| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/24/2013 | EP2617054A2 Staged via formation from both sides of chip |
| 07/24/2013 | EP2616995A1 Systems and methods for integrating radio-frequency indentification circuitry into flexible circuits |
| 07/24/2013 | EP2616859A1 Optical coupling device, opticalsystem and methods of assembly |
| 07/24/2013 | EP2616389A2 Multi-die mems package |
| 07/24/2013 | CN203085543U Image sensor structure with air chamber gap |
| 07/24/2013 | CN203085532U Darlington triode |
| 07/24/2013 | CN203085531U Distinguishable chip |
| 07/24/2013 | CN203085527U A bonded wafer containing aligning identification |
| 07/24/2013 | CN203085526U A bonded wafer |
| 07/24/2013 | CN203085525U Integrated circuit used for stacking |
| 07/24/2013 | CN203085524U Packaging substrate |
| 07/24/2013 | CN203085523U Lead frame for semiconductor packaging |
| 07/24/2013 | CN203085522U Lead frame for packaging semiconductor |
| 07/24/2013 | CN203085521U Lead frame for packaging three chips |
| 07/24/2013 | CN203085520U A leading wire framework equipped with an isolating groove |
| 07/24/2013 | CN203085519U A chip leading wire frame |
| 07/24/2013 | CN203085518U A leading wire frame |
| 07/24/2013 | CN203085517U Flat display panel structure for inspecting COG or COF binding defects |
| 07/24/2013 | CN203085516U A double-ball bonding structure of a semiconductor device chip bonding pad |
| 07/24/2013 | CN203085515U Semiconductor packaging body |
| 07/24/2013 | CN203085514U IGBT module heat radiator based on loop heat pipe |
| 07/24/2013 | CN203085513U Heat pipe heat dissipation IGBT power module |
| 07/24/2013 | CN203085512U Servo amplifier |
| 07/24/2013 | CN203085511U Re-wiring multi-chip AAQFN packaging device |
| 07/24/2013 | CN103222352A Multilayer wiring board |
| 07/24/2013 | CN103222346A Circuit board and electronic device |
| 07/24/2013 | CN103222053A 电路装置 Circuit device |
| 07/24/2013 | CN103222052A Structure of metal e-use |
| 07/24/2013 | CN103222051A Using bump bonding to distribute current flow on a semiconductor power device |
| 07/24/2013 | CN103222050A Crack arrest vias for ic devices |
| 07/24/2013 | CN103222049A Stacked cooler |
| 07/24/2013 | CN103222048A Heat sink device and method for producing a heat sink device |
| 07/24/2013 | CN103222047A Ceramic heat sink material for compression contact structure, semiconductor module using same, and method for producing semiconductor module |
| 07/24/2013 | CN103222046A Electronic circuit and heat sink |
| 07/24/2013 | CN103222045A Package for electronic component mounting and electronic device using same |
| 07/24/2013 | CN103222040A Adhesive composition, method for manufacturing semiconductor device, and semiconductor device |
| 07/24/2013 | CN103221896A 便携式电子设备 The portable electronic device |
| 07/24/2013 | CN103221501A Heat-conductive, pressure-sensitive adhesive composition, heat-conductive, pressure-sensitive adhesive sheet formed body, method for producing each, and electronic component |
| 07/24/2013 | CN103221486A Heat-curable silicone resin composition, silicone resin-ontaining structure, optical semiconductor element sealed body, and silanol condensation catalyst |
| 07/24/2013 | CN103221485A Silicone resin composition and method for using silicone resin-containing structure, optical semiconductor element sealed body, and silicone resin composition, that use same |
| 07/24/2013 | CN103221481A Liquid resin composition |
| 07/24/2013 | CN103221480A Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 07/24/2013 | CN103221455A Powdered sealant and sealing method |
| 07/24/2013 | CN103221452A Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material |
| 07/24/2013 | CN103221442A Active ester resin, method for producing same, thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-p film |
| 07/24/2013 | CN103221333A Multi-die MEMS package |
| 07/24/2013 | CN103221330A Sensor comprising a preferably multilayered ceramic substrate and method for producing it |
| 07/24/2013 | CN103219869A Cooler of power converting device for railroad vehicle |
| 07/24/2013 | CN103219388A Thin-film transistor, method of manufacturing the same, display unit, and electronic apparatus |
| 07/24/2013 | CN103219374A Semiconductor device and power supply device |
| 07/24/2013 | CN103219373A Semiconductor triode with mounting plate |
| 07/24/2013 | CN103219333A Enhancement type Flash chip, encapsulating method and instruction execution method |
| 07/24/2013 | CN103219328A 3-d integrated circuit lateral heat dissipation |
| 07/24/2013 | CN103219327A Integrating passive components on spacer in stacked dies |
