| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/24/2013 | CN102157493B 金属塞及其制造方法 Metal Slug and its manufacturing method |
| 07/24/2013 | CN102157472B Electronic device |
| 07/24/2013 | CN102130154B Silicon-controlled rectifier structure and manufacturing method thereof |
| 07/24/2013 | CN102105980B A cooling device for cooling a semiconductor die |
| 07/24/2013 | CN102045983B Radiating module and manufacturing method thereof |
| 07/24/2013 | CN102034774B A power-electronic arrangement |
| 07/24/2013 | CN101821842B 半导体装置 Semiconductor device |
| 07/24/2013 | CN101771021B Electric fuse structure and manufacture method thereof |
| 07/24/2013 | CN101740498B Semiconductor device with contact etching stop layer and forming method thereof |
| 07/24/2013 | CN101582411B Semiconductor device and method for manufacturing the same |
| 07/24/2013 | CN101246888B Integrated circuit, dual port sram cell and semiconductor structure |
| 07/24/2013 | CN101113318B Phosphor-containing curable silicone composition for LED and LED light-emitting device using the composition |
| 07/23/2013 | US8493767 One-time programmable device having an LDMOS structure |
| 07/23/2013 | US8493746 Additives for grain fragmentation in Pb-free Sn-based solder |
| 07/23/2013 | US8492912 Light emitting diode package |
| 07/23/2013 | US8492911 Stacked interconnect heat sink |
| 07/23/2013 | US8492910 Underfill method and chip package |
| 07/23/2013 | US8492909 Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof |
| 07/23/2013 | US8492908 Atomic layer deposition encapsulation for power amplifiers in RF circuits |
| 07/23/2013 | US8492907 Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device |
| 07/23/2013 | US8492906 Lead frame ball grid array with traces under die |
| 07/23/2013 | US8492905 Vertically stackable dies having chip identifier structures |
| 07/23/2013 | US8492904 Semiconductor device and manufacturing method of the same |
| 07/23/2013 | US8492902 Multi-layer TSV insulation and methods of fabricating the same |
| 07/23/2013 | US8492901 Metal oxide semiconductor (MOS)-compatible high-aspect ratio through-wafer vias and low-stress configuration thereof |
| 07/23/2013 | US8492900 Post passivation interconnection schemes on top of IC chip |
| 07/23/2013 | US8492899 Method to electrodeposit nickel on silicon for forming controllable nickel silicide |
| 07/23/2013 | US8492898 Printed circuit boards |
| 07/23/2013 | US8492897 Microstructure modification in copper interconnect structures |
| 07/23/2013 | US8492896 Semiconductor apparatus and semiconductor apparatus unit |
| 07/23/2013 | US8492895 Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit |
| 07/23/2013 | US8492894 Bump, method for forming the bump, and method for mounting substrate having the bump thereon |
| 07/23/2013 | US8492893 Semiconductor device capable of preventing dielectric layer from cracking |
| 07/23/2013 | US8492892 Solder bump connections |
| 07/23/2013 | US8492891 Cu pillar bump with electrolytic metal sidewall protection |
| 07/23/2013 | US8492890 Semiconductor device and method for manufacturing thereof |
| 07/23/2013 | US8492889 Semiconductor package |
| 07/23/2013 | US8492888 Integrated circuit packaging system with stiffener and method of manufacture thereof |
| 07/23/2013 | US8492887 Integrated circuit packaging system with leadframe and method of manufacture thereof |
| 07/23/2013 | US8492886 3D integrated circuit with logic |
| 07/23/2013 | US8492885 Semiconductor storage device and manufacturing method thereof |
| 07/23/2013 | US8492884 Stacked interposer leadframes |
| 07/23/2013 | US8492883 Semiconductor package having a cavity structure |
| 07/23/2013 | US8492882 Semiconductor device and method of manufacturing same |
| 07/23/2013 | US8492881 Magnetic storage device |
| 07/23/2013 | US8492880 Multilayered low k cap with conformal gap fill and UV stable compressive stress properties |
| 07/23/2013 | US8492871 Electrical fuse and method of making |
| 07/23/2013 | US8492870 Semiconductor package with interconnect layers |
| 07/23/2013 | US8492856 Sealed electric element package |
| 07/23/2013 | US8492846 Stress-generating shallow trench isolation structure having dual composition |
| 07/23/2013 | US8492834 Electrostatic discharge protection device and applications thereof |
| 07/23/2013 | US8492808 Semiconductor device and manufacturing method thereof |
