| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/15/1986 | US4582975 Circuit chip |
| 04/15/1986 | US4582954 Diamond heatsink assemblies |
| 04/15/1986 | US4582745 Semiconductors |
| 04/15/1986 | US4582722 Using protective layer to isolate areas on which plating is not desired |
| 04/15/1986 | US4582563 Process for forming multi-layer interconnections |
| 04/15/1986 | US4582556 Adhesion primers for encapsulating epoxies |
| 04/15/1986 | US4582130 Heat exchanger for an electronics cabinet |
| 04/15/1986 | US4581815 Integrated circuit structure having intermediate metal silicide layer and method of making same |
| 04/10/1986 | WO1986002200A1 Lead frame having improved arrangement of supporting leads and semiconductor device employing the same |
| 04/09/1986 | EP0177336A2 Gate array integrated device |
| 04/09/1986 | EP0177251A1 A semiconductor device having a reliable bonding pad structure |
| 04/09/1986 | EP0177220A2 Method for embedding electrical and electronic circuitry |
| 04/09/1986 | EP0177105A2 Method for providing a semiconductor device with planarized contacts |
| 04/09/1986 | EP0177042A2 Electronic circuit device and method of producing the same |
| 04/09/1986 | EP0176762A1 Monolithic integrated bipolar Darlington circuit |
| 04/09/1986 | EP0176746A1 Manufacture of copper bumps for integrated circuits |
| 04/09/1986 | EP0176557A1 Impedance-matched leads. |
| 04/09/1986 | EP0176555A1 Multilayer hybrid integrated circuit. |
| 04/08/1986 | US4581679 Multi-element circuit construction |
| 04/08/1986 | US4581628 Circuit programming by use of an electrically conductive light shield |
| 04/08/1986 | US4581622 Semiconductors |
| 04/08/1986 | US4581411 Rubbery compounds as modifiers for poly(arylene sulfide) |
| 04/08/1986 | US4581279 Thick film circuit board |
| 04/08/1986 | US4581250 Microwave component mounting |
| 04/08/1986 | US4581096 Tape applying device |
| 04/08/1986 | US4580523 Jig apparatus for arraying and supporting works to be soldered |
| 04/08/1986 | US4580332 Forming a conductive, protective layer for multilayer metallization |
| 04/02/1986 | EP0176245A2 Multilayer wiring substrate |
| 04/02/1986 | EP0176010A2 Integrated circuit fabrication process and device |
| 04/02/1986 | EP0175901A1 Plated parts and their production |
| 04/02/1986 | EP0175870A2 Wafer scale integrated circuit device |
| 04/01/1986 | US4580157 Semiconductor device having a soft-error preventing structure |
| 04/01/1986 | US4579812 Process for forming slots of different types in self-aligned relationship using a latent image mask |
| 04/01/1986 | CA1202732A1 Semiconductor chip package |
| 04/01/1986 | CA1202725A1 Semiconductor integrated circuit with battery |
| 03/26/1986 | EP0175489A2 An eprom device and method of manufacturing same |
| 03/26/1986 | EP0175488A2 EPROM device |
| 03/26/1986 | EP0175361A2 glass composite |
| 03/26/1986 | EP0175183A1 Copper alloys having an improved combination of strength and conductivity |
| 03/26/1986 | EP0175085A2 Wafer scale integrated circuit device |
| 03/26/1986 | EP0174986A1 Process for forming and locating buried layers. |
| 03/26/1986 | EP0174985A1 Conductive, protective layer for multilayer metallization |
| 03/26/1986 | EP0174950A1 Wafer scale package system and header and method of manufacture thereof |
| 03/25/1986 | US4578745 Semiconductor valve |
| 03/25/1986 | US4578697 Semiconductor device encapsulating a multi-chip array |
| 03/25/1986 | US4578304 For mounting electronic circuits |
| 03/25/1986 | US4577923 Microwave integrated circuit and mounting device therefor |
| 03/19/1986 | EP0174776A2 Flexible tape having stripes of electrically conductive particles for making multiple connections |
| 03/19/1986 | EP0174773A2 Semiconductor device having interconnection layers |
| 03/19/1986 | EP0174712A2 Semiconductor devices having electrically conductive paths |
| 03/19/1986 | EP0174647A2 Ultra-violet light crosslinkable organopolysiloxane compositions and process for embedding electronic components |
| 03/19/1986 | EP0174537A1 Flexible cooling body surrounded by a moving cooling fluid when operating |
