H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1986
10/21/1986	US4618467 Method for sealing cavities
10/21/1986	US4618209 Lead member and method of fixing thereof
10/21/1986	US4617730 Method of fabricating a chip interposer
10/21/1986	US4617729 Process for manufacturing miniaturized electronic power circuits
10/21/1986	US4617723 Metal and silicon layers activated by low temperature silicide formation
10/21/1986	US4617708 Component module for piggyback mounting on a circuit package having dual-in-line leads, and methods of fabricating same
10/21/1986	CA1213079A1 Microwave semiconductor device working together with another semiconductor device for reference potential
10/21/1986	CA1213078A1 Semiconductor component embedded in a compound-filled cup
10/21/1986	CA1213074A1 Master slice semiconductor device
10/15/1986	EP0197894A2 Assembly including a modular electrical or electronic circuit, and a connector for linking the circuit to an autonomous electrical system
10/15/1986	EP0197847A1 Method of manufacturing electronic-memory boards, and boards obtained by this method
10/15/1986	EP0197639A2 Semiconductor memory device
10/15/1986	EP0197438A1 Method of manufacturing electronic modules for microcircuit boards and modules obtained by this method
10/15/1986	EP0197148A1 Printed-circuit board for mounting electronic element and method of manufacture thereof
10/15/1986	EP0197089A1 Wafer-scale-integrated assembly.
10/15/1986	CN86102472A Apparatus for vapor-cooling a semiconductor
10/14/1986	US4617605 Carrier element for an IC module
10/14/1986	US4617586 High-frequency circuit comprising an integrated capacitor
10/14/1986	US4617585 Plastic enclosing device
10/14/1986	US4617584 Resin encapsulation type semiconductor device
10/14/1986	US4617193 Planar interconnect for integrated circuits
10/14/1986	US4617181 Consistent high termoconductivity
10/14/1986	US4617160 Method for fabricating modules comprising uniformly stacked, aligned circuit-carrying layers
10/14/1986	US4617071 Method of fabricating electrically connected regions of opposite conductivity type in a semiconductor structure
10/14/1986	US4616895 Integrated circuit socket
10/14/1986	US4616412 Method for bonding electrical leads to electronic devices
10/14/1986	US4616406 Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein
10/09/1986	WO1986005942A1 Electronic module with self-activated heat pipe
10/08/1986	EP0196865A2 Electronic circuit substrates
10/08/1986	EP0196863A1 Cooling system for electronic circuit components
10/08/1986	EP0196747A2 Substrate structure for a semiconductor device
10/08/1986	EP0196670A2 Ceramic substrates for microelectronic circuits and process for producing same
10/08/1986	EP0196636A2 A teaching and demonstrating apparatus for electrical circuits
10/08/1986	EP0196374A1 Semiconductor embedded layer technology
10/07/1986	US4616250 Contact assembly for small semiconductor device
10/07/1986	US4615857 Plastic encapsulating electronic devices; injection or transfer molding
10/07/1986	US4615741 Filler for electronic element encapsulation resin and electronic element encapsulation resin composition containing the same
10/07/1986	US4615441 IC package carrier
10/07/1986	CA1212484A1 Semiconductor package
10/01/1986	EP0196054A2 Semiconductor module cooling structure
10/01/1986	EP0195977A2 Metal interconnection system with a planar surface
10/01/1986	CN85107077A 半导体器件及其制造法 Semiconductor device and manufacturing method
09/1986
09/30/1986	US4614963 Corrosion resistance using cresol
09/30/1986	US4614666 Semi-conductor device with sandwich passivation coating
09/30/1986	US4614387 Connecting element for chip carriers
09/30/1986	US4614227 Cooling body for the liquid cooling of high-power semiconductor components
09/30/1986	CA1212181A2 Semiconductor structures and manufacturing methods
09/30/1986	CA1212173A1 Immersion cooled high density electronic assembly
09/24/1986	EP0195716A1 Thick bus metallization interconnect structure to reduce bus area
