| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/30/2013 | US8497553 Semiconductor device |
| 07/30/2013 | US8497534 Chip package with heavily doped regions and fabrication method thereof |
| 07/30/2013 | US8497531 Integrated MOS gas or humidity sensor having a wireless transceiver |
| 07/30/2013 | US8497195 Method for radiation hardening a semiconductor device |
| 07/30/2013 | US8497167 EDS protection diode with pwell-nwell resurf |
| 07/30/2013 | US8497159 Method of manufacturing leadless integrated circuit packages having electrically routed contacts |
| 07/30/2013 | US8497156 Semiconductor device and manufacturing method of the same |
| 07/30/2013 | US8497148 MEMS devices and methods of forming same |
| 07/25/2013 | WO2013109355A1 Magnetic field sensor device having non- conductive die paddle and production method |
| 07/25/2013 | WO2013109308A2 Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate |
| 07/25/2013 | WO2013108930A1 Substrate processing apparatus |
| 07/25/2013 | WO2013108814A1 Electron beam curable resin composition, resin frame for reflectors, reflector, semiconductor light emitting device, and method for producing molded body |
| 07/25/2013 | WO2013108791A1 Semiconductor sealing composition, semiconductor device and method for producing same, and polymer and method for producing same |
| 07/25/2013 | WO2013108718A1 Heat conductive member and semiconductor device provided with same |
| 07/25/2013 | WO2013108703A1 Semiconductor part surface protection adhesive tape |
| 07/25/2013 | WO2013107432A1 Surface mount microwave system |
| 07/25/2013 | WO2013107406A1 Methods and apparatus for a substrate core layer |
| 07/25/2013 | WO2013107305A1 Integrated module, integrated system board and electronic device |
| 07/25/2013 | WO2013107026A1 Manufacturing method of temperature equalization device without liquid injection tube and temperature equalization device manufactured by the method |
| 07/25/2013 | WO2013106973A1 Package-on-package semiconductor chip packaging structure and technology |
| 07/25/2013 | WO2013064902A3 Silicon interposer systems |
| 07/25/2013 | WO2012152672A4 Method for producing reconstituted wafers with support of the chips during their encapsulation |
| 07/25/2013 | US20130189828 Method for forming pad in wafer with three-dimensional stacking structure |
| 07/25/2013 | US20130189514 Multilayer resin sheet and process for production thereof, resin sheet laminate and process for production thereof, cured multilayer resin sheet, metal-foil-cladded multilayer resin sheet, and semiconductor device |
| 07/25/2013 | US20130187296 Resin compact, method for producing resin compact, resin composition, method for producing resin composition and electronic component device |
| 07/25/2013 | US20130187295 Sensor module, production method of a sensor module, and injection mold for encapsulating a sensor module |
| 07/25/2013 | US20130187294 Semiconductor device including stacked semiconductor chips |
| 07/25/2013 | US20130187293 Electronic device, method of manufacturing, and electronic device manufacturing apparatus |
| 07/25/2013 | US20130187292 Multi-Dimensional Integrated Circuit Structures and Methods of Forming the Same |
| 07/25/2013 | US20130187291 Integrated circuit devices having buried interconnect structures therein that increase interconnect density |
| 07/25/2013 | US20130187290 Three dimensional structure memory |
| 07/25/2013 | US20130187289 Semiconductor device structures and electronic devices including same hybrid conductive vias, and methods of fabrication |
| 07/25/2013 | US20130187288 Package-on-package assembly |
| 07/25/2013 | US20130187287 Semiconductor Device and Method of Fabricating the Same |
| 07/25/2013 | US20130187286 Lead frameless hermetic circuit package |
| 07/25/2013 | US20130187285 Carrier, semiconductor package and fabrication method thereof |
| 07/25/2013 | US20130187284 Low Cost and High Performance Flip Chip Package |
| 07/25/2013 | US20130187283 Method of manufacturing a semiconductor device and semiconductor device |
| 07/25/2013 | US20130187282 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium |
| 07/25/2013 | US20130187281 Semiconductor device and method for manufacturing of same |
| 07/25/2013 | US20130187280 Crack-Arresting Structure for Through-Silicon Vias |
| 07/25/2013 | US20130187279 Semiconductor device structures including buried digit lines and related methods |
| 07/25/2013 | US20130187278 Structure for interconnecting copper with low dielectric constant medium and the integration method thereof |
| 07/25/2013 | US20130187277 Crack stopper on under-bump metallization layer |
| 07/25/2013 | US20130187276 Microelectronic device having metal interconnection levels connected by programmable vias |
| 07/25/2013 | US20130187275 Semiconductor device and fabrication process thereof |
| 07/25/2013 | US20130187274 Semiconductor device having a nanotube layer and method for forming |
| 07/25/2013 | US20130187273 Semiconductor devices with copper interconnects and methods for fabricating same |
| 07/25/2013 | US20130187272 Semiconductor module |
| 07/25/2013 | US20130187271 Semiconductor device and method of manufacturing the same |
| 07/25/2013 | US20130187270 Multi-Chip Fan Out Package and Methods of Forming the Same |
| 07/25/2013 | US20130187269 Package assembly and method of forming the same |
