| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/07/2013 | EP1742265B1 Coolant cooled type semiconductor device |
| 08/07/2013 | CN203120373U Radiator combined structure |
| 08/07/2013 | CN203118955U Transistor and heat dissipating device thereof |
| 08/07/2013 | CN203118942U High voltage silicon stack for microwave equipment |
| 08/07/2013 | CN203118941U Wafer level three-dimensional capacitor structure |
| 08/07/2013 | CN203118940U Semiconductor structure |
| 08/07/2013 | CN203118939U Square flat type power device capsule |
| 08/07/2013 | CN203118938U IGBT (insulated gate bipolar transistor) elastic main electrode |
| 08/07/2013 | CN203118937U Semiconductor encapsulation structure convenient to position |
| 08/07/2013 | CN203118936U Package structure for rectifier semiconductor chip |
| 08/07/2013 | CN203118935U DFN (dual flat-pack no-lead) package structure for rectifier chip |
| 08/07/2013 | CN203118934U Paster type diode device |
| 08/07/2013 | CN203118933U Memory chip with odd pins |
| 08/07/2013 | CN203118932U Radiating module |
| 08/07/2013 | CN203118931U Simple wafer radiator |
| 08/07/2013 | CN203118930U Wafer radiating module |
| 08/07/2013 | CN203118929U Chip structure with silica gel protection layer |
| 08/07/2013 | CN203118928U Packaging structure |
| 08/07/2013 | CN203118927U No-base-plate power module |
| 08/07/2013 | CN203118926U High-reliability and high-pressure-resistance insulation structure |
| 08/07/2013 | CN203117620U TET array substrate and display device |
| 08/07/2013 | CN103238213A Tilt bare chip stack body |
| 08/07/2013 | CN103236428A RPMC-comprising (replay protection monotonic counter-comprising) enhanced flash chip and packaging method thereof |
| 08/07/2013 | CN103236426A Equal-directional array type rectifier bridge stack |
| 08/07/2013 | CN103236425A DRAM (dynamic random access memory) double-chip stacking and packaging structure and packaging technology |
| 08/07/2013 | CN103236424A Wafer level packaging structure and packaging method |
| 08/07/2013 | CN103236422A Intelligent power module and manufacturing method thereof |
| 08/07/2013 | CN103236421A Copper wire bonding structure between chip pad points and bonding method thereof |
| 08/07/2013 | CN103236420A Packaging structure shared by heat dissipation channel and ground wire channel in three-dimensional packaging |
| 08/07/2013 | CN102412216B Intelligent refrigerator control chip radiating assembly |
| 08/07/2013 | CN102403283B Ball grid array packaging structure with basic islands and manufacturing method thereof |
| 08/07/2013 | CN102332437B Heat pipe radiating device and installation method thereof |
| 08/07/2013 | CN102222656B Leadframe package for high-speed data rate applications |
| 08/07/2013 | CN102165582B Leadframe substrate, method for manufacturing same, and semiconductor device |
| 08/07/2013 | CN102044500B Chip carrier plate as well as encapsulating structure and method thereof |
| 08/07/2013 | CN102027592B Substrate for power module, power module, and method for producing substrate for power module |
| 08/07/2013 | CN102010598B Silicone composition and cured product thereof |
| 08/07/2013 | CN101925290B Flat type heat radiating mechanism on heating surface with parallel radiator fins |
| 08/07/2013 | CN101865371B Illumination device |
| 08/07/2013 | CN101865370B Light-emitting diode lamp |
| 08/07/2013 | CN101835364B Heat-dissipating device |
| 08/07/2013 | CN101819945B Manufacturing method of semiconductor device with fuse module |
| 08/07/2013 | CN101808488B Heat dissipating device |
| 08/07/2013 | CN101728387B Integrated circuit layout pattern for cross-coupled circuits |
| 08/07/2013 | CN101621043B Standing chip scale package |
| 08/07/2013 | CN101539691B System for displaying images and manufacturing method thereof |
| 08/07/2013 | CN101533788B Electrical element having transparent portion and a sealing method of the same and thermosetting resin composition for sealing |
| 08/06/2013 | US8503212 Semiconductor memory apparatus with power-meshed structure |
| 08/06/2013 | US8503189 Pb-free solder-connected structure and electronic device |
| 08/06/2013 | US8503181 Semiconductor device with a zigzag radiator |
| 08/06/2013 | US8502401 Polymeric compositions comprising per(phenylethynyl) arene derivatives |
| 08/06/2013 | US8502400 Methods and apparatuses to stiffen integrated circuit package |