09/24/1986	EP0195701A1 Multiple staple and device for mounting electronic power components collectively
09/24/1986	EP0195700A1 Method of producing a refractory metal silicide layer on a substrate, possibly with an insulating layer, especially used for making integrated-circuit interconnection layers
09/24/1986	EP0195520A1 Coplanar microstrap waveguide
09/24/1986	CN86101795A Semiconductor device and its process of production as well as lead frame for above-mentioned process
09/24/1986	CN85204502U Vhf transistor shell
09/24/1986	CN85204479U Shf metal-sealed shell transistor
09/23/1986	US4613892 Laminated semiconductor assembly
09/23/1986	US4613891 Packaging microminiature devices
09/23/1986	US4613888 Semiconductor device of multilayer wiring structure
09/23/1986	US4613541 Electronic device using electron transport proteins
09/23/1986	US4612978 Apparatus for cooling high-density integrated circuit packages
09/23/1986	US4612805 Adhesion characterization test site
09/23/1986	CA1211863A1 Mirror wafer of compound semiconductor
09/23/1986	CA1211862A1 Electrically insulated heat sink assemblies and insulators used therein
09/23/1986	CA1211861A1 Heat sink for electronic components
09/23/1986	CA1211859A1 Electric circuit units
09/17/1986	EP0194950A2 High temperature interconnect system for an integrated circuit
09/17/1986	EP0194946A2 Pressurized contact type double gate static induction thyristor
09/17/1986	EP0194519A2 Electric circuits having repairable circuit lines and method of making the same
09/17/1986	EP0194475A2 Semiconductor die attach system
09/17/1986	EP0194358A1 Heat sink using a sintered body having high heat-conductivity and method of manufacturing thereof
09/16/1986	US4612629 Highly scalable dynamic RAM cell with self-signal amplification
09/16/1986	US4612601 Heat dissipative integrated circuit chip package
09/16/1986	US4612566 Microwave transistor mounting structure
09/16/1986	US4612565 Semiconductor memory device
09/16/1986	US4612564 Plastic integrated circuit package
09/16/1986	US4612562 PNPN switch device with capacitor formed outside active device areas
09/16/1986	US4612258 Method for thermally oxidizing polycide substrates in a dry oxygen environment and semiconductor circuit structures produced thereby
09/16/1986	US4612167 Copper-base alloys for leadframes
09/16/1986	US4612083 Process of fabricating three-dimensional semiconductor device
09/16/1986	US4611882 High-frequency circuit device with an annular capacitor on the back of an insulated substrate
09/16/1986	US4611869 Clamping device
09/16/1986	US4611745 Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same
09/16/1986	US4611398 Integrated circuit package
09/16/1986	US4611389 For the fabrication of a semiconductor device package
09/12/1986	WO1986005322A1 Semiconducteur circuit device
09/10/1986	EP0194216A1 Monolithic substrate for an electric power component, and method for its manufacture
09/10/1986	EP0194205A2 A method for fabricating A 1-chip microcomputer
09/10/1986	EP0194133A2 Bond wire transmission line
09/10/1986	EP0193907A2 Hybrid and multi-layer circuitry
09/10/1986	EP0193747A2 Device for cooling integrated circuit chip
09/10/1986	EP0193661A1 Diode and connector with built-in diode
09/09/1986	US4611238 Integrated circuit package incorporating low-stress omnidirectional heat sink
09/09/1986	US4611237 Semiconductor integrated circuit device
09/09/1986	US4610843 Low-alloy (Ni-Sn-Ti) copper alloy
09/09/1986	US4610299 Spring-biased heat sink
09/09/1986	US4610076 Method of manufacturing an insulated gate field effect transistor
09/09/1986	CA1210984A1 Method of making planarizing non-conductive layers employing conductive metals
09/03/1986	EP0193331A2 Process for forming a doped polysilicon pattern
09/03/1986	EP0193251A1 Encapsulated chemoresponsive microelectronic device arrays
09/03/1986	EP0193127A1 Film-mounted circuit and method for its manufacture

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