| 03/19/1986 | EP0174494A2 Thermostable polymer system, cross-linkable by irradiation, for microelectronic use |
| 03/19/1986 | EP0174457A1 Transistor devices for microwave oscillator elements |
| 03/19/1986 | EP0042380B1 Method for achieving ideal impurity base profile in a transistor |
| 03/18/1986 | US4577214 Low-inductance power/ground distribution in a package for a semiconductor chip |
| 03/18/1986 | US4577213 Internally matched Schottky barrier beam lead diode |
| 03/18/1986 | US4577212 Structure for inhibiting forward bias beta degradation |
| 03/18/1986 | US4577056 Refractory oxide on substrate, metal covering bands |
| 03/18/1986 | US4576224 Diamond heatsink assemblies |
| 03/13/1986 | WO1986001674A1 Electrical connector device |
| 03/13/1986 | WO1986001640A1 Diffusion barrier layer for integrated-circuit devices |
| 03/13/1986 | WO1986001639A1 Electrical contact in semiconductor devices |
| 03/12/1986 | EP0174185A2 Semiconductor device and manufacturing method thereof |
| 03/12/1986 | EP0174020A2 Integrated circuit package with integral heat dissipating means |
| 03/12/1986 | EP0173847A1 Lead frame and electronic device employing the same |
| 03/12/1986 | EP0173734A1 Improved integrated circuit structure having intermediate metal silicide layer and method of making same |
| 03/12/1986 | EP0173733A1 Capacitive device. |
| 03/11/1986 | US4575748 Semiconductor device |
| 03/11/1986 | US4575747 Device for protecting film-mounted integrated circuits against destruction due to electrostatic charges |
| 03/11/1986 | US4575746 Crossunders for high density SOS integrated circuits |
| 03/11/1986 | US4575745 Tailorable standard cells and method for tailoring the performance of IC designs |
| 03/11/1986 | US4575744 Interconnection of elements on integrated circuit substrate |
| 03/11/1986 | US4574879 Polyimide filled with boron nitride or aluminum oxide |
| 03/11/1986 | US4574877 Can-type evaporative cooling device for power semiconductor elements |
| 03/11/1986 | US4574470 Semiconductor chip mounting system |
| 03/11/1986 | CA1201820A1 Semiconductor integrated circuit including a lead frame chip support |
| 03/11/1986 | CA1201819A1 Electronic device method using a leadframe with an integral mold vent means |
| 03/11/1986 | CA1201817A1 Self-positioning heat spreader |
| 03/05/1986 | EP0173616A1 Dielectric ceramic substrate and method of making it |
| 03/05/1986 | EP0173524A2 Method of eliminating titanium silicide penetration into polysilicon during the oxidation of a polycide structure |
| 03/05/1986 | EP0173245A1 Semiconductor memory device having a polycrystalline silicon layer |
| 03/05/1986 | EP0172889A1 Integrated circuit chip assembly |
| 03/04/1986 | US4574331 Multi-element circuit construction |
| 03/04/1986 | US4574299 Thyristor packaging system |
| 03/04/1986 | US4574297 Semiconductor device |
| 03/04/1986 | US4574255 MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate |
| 03/04/1986 | US4574162 Compact circuit package with improved construction for clamping to enhance heat transfer |
| 03/04/1986 | CA1201537A1 Semiconductor structures and manufacturing methods |
| 03/04/1986 | CA1201496A1 Electrical connectors with quasi-terminal pins |
| 02/26/1986 | EP0172554A2 Enclosed thyristor valve |
| 02/26/1986 | EP0172485A1 Common housing for two semiconductor bodies |
| 02/26/1986 | EP0172324A2 Resin encapsulation type semiconductor device by use of epoxy resin composition |
| 02/26/1986 | EP0172193A1 Programmable read-only memory cell and method of fabrication. |
| 02/25/1986 | US4573067 Method and means for improved heat removal in compact semiconductor integrated circuits |
| 02/25/1986 | US4572972 CMOS Logic circuits with all pull-up transistors integrated in separate chip from all pull-down transistors |
| 02/25/1986 | US4572924 Electronic enclosures having metal parts |
| 02/25/1986 | US4572886 Optical method for integrated circuit bar identification |
| 02/25/1986 | US4572853 Resin encapsulation type semiconductor device |
| 02/25/1986 | US4572757 Method of making a microcircuit substrate |