| 08/06/2013 | US8502399 Resin composition for encapsulating semiconductor and semiconductor device |
| 08/06/2013 | US8502398 Wiring board, semiconductor apparatus and method of manufacturing them |
| 08/06/2013 | US8502397 Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet |
| 08/06/2013 | US8502396 Embedded package security tamper mesh |
| 08/06/2013 | US8502395 Semiconductor device and a method of manufacturing the same |
| 08/06/2013 | US8502394 Multi-stacked semiconductor dice scale package structure and method of manufacturing same |
| 08/06/2013 | US8502393 Chip package and method for forming the same |
| 08/06/2013 | US8502392 Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die |
| 08/06/2013 | US8502391 Semiconductor device and method of making single layer substrate with asymmetrical fibers and reduced warpage |
| 08/06/2013 | US8502389 CMOS image sensor and method for forming the same |
| 08/06/2013 | US8502388 Semiconductor device and method for fabricating the same |
| 08/06/2013 | US8502386 Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages |
| 08/06/2013 | US8502385 Power semiconductor device |
| 08/06/2013 | US8502384 Semiconductor device and manufacturing method thereof |
| 08/06/2013 | US8502383 Integrated circuit including detection circuit to detect electrical energy delivered by a thermoelectric material |
| 08/06/2013 | US8502382 MEMS and protection structure thereof |
| 08/06/2013 | US8502381 Barrier layer configurations and methods for processing microelectronic topographies having barrier layers |
| 08/06/2013 | US8502380 Chip package and fabrication method thereof |
| 08/06/2013 | US8502379 Method for manufacturing semiconductor device, and semiconductor device |
| 08/06/2013 | US8502378 Package unit and stacking structure thereof |
| 08/06/2013 | US8502377 Package substrate for bump on trace interconnection |
| 08/06/2013 | US8502376 Wirebondless wafer level package with plated bumps and interconnects |
| 08/06/2013 | US8502375 Corrugated die edge for stacked die semiconductor package |
| 08/06/2013 | US8502374 Power module package and method for manufacturing the same |
| 08/06/2013 | US8502373 3-D integrated circuit lateral heat dissipation |
| 08/06/2013 | US8502372 Low-cost 3D face-to-face out assembly |
| 08/06/2013 | US8502371 Integrated circuit package system with extended corner leads |
| 08/06/2013 | US8502370 Stack package structure and fabrication method thereof |
| 08/06/2013 | US8502368 Multi-chip package with offset die stacking |
| 08/06/2013 | US8502367 Wafer-level packaging method using composite material as a base |
| 08/06/2013 | US8502366 Semiconductor package |
| 08/06/2013 | US8502364 Semiconductor device member, production method of semiconductor-device-member formation liquid and semiconductor device member, and semiconductor-device-member formation liquid, phosphor composition, semiconductor light-emitting device, lighting system and image display system using the same |
| 08/06/2013 | US8502363 Semiconductor device packages with solder joint enhancement element and related methods |
| 08/06/2013 | US8502362 Semiconductor package containing silicon-on-insulator die mounted in bump-on-leadframe manner to provide low thermal resistance |
| 08/06/2013 | US8502361 Concentrated photovoltaic receiver package with stacked internal support features |
| 08/06/2013 | US8502360 Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device |
| 08/06/2013 | US8502359 Semiconductor device |
| 08/06/2013 | US8502358 Integrated circuit packaging system with multi-row leads and method of manufacture thereof |
| 08/06/2013 | US8502356 Organic thin film transistors |
| 08/06/2013 | US8502355 Overlay vernier mask pattern, formation method thereof, semiconductor device including overlay vernier pattern, and formation method thereof |
| 08/06/2013 | US8502354 Break pattern of silicon wafer, silicon wafer, and silicon substrate |
| 08/06/2013 | US8502353 Through-wafer interconnects for photoimager and memory wafers |
| 08/06/2013 | US8502352 Semiconductor device with conductive vias between saw streets |
| 08/06/2013 | US8502304 Semiconductor substrate and semiconductor chip |
| 08/06/2013 | US8502276 Compact memory arrays |
| 08/06/2013 | US8502275 Thin film transistor array panel for a liquid crystal display |
| 08/06/2013 | US8502274 Integrated circuit including power transistor cells and a connecting line |
| 08/06/2013 | US8502269 Semiconductor device |