| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/18/2013 | US20130181350 Semiconductor devices with nonconductive vias |
| 07/18/2013 | US20130181349 Semiconductor device having through-substrate via |
| 07/18/2013 | US20130181348 Semiconductor device having backside redistribution layers and method for fabricating the same |
| 07/18/2013 | US20130181347 Bump Pad Structure |
| 07/18/2013 | US20130181346 Bumping process and structure thereof |
| 07/18/2013 | US20130181345 Semiconductor device having penetration electrode penetrating through semiconductor substrate |
| 07/18/2013 | US20130181344 Semiconductor module, method for manufacturing the semiconductor module, and mobile apparatus |
| 07/18/2013 | US20130181343 Multi-chip package and method of manufacturing the same |
| 07/18/2013 | US20130181342 Semiconductor package |
| 07/18/2013 | US20130181341 Semiconductor package structure and method for manufacturing the same |
| 07/18/2013 | US20130181340 Semiconductor devices with compliant interconnects |
| 07/18/2013 | US20130181339 Multi-chip self-alignment assembly which can be used with flip-chip bonding |
| 07/18/2013 | US20130181338 Package on Package Interconnect Structure |
| 07/18/2013 | US20130181337 Power Routing with Integrated Decoupling Capacitance |
| 07/18/2013 | US20130181336 Semiconductor package with improved thermal properties |
| 07/18/2013 | US20130181335 Leadframe and semiconductor package made using the leadframe |
| 07/18/2013 | US20130181334 Connector and resin-sealed semiconductor device |
| 07/18/2013 | US20130181333 Semiconductor package structure and manufacturing method thereof |
| 07/18/2013 | US20130181332 Package leadframe for dual side assembly |
| 07/18/2013 | US20130181330 Integrating through substrate vias into middle-of-line layers of integrated circuits |
| 07/18/2013 | US20130181329 Semiconductor device and process for producing semiconductor device |
| 07/18/2013 | US20130181323 Semiconductor Device and Method of Forming an Inductor on Polymer Matrix Composite Substrate |
| 07/18/2013 | US20130181317 Semiconductor unit, method of manufacturing the semiconductor unit, solid-state image pickup unit, and electronic apparatus |
| 07/18/2013 | US20130181257 Apparatus for flexible electronic interfaces and associated methods |
| 07/18/2013 | US20130181218 Wiring structure and display device |
| 07/18/2013 | DE202013103056U1 Leistungsmodul Power module |
| 07/18/2013 | DE202013005583U1 Kühlkörper für Bauelemente Heatsinks for components |
| 07/18/2013 | DE112011101750T5 Verfahren und Struktur zur Verbesserung der Leitfähigkeit enger kupfergefüllter Durchkontaktierungen A method and structure for improving the conductivity close copper-filled vias |
| 07/18/2013 | DE112005001285B4 Halbleitervorrichtungsmodul mit Flipchip-Vorrichtungen auf einem gemeinsamen Leiterrahmen Semiconductor device module with flip-chip devices on a common leadframe |
| 07/18/2013 | DE10260851B4 Verfahren zur Herstellung einer Kühlvorrichtung für Leistungsbauelemente, Kühlvorrichtung und elektronisches Steuergerät A process for producing a cooling device for the power components, the cooling device and electronic control unit |
| 07/18/2013 | DE102013200335A1 Schaltungsanordnung mit einem Lasttransistor und Verfahren zum Messen eines Stromes durch einen Lasttransistor Circuit arrangement having a load transistor and method for measuring a current through a load transistor |
| 07/18/2013 | DE102013000639A1 Leitpaste für Feinlinien-Siebdruck mit hohem Streckungsverhältnis bei der Herstellung von Halbleiterbauelementen Conductive paste for screen printing fine line with a high aspect ratio in the manufacture of semiconductor devices |
| 07/18/2013 | DE102012222879A1 Leistungshalbleitermodul und Verfahren zu seiner Herstellung The power semiconductor module and method for its preparation |
| 07/18/2013 | DE102012222252A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation |
| 07/18/2013 | DE102012215529A1 Halbleitervorrichtung Semiconductor device |
| 07/18/2013 | DE102012207245B3 Method for manufacturing composite component carrier for supporting e.g. organic LED on circuit board, involves isolating carrier elements of leadframe from each other and embedding isolated carrier elements in mold material |
| 07/18/2013 | DE102012200532A1 Method for manufacturing e.g. MOSFET, involves forming insulating substrate by spraying insulative material on exposed surface portions of chip and contact carrier device that remains uncovered by insulative material |
| 07/18/2013 | DE102012200485A1 Organische lichtemittierende Vorrichtung und Verfahren zum Prozessieren einer organischen lichtemittierenden Vorrichtung Organic light emitting device and method for processing an organic light emitting device |
| 07/18/2013 | DE102012113110A1 Integrierte Halbleitervorrichtung mit Heteroübergang und Verfahren zur Erzeugung einer integrierten Halbleitervorrichtung mit Heteroübergang Integrated semiconductor device comprising hetero-junction, and method for producing an integrated semiconductor device having heterojunction |
| 07/18/2013 | DE102012000678A1 Kühlanordnung für ein Wärme erzeugendes Bauelement, Schaumstoff und Verwendung eines Schaumstoffes für eine Kühlanordnung A cooling arrangement for a heat-generating component, the foam and the use of a foam for a cooling arrangement |
