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device |
| 07/16/2013 | US8487442 Semiconductor device having dual damascene structure |
| 07/16/2013 | US8487441 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging |
| 07/16/2013 | US8487440 Backside processing of semiconductor devices |
| 07/16/2013 | US8487439 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board |
| 07/16/2013 | US8487438 Integrated circuit system having different-size solder bumps and different-size bonding pads |
| 07/16/2013 | US8487437 Electronic device package and method for fabricating the same |
| 07/16/2013 | US8487436 Semiconductor device, electronic device, and method of manufacturing semiconductor device |
| 07/16/2013 | US8487434 Integrated circuit package system with redistribution layer and method for manufacturing thereof |
| 07/16/2013 | US8487433 Semiconductor device |
| 07/16/2013 | US8487432 Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods |
| 07/16/2013 | US8487431 Semiconductor integrated circuit having a multi-chip structure |
| 07/16/2013 | US8487430 Multi-layer high-speed integrated circuit ball grid array package and process |
| 07/16/2013 | US8487429 Assembly of multi-chip modules using sacrificial features |
| 07/16/2013 | US8487428 Method and system for providing a reliable semiconductor assembly |
| 07/16/2013 | US8487427 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
| 07/16/2013 | US8487426 Semiconductor package with embedded die and manufacturing methods thereof |
| 07/16/2013 | US8487425 Optimized annular copper TSV |
| 07/16/2013 | US8487424 Routable array metal integrated circuit package fabricated using partial etching process |
| 07/16/2013 | US8487423 Interconnect structure of semiconductor integrated circuit and semiconductor device including the same |
| 07/16/2013 | US8487422 Chip stack with conductive column through electrically insulated semiconductor region |
| 07/16/2013 | US8487421 Microelectronic package with stacked microelectronic elements and method for manufacture thereof |
| 07/16/2013 | US8487420 Package in package semiconductor device with film over wire |
| 07/16/2013 | US8487419 Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus |
| 07/16/2013 | US8487418 LED package |
| 07/16/2013 | US8487417 Package for a power semiconductor device |
| 07/16/2013 | US8487416 Coaxial power module |
| 07/16/2013 | US8487413 Passivation film for electronic device and method of manufacturing the same |
| 07/16/2013 | US8487411 Multiple patterning using improved patternable low-κ dielectric materials |
| 07/16/2013 | US8487407 Low impedance gate control method and apparatus |
| 07/16/2013 | US8487404 Fuse patterns and method of manufacturing the same |
| 07/16/2013 | US8487401 Methods of fabricating passive element without planarizing and related semiconductor device |
| 07/16/2013 | US8487400 High performance system-on-chip using post passivation process |
| 07/16/2013 | US8487397 Method for forming self-aligned contact |
| 07/16/2013 | US8487381 Protection element and semiconductor device having the protection element |
| 07/16/2013 | US8487371 Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the same |
| 07/16/2013 | US8487308 Thin film transistor and image display unit |
| 07/16/2013 | US8487305 Semiconductor device and method of manufacturing the same |
| 07/16/2013 | US8487304 High performance compliant wafer test probe |
| 07/16/2013 | US8486796 Thin film resistors and methods of manufacture |
| 07/16/2013 | US8486764 Wafer level package and fabrication method |
| 07/16/2013 | US8486760 Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same |
| 07/16/2013 | US8486758 Simultaneous wafer bonding and interconnect joining |
| 07/16/2013 | US8486733 Package having light-emitting element and fabrication method thereof |
| 07/16/2013 | US8486728 Semiconductor device including semiconductor elements mounted on base plate |
| 07/16/2013 | US8486540 Lead frame sheet |
| 07/16/2013 | US8486250 Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface |
| 07/11/2013 | WO2013103962A1 Integrated circuit device with wire bond connections |
| 07/11/2013 | WO2013103473A1 Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias |
| 07/11/2013 | WO2013103136A1 Semiconductor device and method for manufacturing same |
| 07/11/2013 | WO2013103113A1 Electronic component and method for manufacturing same |
| 07/11/2013 | WO2013103066A1 Circuit board, and electronic device using same |
| 07/11/2013 | WO2013102973A1 Cooling device and electronic equipment using same |
| 07/11/2013 | WO2013102301A1 Heat sink and method for manufacturing |