| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/31/2013 | CN203103355U Semiconductor structure and semiconductor unit |
| 07/31/2013 | CN203103308U Silicon-controlled rectifier piece with composite inner passivation layer structure |
| 07/31/2013 | CN203103305U Packaging structure of mixed substrate and semiconductor device |
| 07/31/2013 | CN203103299U Highly reliable high-voltage diode for automobile igniter |
| 07/31/2013 | CN203103297U A LCD display panel |
| 07/31/2013 | CN203103296U PCB (Printed Circuit Board) chip packaging structure |
| 07/31/2013 | CN203103295U Epitaxial mark |
| 07/31/2013 | CN203103294U Semiconductor packaging element |
| 07/31/2013 | CN203103293U 半导体封装 The semiconductor package |
| 07/31/2013 | CN203103292U Package substrate structure |
| 07/31/2013 | CN203103291U Stereoscopically encapsulated MRAM |
| 07/31/2013 | CN203103290U Stereoscopically encapsulated SRAM |
| 07/31/2013 | CN203103289U Stereoscopically encapsulated computer system module |
| 07/31/2013 | CN203103288U Stereoscopically encapsulated NAND-FLASH memory |
| 07/31/2013 | CN203103287U Flat multichip packaging piece with stamping frame with square groove |
| 07/31/2013 | CN203103286U Single chip packaging piece capable of realizing SMT (surface mount technology) on basis of cylindrical inductor |
| 07/31/2013 | CN203103285U High-density etching lead frame FCAAQFN packaging piece |
| 07/31/2013 | CN203103284U TSOP (Thin Small Outline Package) memory device |
| 07/31/2013 | CN203103283U Novel MOS tube |
| 07/31/2013 | CN203103282U Chip packaging structure |
| 07/31/2013 | CN203103281U Wafer thinning single chip packaging piece after solidification of bottom filling material |
| 07/31/2013 | CN203103280U Single-chip packaging element produced by tin immersion method |
| 07/31/2013 | CN203103279U Water-cooling heat radiator of insulated gate bipolar transistor |
| 07/31/2013 | CN203103278U Vacuum superconducting heat pipe radiator |
| 07/31/2013 | CN203103277U Low-thermal-resistance bridge rectifier with main heat conducting surface made of aluminum-based copper-clad plate |
| 07/31/2013 | CN203103276U Horizontal circuit board power supply voltage stabilizing chip radiating device |
| 07/31/2013 | CN203103275U High-power IGBT module package structure |
| 07/31/2013 | CN203103274U Single chip package piece with glue film replacing bottom filler |
| 07/31/2013 | CN203103149U Electric tool switch with MOS (Metal Oxide Semiconductor) transistor |
| 07/31/2013 | CN203103148U Electric tool switch provided with diode |
| 07/31/2013 | CN203093220U Laminate, laminated board, multilayer laminated board and printed wiring board |
| 07/31/2013 | CN203093219U Laminate, laminated board, multilayer laminated board and printed wiring board |
| 07/31/2013 | CN203093218U Laminate, laminated board, multilayer laminated board and printed wiring board |
| 07/31/2013 | CN203093217U Laminate, laminated board, multilayer laminated board and printed wiring board |
| 07/31/2013 | CN103229298A Single-chip integrated circuit with capacitive isolation |
| 07/31/2013 | CN103229297A Circuit device |
| 07/31/2013 | CN103229296A Stackable semiconductor chip with edge features and method of fabricating and processing same |
| 07/31/2013 | CN103229295A Power module |
| 07/31/2013 | CN103229294A Electrolytic depositon and via filling in coreless substrate processing |
| 07/31/2013 | CN103229293A Semiconductor chip package, semiconductor module, and method for manufacturing same |
| 07/31/2013 | CN103229286A 半导体装置 Semiconductor device |
| 07/31/2013 | CN103229285A Corner structure for IC chip |
| 07/31/2013 | CN103229014A Heat exchanger and method for manufacturing same |
| 07/31/2013 | CN103228823A Heat exchanger for a system for solidifying and/or crystallizing a semiconductor |
| 07/31/2013 | CN103228754A Film sealant and sealing method |
| 07/31/2013 | CN103228753A Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet |
| 07/31/2013 | CN103228721A Encapsulation composition for photovoltaic module and photovoltaic module comprising same |
| 07/31/2013 | CN103228709A Resin molded product and process for producing same, resin composition and process for producing same, and electronic component device |
| 07/31/2013 | CN103228394A Bonded body, power semiconductor device and method for manufacturing bonded body and power semiconductor device |
| 07/31/2013 | CN103228388A Brazing method and brazed structure |
| 07/31/2013 | CN103227223A Photovoltaic power generation component junction box |
| 07/31/2013 | CN103227182A Solid-state imaging device, method of manufacturing the same |