| 07/18/2013 | DE102008045744B4 Halbleiterbaustein mit einer an eine Rückseite eines Chips gekoppelten Elektronikkomponente und Verfahren zur Herstellung A semiconductor device having a coupled to a backside of a chip electronic component and methods for making |
| 07/18/2013 | DE102008036285B4 Integrierte Schaltung mit einer durch einen galvanischen Prozess erzeugten Verbindung mit einem Kühlkörper und Verfahren dazu Integrated circuit comprising a produced by a galvanic process conjunction with a heat sink and method thereof |
| 07/18/2013 | DE102005002812B4 Kühlkörper für oberflächenmontierte Halbleiterbauteile und Montageverfahren Heat sink for semiconductor components and surface mount assembly process |
| 07/18/2013 | DE102004054996B4 Elektronisches Gerät Electronic Instrument |
| 07/17/2013 | EP2615641A2 Chip attack protection |
| 07/17/2013 | EP2615639A2 Semiconductor die with a universal interface block, associated electronic apparatuses and associated methods |
| 07/17/2013 | EP2615638A2 Semiconductor Package Structure and Method for Manufacturing The Same |
| 07/17/2013 | EP2615637A2 Semiconductor package and method for manufacturing the same |
| 07/17/2013 | EP2615635A1 Semiconductor device production method and rinse |
| 07/17/2013 | EP2615133A1 Composite material with enhanced conductivity, part made from said material and uses thereof |
| 07/17/2013 | EP2614694A1 Coating method for an optoelectronic chip-on-board module |
| 07/17/2013 | EP2614693A1 Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board-module |
| 07/17/2013 | EP2614524A1 Monolithic microwave integrated circuit |
| 07/17/2013 | EP2614523A1 Semiconductor chip with redundant thru-silicon-vias |
| 07/17/2013 | EP2614522A1 Semiconductor chip device with polymeric filler trench |
| 07/17/2013 | EP2274773B1 Die stacking with an annular via having a recessed socket |
| 07/17/2013 | CN203071061U 集成电路装置 The integrated circuit device |
| 07/17/2013 | CN203071060U Wafer-level 3D high-density capacitance structure |
| 07/17/2013 | CN203071059U PCB structure for high-pixel image sensor |
| 07/17/2013 | CN203071058U Anti-warpage packaging substrate |
| 07/17/2013 | CN203071057U Framework for DIP (Double In-line Package) arrangement in integrated block package frame |
| 07/17/2013 | CN203071056U Heat radiation mechanism for power module |
| 07/17/2013 | CN203071055U Micro-channel heat exchanger suitable for high heat flow density electric power components with local hot spots |
| 07/17/2013 | CN203071054U Radiating component for IGBTs |
| 07/17/2013 | CN203067329U Centrifugal fan box for thyristor rectifying air duct |
| 07/17/2013 | CN1917158B Power semiconductor packaging method and structure |
| 07/17/2013 | CN1501493B Combined semiconductor apparatus with thin semiconductor films |
| 07/17/2013 | CN103210707A Cooler |
| 07/17/2013 | CN103210489A 半导体装置 Semiconductor device |
| 07/17/2013 | CN103210488A Cladding material for insulated substrates |
| 07/17/2013 | CN103210487A Semiconductor package |
| 07/17/2013 | CN103210486A Staged via formation from both sides of chip |
| 07/17/2013 | CN103210041A Thermosetting silicone resin composition, and silicone resin-containing structure and optical semiconductor element encapsulant obtained using same |
| 07/17/2013 | CN103210012A Polyfunctional epoxy compound |
| 07/17/2013 | CN103209936A Semiconductor encapsulating non-lead glass and semiconductor encapsulating coating tube |
| 07/17/2013 | CN103209566A Radiating structure |
| 07/17/2013 | CN103208487A Methods and apparatus for thinner package on package structures |
| 07/17/2013 | CN103208486A Package of multi-chip stack and manufacturing method thereof |
| 07/17/2013 | CN103208485A Semiconductor device having through-substrate via |
| 07/17/2013 | CN103208484A Semiconductor package and method for manufacturing the same |
| 07/17/2013 | CN103208483A Overlay mark and application thereof |
| 07/17/2013 | CN103208482A Through-assembly Via Modules And Methods For Forming The Same |
| 07/17/2013 | CN103208481A Semiconductor memory device, memory chip, memory module, memory system and method for fabricating the same |
| 07/17/2013 | CN103208480A Multilayer electronic structure with through-holes having different sizes |
| 07/17/2013 | CN103208479A Multilayer electronic structure having integrated step-shaped stack structure |
| 07/17/2013 | CN103208478A Suspended Lattice For Electrical Interconnects |
| 07/17/2013 | CN103208477A Method For Forming Rutile Titanium Oxide And The Stacking Structure Thereof |
| 07/17/2013 | CN103208476A Package module of embedded package and manufacturing method of package |
| 07/17/2013 | CN103208475A Package substrate and production method thereof |
| 07/17/2013 | CN103208474A Quad flat type high-power chip packing structure |
| 07/17/2013 | CN103208473A Power module adopting laser welding terminals |
| 07/17/2013 | CN103208472A Composite semi-conductor integrated circuit with three-dimensional element |
| 07/17/2013 | CN103208471A Multi-chip package body |
| 07/17/2013 | CN103208470A Non-medium inosculating heat conduction method and application thereof |
| 07/17/2013 | CN103208469A Radiating clip and production method thereof |
| 07/17/2013 | CN103208468A Servo amplifier |
| 07/17/2013 | CN103208467A Package module of inline package body and manufacturing method thereof |
| 07/17/2013 | CN103208466A Semiconductor device and method of manufacturing the same |
| 07/17/2013 | CN103208465A Stress compensation layer for 3D packaging |
| 07/17/2013 | CN103208464A Light-emitting diode (LED) chip assembly and manufacturing method thereof |