| 07/24/2013 | CN103219326A Multi-layered semiconductor apparatus |
| 07/24/2013 | CN103219325A Multi-dimensional integrated circuit structures and methods of forming the same |
| 07/24/2013 | CN103219324A Stackable semiconductor chip packaging structure and process thereof |
| 07/24/2013 | CN103219323A 半导体装置 Semiconductor device |
| 07/24/2013 | CN103219322A Three dimensional integrated circuit having a resistance measurment structure and method of use |
| 07/24/2013 | CN103219321A Composite copper diffusion blocking layer and preparation method thereof |
| 07/24/2013 | CN103219320A 电熔丝 Electrical fuse |
| 07/24/2013 | CN103219319A Array substrate and manufacturing method thereof and display device |
| 07/24/2013 | CN103219318A High-temperature-resistant MIM capacitor for microwave internal matching transistor and manufacturing method thereof |
| 07/24/2013 | CN103219317A Packaging integrated circuit by fabricating package module from successive build-up layers having circuit interconnections, and forming cavity on top-side of package module |
| 07/24/2013 | CN103219316A Package assembly and method of forming the same |
| 07/24/2013 | CN103219315A 肖特基整流芯片封装结构 Schottky rectifier chip package |
| 07/24/2013 | CN103219314A Electronic device and a method for fabricating an electronic device |
| 07/24/2013 | CN103219313A 半导体装置 Semiconductor device |
| 07/24/2013 | CN103219312A Palladium-plated gold-plated double-plating bonding copper wire |
| 07/24/2013 | CN103219311A Palladium-plated silver-plated double-plating bonding copper wire |
| 07/24/2013 | CN103219310A Mixed solder ball arrangement and forming method thereof |
| 07/24/2013 | CN103219309A Multi-chip fan out package and methods of forming the same |
| 07/24/2013 | CN103219308A Multichip module with reroutable inter-die communication |
| 07/24/2013 | CN103219307A Semiconductor packaging structure and method |
| 07/24/2013 | CN103219306A Encapsulating structure with electronic assembly in embedded mode and manufacturing method thereof |
| 07/24/2013 | CN103219305A Salient point bottom protection structure |
| 07/24/2013 | CN103219304A Semiconductor wafer level packaging structure and preparation method thereof |
| 07/24/2013 | CN103219303A Packaging structure and method of TSV (Through Silicon Vias) back leakage hole |
| 07/24/2013 | CN103219302A Intermediate plate with punched hole |
| 07/24/2013 | CN103219301A Power semiconductor module and method of manufacturing the same |
| 07/24/2013 | CN103219300A Heat dissipation base plate, thin-type heat dissipation module, and method for manufacturing same |
| 07/24/2013 | CN103219299A Integrated circuit package assembly and method of forming the same |
| 07/24/2013 | CN103219298A Semiconductor package provided with heat dissipating structure and electromagnetic interference shielding function and manufacturing method thereof |
| 07/24/2013 | CN103219297A Carrier, semiconductor package and fabrication method thereof |
| 07/24/2013 | CN103219296A Multifunctional film for semiconductor encapsulation and manufacture method of multifunctional film |
| 07/24/2013 | CN103219295A Conformal mask packaging structure and detection method |
| 07/24/2013 | CN103219294A Novel waterproof diode |
| 07/24/2013 | CN103219293A Sawing underfill in packaging processes |
| 07/24/2013 | CN103219279A Semiconductor devices with copper interconnects and methods for fabricating same |
| 07/24/2013 | CN103219253A Chip size packing structure and chip size packaging method |
| 07/24/2013 | CN103219249A Manufacturing method of palladium-plated gold-plated double-plating bonding copper wire |
| 07/24/2013 | CN103219244A Semiconductor substrate process, packaging method, packaging, and system-level packaging structure |
| 07/24/2013 | CN103214855A Solidifiable siloxane composite, solidified product and semiconductor device |
| 07/24/2013 | CN103212776A Electronic device, method of manufacturing, and electronic device manufacturing apparatus |
| 07/24/2013 | CN102456541B Preparation method of SiGe monitoring piece and method for employing piece to carry out monitoring |
| 07/24/2013 | CN102432980B Epoxy resin composition for semiconductor packaging and preparation method thereof |
| 07/24/2013 | CN102347316B Three-dimensional integrated circuit structure |
| 07/24/2013 | CN102254879B Controlled silicon for large-size silicon chip employing plastic entity package and packaging process thereof |
| 07/24/2013 | CN102194761B Manufacturing method of residue-free wafer |
| 07/24/2013 | CN102174155B Polyorganosiloxane composition |