| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/14/1986 | US4564739 Apparatus for labeling parts with a laser |
| 01/14/1986 | US4564562 Silicone encapsulated devices |
| 01/14/1986 | US4564251 Leadless chip carrier adapter |
| 01/14/1986 | US4563811 Method of making a dual-in-line package |
| 01/14/1986 | CA1199428A1 Bay packing method and integrated circuit employing same |
| 01/14/1986 | CA1199424A1 Lead frame with fusible links |
| 01/08/1986 | EP0167357A2 Photosensor devices and optical pick-ups |
| 01/08/1986 | EP0167348A2 Terminal straightener for an integrated circuit package |
| 01/08/1986 | EP0167198A1 Starting mixture for an isolating composition containing a lead glass, screen printing ink comprising such a mixture, and use of this ink for protecting hybrid microcircuits on ceramic substrates |
| 01/08/1986 | EP0167075A2 Process for bonding current carrying elements to a substrate |
| 01/08/1986 | EP0167051A1 Thermostable and irradiation-curable polymer system based on bisphenol and epichlorohydrine, and method for its preparation |
| 01/08/1986 | EP0167033A2 Apparatus for conduction cooling |
| 01/08/1986 | EP0166964A1 A double level polysilicon semiconductor structure |
| 01/08/1986 | EP0166932A1 Protective circuit arrangement |
| 01/08/1986 | EP0166762A1 Electrical circuitry |
| 01/08/1986 | EP0074168B1 Device and method for packaging electronic devices |
| 01/07/1986 | US4563725 Electrical assembly |
| 01/07/1986 | US4563575 Identification card having an embedded IC module |
| 01/07/1986 | US4563543 Stable interface between silver alloy and gold deposits |
| 01/07/1986 | US4563541 Package providing high heat dissipation, in particular for microelectronics |
| 01/07/1986 | US4563383 Direct bond copper ceramic substrate for electronic applications |
| 01/07/1986 | US4563375 Heat dissipation in electronic equipment |
| 01/07/1986 | US4562640 Method of manufacturing stable, low resistance contacts in integrated semiconductor circuits |
| 01/02/1986 | EP0166634A1 Electric voltage dividing device and electronic component containing a package including such a device |
| 01/02/1986 | EP0166633A1 Metallisation structure for making contacts with a semiconductor device, and device comprising such a structure |
| 01/02/1986 | EP0166423A2 Semiconductor integrated circuit having complementary field effect transistors |
| 01/02/1986 | EP0166401A2 Circuit module |
| 01/02/1986 | EP0166344A2 Means for alleviating emitter contact stress in bipolar transistors |
| 01/02/1986 | EP0166289A2 High density module for semiconductor device chips |
| 01/02/1986 | EP0166225A2 High yield liquid crystal display and method of making same |
| 01/02/1986 | EP0166112A2 Semiconductor device with bonding pads surrounded by source and/or drain regions |
| 01/02/1986 | EP0166027A2 C-MOS basic cell |
| 12/31/1985 | US4562513 Process for forming a high density metallurgy system on a substrate and structure thereof |
| 12/31/1985 | US4562455 Semiconductor element |
| 12/31/1985 | US4562092 Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits |
| 12/31/1985 | US4561907 Process for forming low sheet resistance polysilicon having anisotropic etch characteristics |
| 12/31/1985 | US4561906 Doping polysilicon applying absorption mask, applying laser to diffuse dopant, forming additional connectors |
| 12/31/1985 | US4561891 Contains beryllium, dielectric, thermoconductivity |
| 12/31/1985 | US4561219 Process and apparatus for finishing electronic device |
| 12/31/1985 | US4561173 Method of manufacturing a wiring system |
| 12/31/1985 | CA1198833A1 Tape-automated-bonding of integrated circuits |
| 12/31/1985 | CA1198829A1 High-speed wire wrap board |
| 12/27/1985 | EP0165829A1 Encapsulating housing with thermal dissipation for electric circuits |
| 12/27/1985 | EP0165705A1 Integrated circuit chip carrier |
