| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/06/2013 | US8502224 Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor |
| 08/06/2013 | US8502223 Silicon wafer having testing pad(s) and method for testing the same |
| 08/06/2013 | US8502217 Oxide semiconductor device including insulating layer and display apparatus using the same |
| 08/06/2013 | US8502089 Method for contacting a rigid printed circuit board to a contact partner and arrangement of a rigid printed circuit board and contact partner |
| 08/06/2013 | US8501976 Scalable lead zirconium titanate (PZT) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material |
| 08/06/2013 | US8501622 Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof |
| 08/06/2013 | US8501544 Semiconductor device and method of forming adhesive material over semiconductor die and carrier to reduce die shifting during encapsulation |
| 08/06/2013 | US8501543 Direct-write wafer level chip scale package |
| 08/06/2013 | US8501539 Semiconductor device package |
| 08/06/2013 | DE202013005999U1 Optische Empfangseinheit für einen nach dem Streulichtprinzip arbeitenden optischen Rauchmelder mit verbessertem Schutz gegen EMV-Einstrahlung Optical receiver unit for operating according to the principle of scattered light optical smoke detector with improved protection against electromagnetic disturbance |
| 08/06/2013 | CA2547358C Thermal interface material and solder preforms |
| 08/01/2013 | WO2013112862A1 Stacked integrated component media insert for an ophthalmic device |
| 08/01/2013 | WO2013112803A2 Multiple energization elements in stacked integrated component devices |
| 08/01/2013 | WO2013112748A1 Energized ophthalmic lens including stacked integrated components |
| 08/01/2013 | WO2013112723A1 Apparatuses and methods for providing capacitance in a multi-chip module |
| 08/01/2013 | WO2013111863A1 System for detecting temperature of semiconductor element, semiconductor module, and semiconductor module system |
| 08/01/2013 | WO2013111752A1 Package for housing electronic component and electronic device |
| 08/01/2013 | WO2013111725A1 Semiconductor device and method for manufacturing same |
| 08/01/2013 | WO2013111697A1 Resin composition and semiconductor mounting substrate obtained by molding same |
| 08/01/2013 | WO2013111592A1 Method for manufacturing semiconductor device |
| 08/01/2013 | WO2013111561A1 Cooling structure and electronic device using same |
| 08/01/2013 | WO2013111533A1 Thin film transistor substrate manufacturing method, and thin film transistor substrate manufactured by same |
| 08/01/2013 | WO2013111463A1 Material for forming passivation film for semiconductor substrate, method of manufacturing semiconductor substrate comprising passivation film for semiconductor substrate, solar cell element, and method of manufacturing solar cell element |
| 08/01/2013 | WO2013111276A1 Power semiconductor device |
| 08/01/2013 | WO2013111253A1 Led package, led light-emitting element, and method of manufacturing same |
| 08/01/2013 | WO2013111241A1 Polyimide precursor and resin composition using same |
| 08/01/2013 | WO2013111234A1 Power conversion device |
| 08/01/2013 | WO2013111225A1 Thin film transistor array apparatus and el display apparatus using same |
| 08/01/2013 | WO2013111194A1 Multilayer printed board |
| 08/01/2013 | WO2013052370A3 Stub minimization for multi-die wirebond assemblies with parallel windows |
| 08/01/2013 | US20130197129 Liquid epoxy resin composition and semiconductor device |
| 08/01/2013 | US20130194752 System and method for an electronic package with a fail-open mechanism |
| 08/01/2013 | US20130193996 Semiconductor Package with Improved Testability |
| 08/01/2013 | US20130193593 Bump structural designs to minimize package defects |
| 08/01/2013 | US20130193591 Power Semiconductor Module with Pressed Baseplate and Method for Producing a Power Semiconductor Module with Pressed Baseplate |
| 08/01/2013 | US20130193590 Semiconductor device including voltage converter circuit, and method of making the semiconductor device |
| 08/01/2013 | US20130193589 Packaged integrated circuit using wire bonds |
| 08/01/2013 | US20130193588 Semiconductor package |
| 08/01/2013 | US20130193587 Semiconductor Package Having an Interposer Configured for Magnetic Signaling |
| 08/01/2013 | US20130193586 Semiconductor device having plurality of wiring layers and designing method thereof |
| 08/01/2013 | US20130193585 Fabrication method and structure of through silicon via |
| 08/01/2013 | US20130193584 On-chip radial cavity power divider/combiner |
| 08/01/2013 | US20130193583 Semiconductor device having metal lines with slits |
| 08/01/2013 | US20130193582 Method and apparatus for connecting memory dies to form a memory system |
| 08/01/2013 | US20130193581 Packaged microdevices and methods for manufacturing packaged microdevices |
| 08/01/2013 | US20130193580 Method of manufacturing semiconductor device and semiconductor device |
| 08/01/2013 | US20130193579 Structure for nano-scale metallization and method for fabricating same |
| 08/01/2013 | US20130193578 Through-silicon vias for semicondcutor substrate and method of manufacture |
| 08/01/2013 | US20130193577 Structure of electrical contact and fabrication method thereof |
| 08/01/2013 | US20130193576 Encapsulant with corosion inhibitor |
| 08/01/2013 | US20130193575 Optimization of copper plating through wafer via |
| 08/01/2013 | US20130193574 3d chip stack having encapsulated chip-in-chip |
| 08/01/2013 | US20130193573 Methods of stress balancing in gallium arsenide wafer processing |
| 08/01/2013 | US20130193572 Ball grid array package substrate with through holes and method of forming same |