| 07/25/2013 | US20130187268 Semiconductor Packaging Structure and Method |
| 07/25/2013 | US20130187267 Increased surface area electrical contacts for microelectronic packages |
| 07/25/2013 | US20130187266 Integrated circuit package assembly and method of forming the same |
| 07/25/2013 | US20130187265 Package structure and semiconductor structure thereof |
| 07/25/2013 | US20130187264 Low ohmic contacts |
| 07/25/2013 | US20130187263 Semiconductor stacked package and method of fabricating the same |
| 07/25/2013 | US20130187262 Devices including composite thermal capacitors |
| 07/25/2013 | US20130187261 Semiconductor device |
| 07/25/2013 | US20130187260 Packaged semiconductor devices, and related methods and systems |
| 07/25/2013 | US20130187259 Electronic Device and a Method for Fabricating an Electronic Device |
| 07/25/2013 | US20130187257 Semiconductor device and method for manufacturing the same |
| 07/25/2013 | US20130187254 Semiconductor Chip and Methods for Producing the Same |
| 07/25/2013 | US20130187252 Bondpad integrated theromelectric cooler |
| 07/25/2013 | US20130187176 Silicone resin |
| 07/25/2013 | US20130187158 Semiconductor device |
| 07/25/2013 | US20130187157 Methods of heating integrated circuits at low temperatures and devices using the methods |
| 07/25/2013 | US20130187156 Three dimensional integrated circuit having a resistance measurment structure and method of use |
| 07/25/2013 | US20130186944 Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer |
| 07/25/2013 | DE112011103477T5 Halbleiterlaservorrichtung A semiconductor laser device |
| 07/25/2013 | DE112007002936B4 Plattierelement und Verfahren zum Herstellen eines Platierelements Plating element and method for manufacturing a Platierelements |
| 07/25/2013 | DE102013200649A1 ESD-Schutzschaltung ESD protection circuit |
| 07/25/2013 | DE102013200518A1 Halbleiterpackung Semiconductor package |
| 07/25/2013 | DE102013100683A1 Integrierte Schaltung einschliesslich Feldeffekttransistorstrukturen mit Gate- und Feldelektroden und Verfahren zum Herstellen und Betreiben einer integrierten Schaltung An integrated circuit including field-effect transistor structures with gate and field electrodes and methods of making and operating an integrated circuit |
| 07/25/2013 | DE102013100339A1 Elektronisches Bauelement und ein Verfahren zur Herstellung eines elektronischen Bauelements Electronic component and a method for manufacturing an electronic component |
| 07/25/2013 | DE102012216153A1 Halbleiterbauelemente mit Kupferverbindungen und Verfahren zu deren Herstellung Semiconductor devices with copper compounds and methods for their preparation |
| 07/25/2013 | DE102012200840A1 Bauelement mit einer Durchkontaktierung Component with a via |
| 07/25/2013 | DE102012112123A1 Verfahren zum Heizen integrierter Schaltungen bei niedrigen Temperaturen und die Verfahren verwendende Vorrichtungen A method of heating of integrated circuits at low temperatures and the method used devices |
| 07/25/2013 | DE102007036698B4 Abgeschirmte Leiterplatte Shielded PCB |
| 07/25/2013 | DE102005025667B4 Verfahren zur Herstellung einer Sensoranordnung mit einem umgossenen Signalausgabeabschnitt A process for producing a sensor arrangement with a signal output section overmolded |
| 07/25/2013 | CA2861406A1 Method of manufacturing heat-dissipating device without injection tube and object manufactured by the method |
| 07/24/2013 | EP2618482A1 Power amplifier, asymmetric doherty power amplifier device and base station |
| 07/24/2013 | EP2618389A2 Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same |
| 07/24/2013 | EP2618375A1 Method and system for measuring the thermal calibration of an electronic circuit |
| 07/24/2013 | EP2618374A2 Semiconductor device with die stack arrangement including staggered die and efficient wire bonding |
| 07/24/2013 | EP2618373A1 Mobile wireless communications device including conformable, shape-retaining vacuum formed film and related methods |
| 07/24/2013 | EP2618372A1 Multi-layer through-hole stacked layer structure |
| 07/24/2013 | EP2618371A2 Semiconductor device |
| 07/24/2013 | EP2618370A1 Method for manufacturing tight electrical bushings through an encapsulating housing and encapsulating housing provided with at least one of said electrical bushings |
| 07/24/2013 | EP2618369A2 Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same |
| 07/24/2013 | EP2618368A1 Connection component with hollow inserts and method of making the same |
| 07/24/2013 | EP2617791A1 UV-curable adhesive silicone composition, UV-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same |
| 07/24/2013 | EP2617781A2 Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same |
| 07/24/2013 | EP2617770A1 Resin composition sheet for encapsulating electronic parts and method of producing electronic part apparatus using the sheet |
| 07/24/2013 | EP2617761A1 Aerogel/PTFE composite insulating material |
| 07/24/2013 | EP2617747A1 Active ester resin, method for producing same, thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-up film |
| 07/24/2013 | EP2617070A1 Optoelectronic component and method for producing it |
| 07/24/2013 | EP2617056A1 Electronic packaging with a variable thickness mold cap |
| 07/24/2013 | EP2617055A1 Disaster resistant server enclosure with cold thermal storage device and server cooling device |