| 07/31/2013 | CN103227174A Semiconductor memory device and layout |
| 07/31/2013 | CN103227167A Chip and test mode protection circuit and method of chip |
| 07/31/2013 | CN103227166A Semiconductor package with improved testability |
| 07/31/2013 | CN103227165A Semiconductor device having a nanotube layer and method for forming |
| 07/31/2013 | CN103227164A Semiconductor package structure and manufacturing method thereof |
| 07/31/2013 | CN103227163A Bump structural designs to minimize package defects |
| 07/31/2013 | CN103227162A Wire frame and packaging structure thereof |
| 07/31/2013 | CN103227161A Welding substrate for electronic product and manufacturing method of welding substrate |
| 07/31/2013 | CN103227160A Mixed surface coating and manufacturing method thereof |
| 07/31/2013 | CN103227159A Semiconductor package and mobile device including same |
| 07/31/2013 | CN103227158A Structure and method for technologically integrating signal wire TSVs (through silicon via) and ground wire TSVs |
| 07/31/2013 | CN103227157A Electronic device and method of manufacturing the same |
| 07/31/2013 | CN103227156A System and method for an electronic package with a fail-open mechanism |
| 07/31/2013 | CN103227155A Encapsulant with corosion inhibitor |
| 07/31/2013 | CN103227154A Power semiconductor module with pressed baseplate and method for producing a power semiconductor module with pressed baseplate |
| 07/31/2013 | CN103227145A Integrated circuits and methods for processing integrated circuits with embedded features |
| 07/31/2013 | CN103227123A Semiconductor device and method of automatically inspecting an appearance of the same |
| 07/31/2013 | CN103227116A Light-transmitting casing, manufacturing method thereof and optical module employing light-transmitting casing |
| 07/31/2013 | CN103227115A Lead frame and method of manufacturing the same, and semiconductor device and method of manufacturing the same |
| 07/31/2013 | CN102420205B Manufacturing method of advanced four-side flat pin-free package |
| 07/31/2013 | CN102386225B Lateral double-diffused metal oxide semiconductor device and manufacturing method thereof |
| 07/31/2013 | CN102244976B Bismaleimide and triazine (BT) circuit board alloy plating layer suitable for gold wire bonding |
| 07/31/2013 | CN102222609B Impurity concentration distribution control method of semiconductor component and related semiconductor component |
| 07/31/2013 | CN102203926B Manufacturing method of electronic parts module |
| 07/31/2013 | CN102104037B Luminous device with integrated circuit and manufacturing method thereof |
| 07/31/2013 | CN102017138B Die stacking system and method |
| 07/31/2013 | CN101924102B Semiconductor device |
| 07/31/2013 | CN101918888B Display device, process for producing the display device, and sputtering target |
| 07/31/2013 | CN101587876B A semiconductor device and a semiconductor integrated circuit device |
| 07/31/2013 | CN101582395B Wiring board |
| 07/31/2013 | CN101533767B Semiconductor device, metal-insulator-metal capacitor and method for manufacturing same |
| 07/31/2013 | CN101354755B Semiconductor device and method for manufacturing the same |
| 07/30/2013 | US8498680 Electrode unit joining structure for superconducting wire, superconducting wire, and superconducting coil |
| 07/30/2013 | US8497587 Thermally enhanced expanded wafer level package ball grid array structure and method of making the same |
| 07/30/2013 | US8497585 Chip package |
| 07/30/2013 | US8497584 Method to improve bump reliability for flip chip device |
| 07/30/2013 | US8497581 Semiconductor device and manufacturing method thereof |
| 07/30/2013 | US8497580 Noble metal cap for interconnect structures |
| 07/30/2013 | US8497579 Semiconductor packaging method and structure thereof |
| 07/30/2013 | US8497578 Terminal face contact structure and method of making same |
| 07/30/2013 | US8497577 Micro electrical mechanical system |
| 07/30/2013 | US8497576 Semiconductor device |
| 07/30/2013 | US8497575 Semiconductor packaging system with an aligned interconnect and method of manufacture thereof |
| 07/30/2013 | US8497574 High power semiconductor package with conductive clips and flip chip driver IC |
| 07/30/2013 | US8497573 High power semiconductor package with conductive clip on multiple transistors |
| 07/30/2013 | US8497572 Semiconductor module and method of manufacturing the same |
| 07/30/2013 | US8497571 Thin flip chip package structure |
| 07/30/2013 | US8497554 Semiconductor device comprising metal gate structures formed by a replacement gate approach and efuses including a silicide |