| 08/01/2013 | US20130193571 Semiconductor package and method and system for fabricating the same |
| 08/01/2013 | US20130193570 Bumping process and structure thereof |
| 08/01/2013 | US20130193569 Integrated Circuit Die And Method Of Fabricating |
| 08/01/2013 | US20130193568 Terminal Box |
| 08/01/2013 | US20130193567 Lead frame and method of manufacturing the same, and semiconductor device and method of manufacturing the same |
| 08/01/2013 | US20130193566 Integrated Circuit Shielding Film and Manufacturing Method Thereof |
| 08/01/2013 | US20130193565 Semiconductor mask blanks with a compatible stop layer |
| 08/01/2013 | US20130193564 Semiconductor structure and method and tool for forming the semiconductor structure |
| 08/01/2013 | US20130193561 Processes and structures for IC fabrication |
| 08/01/2013 | US20130193553 High performance system-on-chip inductor using post passivation process |
| 08/01/2013 | US20130193552 Integrated circuit devices with crack-resistant fuse structures |
| 08/01/2013 | US20130193550 3d integrated circuit |
| 08/01/2013 | US20130193549 Semiconductor devices including conductive plugs and methods of manufacturing the same |
| 08/01/2013 | US20130193489 Integrated circuits including copper local interconnects and methods for the manufacture thereof |
| 08/01/2013 | US20130193457 Light-Emitting Circuit, Luminaire, and Manufacturing Method for the Light-Emitting Circuit |
| 08/01/2013 | US20130193437 Device for protecting an integrated circuit against back side attacks |
| 08/01/2013 | US20130192660 Dense receiver array with bypass element |
| 08/01/2013 | US20130192078 Semiconductor device and method of automatically inspecting an appearance of the same |
| 08/01/2013 | DE19936610B4 Halbleiterbeschleunigungssensor und Verfahren zur Herstellung desselben A semiconductor acceleration sensor and method for manufacturing the same |
| 08/01/2013 | DE112011103633T5 Vorrichtungsspezifische Markierungen Device-specific markers |
| 08/01/2013 | DE112011103278T5 Struktur einer Metall-E-Sicherung Structure of a metal-E-fuse |
| 08/01/2013 | DE112006003229B4 Verfahren zur Herstellung eines Körpers mit einem darin gebildeten Fließweg und Körper mit dem darin gebildeten Fließweg A method of producing a body having a flow path formed therein and the body with the flow path formed therein |
| 08/01/2013 | DE112004003075B4 Filme mit niedriger Dielektrizitätskonstante und Herstellungsverfahren für diese Filme sowie elektronische Bauteile, die diese Filme verwenden Low dielectric constant films and manufacturing methods for these films, and electronic components using these films |
| 08/01/2013 | DE102013201363A1 Light emitting component has wall portion located between light emitting elements and protruded from bottom surface through opening, and light emitting elements that are connected by wire to bridge wall portion |
| 08/01/2013 | DE102013200907A1 Transparente Polyurethane, enthaltend elektronische Bauteile Transparent polyurethanes containing electronic components |
| 08/01/2013 | DE102013100347A1 System und verfahren für eine elektronikeinheit mit einem bei ausfall geöffneten mechanismus System and method for an electronic device with an open case failure mechanism |
| 08/01/2013 | DE102013001296A1 Hochstromfähige Zugriffseinrichtung für dreidimensionalen Halbleiterspeicher High current access device for three-dimensional semiconductor memory |
| 08/01/2013 | DE102012201172A1 Leistungshalbleitermodul mit geprägter Bodenplatte und Verfahren zur Herstellung eines Leistungshalbleitermoduls mit geprägter Bodenplatte The power semiconductor module with an embossed bottom plate and method for producing a power semiconductor module with an embossed bottom plate |
| 08/01/2013 | DE102012106250A1 Modul für ein beschleunigtes Bootverfahren eines elektronischen Gerätes sowie Verfahren Module for accelerated boot process of an electronic device and method |
| 08/01/2013 | DE102012102090A1 Thermoelektrisches Generatormodul, Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A thermoelectric generator module, metal-ceramic substrate and method for manufacturing a metal-ceramic substrate |
| 08/01/2013 | DE102011050228B4 Halbleiter-Package und Verfahren zur Herstellung eines Halbleiter-Packages mit Induktionsspule The semiconductor package and method for manufacturing a semiconductor package with inductor |
| 08/01/2013 | DE102005037321B4 Verfahren zur Herstellung von Halbleiterbauteilen mit Leiterbahnen zwischen Halbleiterchips und einem Schaltungsträger A process for producing semiconductor components having conductive paths between semiconductor chips and a circuit substrate |
| 07/31/2013 | EP2620980A1 Wiring substrate, light emitting device, and manufacturing method of wiring substrate |
| 07/31/2013 | EP2620979A2 Encapsulant with corosion inhibitor |
| 07/31/2013 | EP2620485A1 Film sealant and sealing method |
| 07/31/2013 | EP2620463A1 Powdered sealant and sealing method |
| 07/31/2013 | EP2620239A1 Heat-dissipating module and method for manufacturing the same |
| 07/31/2013 | EP2620043A1 Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing |
| 07/31/2013 | EP2619795A1 Stacked semiconductor chip device with thermal management |
| 07/31/2013 | EP2619794A1 Semiconductor chip with reinforcing through-silicon-vias |
| 07/31/2013 | EP2619793A2 Self referencing pin |
| 07/31/2013 | EP2619792A1 Multifunction sensor as pop microwave pcb |
| 07/31/2013 | EP2619247A1 Organosiloxane block copolymer |
| 07/31/2013 | EP2619245A1 Process for preparing resin-linear organosiloxane block copolymers |
| 07/31/2013 | EP2524394B1 Electronic device, method for producing the latter, and printed circuit board comprising electronic device |
| 07/31/2013 | CN203104305U Three-phase rectifier bridge module |