| 07/23/2013 | US8492797 Vertical structure semiconductor memory devices and methods of manufacturing the same |
| 07/23/2013 | US8492763 Semiconductor device including an edge seal and plural pad pieces |
| 07/23/2013 | US8492762 Electrical interface for a sensor array |
| 07/23/2013 | US8492268 IC having viabar interconnection and related method |
| 07/23/2013 | US8492242 Dry flux bonding device and method |
| 07/23/2013 | US8492202 Semiconductor device and method of manufacturing the same |
| 07/23/2013 | US8492171 Techniques and structures for testing integrated circuits in flip-chip assemblies |
| 07/23/2013 | US8491987 Selectively coated self-aligned mask |
| 07/23/2013 | US8491772 Redox method of forming a coaxial probe structure of elongated electrical conductors projecting from a support structure |
| 07/23/2013 | US8491678 Active gas flow heat exchanger and its associated method of operation |
| 07/23/2013 | US8490681 Fluid cooling system |
| 07/23/2013 | US8490679 Condenser fin structures facilitating vapor condensation cooling of coolant |
| 07/18/2013 | WO2013106796A1 Integrating through substrate vias into middle-of-line layers of integrated circuits |
| 07/18/2013 | WO2013106502A1 Back-end electrically programmable fuse |
| 07/18/2013 | WO2013106442A1 Masks for use in applying protective coatings to electronic assemblies, masked electronic assemblies and associated methods |
| 07/18/2013 | WO2013106334A1 Systems for assembling electronic devices with internal moisture-resistant coatings |
| 07/18/2013 | WO2013106173A1 Stackable microelectronic package structures |
| 07/18/2013 | WO2013106092A1 Integrated circuit package and method of assembling an integrated circuit package |
| 07/18/2013 | WO2013106050A2 Ultra-thin power transistor and synchronous buck converter having customized footprint |
| 07/18/2013 | WO2013105510A1 Proximity sensor |
| 07/18/2013 | WO2013105456A1 Circuit board and electronic device |
| 07/18/2013 | WO2013105425A1 Epoxy resin composition, cured product of same, and optical semiconductor device |
| 07/18/2013 | WO2013105351A1 Power module |
| 07/18/2013 | WO2013105332A1 Power semiconductor module, power module, and power module manufacturing method |
| 07/18/2013 | WO2013105166A1 Power conversion apparatus |
| 07/18/2013 | WO2013105161A1 Pressure contact type semiconductor device and method for fabricating same |
| 07/18/2013 | WO2013105153A1 Semiconductor device |
| 07/18/2013 | WO2013104859A1 Electrically-insulating composite material having improved thermal conductivity, part made from such a material, and uses thereof |
| 07/18/2013 | WO2013104712A1 Semiconductor devices |
| 07/18/2013 | WO2013104620A1 Passive thermal management device |
| 07/18/2013 | WO2013104460A1 Electronic component having a corrosion-protected bonding connection and method for producing the component |
| 07/18/2013 | WO2013104222A1 Electrostatic discharge protection circuit and working method therefor |
| 07/18/2013 | WO2013104206A1 Power device insulating heat radiation structure, circuit board and power supply equipment |
| 07/18/2013 | US20130183799 Method for manufacturing semiconductor device |
| 07/18/2013 | US20130183575 Electrochemical device |
| 07/18/2013 | US20130183535 Adhesive composition and semiconductor device using the same |
| 07/18/2013 | US20130182255 Overlay mark and application thereof |
| 07/18/2013 | US20130181361 Thermosetting resin composition for semiconductor encapsulation and encapsulated semiconductor device |
| 07/18/2013 | US20130181360 Integrated circuit connectivity using flexible circuitry |
| 07/18/2013 | US20130181359 Methods and Apparatus for Thinner Package on Package Structures |
| 07/18/2013 | US20130181358 Semiconductor device including a first wiring having a bending portion a via |
| 07/18/2013 | US20130181357 Manufacturing method for an electronic substrate |
| 07/18/2013 | US20130181356 Microelectronic devices and methods for manufacturing microelectronic devices |
| 07/18/2013 | US20130181355 Support Structure for TSV in MEMS Structure |
| 07/18/2013 | US20130181354 Semiconductor Interposer Having a Cavity for Intra-Interposer Die |
| 07/18/2013 | US20130181353 Semiconductor package and method for manufacturing the same |
| 07/18/2013 | US20130181352 Method of Growing Carbon Nanotubes Laterally, and Lateral Interconnections and Effect Transistor Using the Same |
| 07/18/2013 | US20130181351 Semiconductor Device Package with Slanting Structures |