| 12/27/1985 | EP0165626A1 Method of manufacturing an electronic microcircuit provided with contact elevations |
| 12/27/1985 | EP0165575A2 Method for forming vias in a planar structure |
| 12/27/1985 | EP0165513A2 Semiconductor contact metal protection |
| 12/27/1985 | EP0165427A2 Semiconductor package substrate and manufacturing process |
| 12/24/1985 | US4561040 Cooling system for VLSI circuit chips |
| 12/24/1985 | US4561011 Dimensionally stable semiconductor device |
| 12/24/1985 | US4561010 Containing beryllium, boron or compounds thereof and nondiffusing metal (or) compound adjuvant |
| 12/24/1985 | US4561009 Semiconductor device |
| 12/24/1985 | US4561006 Integrated circuit package with integral heating circuit |
| 12/24/1985 | US4561004 High density, electrically erasable, floating gate memory cell |
| 12/24/1985 | US4560826 Hermetically sealed chip carrier |
| 12/24/1985 | US4560580 Melting polyarylene sulfide with one print compound |
| 12/24/1985 | US4560218 Socket for surface mount dip |
| 12/24/1985 | US4560216 Connector with component removal means |
| 12/24/1985 | US4559697 Method of fixing insertion electrode panel in compression-bonded semiconductor device |
| 12/19/1985 | WO1985005735A1 Integrated circuit package |
| 12/19/1985 | WO1985005733A1 High density ic module assembly |
| 12/18/1985 | EP0165212A2 Connector and method of making |
| 12/18/1985 | EP0165085A1 Method of manufacturing aluminium contacts through a thick insulating layer in a circuit |
| 12/18/1985 | EP0164949A2 Programmable programmed socket |
| 12/18/1985 | EP0164920A2 A soluble imide oligomer and a method for producing the same |
| 12/18/1985 | EP0164841A1 Ceramic composition for dielectrics |
| 12/18/1985 | EP0164794A2 Multi-layer heat sinking integrated circuit package |
| 12/18/1985 | EP0164646A2 Buried field shield for an integrated circuit |
| 12/17/1985 | US4559580 Semiconductor package with internal heat exchanger |
| 12/17/1985 | US4559579 Device for the protection of an electronic component and/or circuit against the disturbances (voltages) generated by an external electromagnetic field |
| 12/17/1985 | US4558912 Edge connector for chip carrier |
| 12/17/1985 | US4558510 Method of producing a semiconductor device |
| 12/11/1985 | EP0164106A2 PNPN switch device |
| 12/11/1985 | EP0163978A2 Method for routing electrical connections on integrated products and resulting product |
| 12/11/1985 | EP0163871A1 Method of producing gate electrodes composed of double layers made of high-melting metal silicides and doped polycrystalline silicon |
| 12/11/1985 | EP0163856A1 Method of making lead frame support for ic chip |
| 12/11/1985 | EP0163830A2 Multi-layer integrated circuit substrates and method of manufacture |
| 12/11/1985 | EP0163795A2 A method and means for reducing signal propagation losses in very large scale integrated circuits |
| 12/11/1985 | EP0163731A1 Semiconductor device pad area protection structure |
| 12/10/1985 | US4558395 Cooling module for integrated circuit chips |
| 12/10/1985 | US4558346 Substrate gold layer; integrated circuit chip; metal terminal chip |
| 12/10/1985 | US4558345 Multiple connection bond pad for an integrated circuit device and method of making same |
| 12/10/1985 | US4558171 Hermetic enclosure for electronic components with an optionally transparent cover and a method of making the same |
| 12/10/1985 | US4557036 Semiconductor device and process for manufacturing the same |
| 12/05/1985 | WO1985005497A1 Monolithic integrated planar semi-conductor device |
| 12/05/1985 | WO1985005496A1 Mounting semi-conductor chips |
| 12/05/1985 | WO1985005349A1 Alumina for semiconductor memory cell package and process for its production |
| 12/04/1985 | EP0163548A2 Method for producing multilayer ceramic circuit board |
| 12/04/1985 | EP0163534A2 IC card and method for manufacturing the same |
| 12/04/1985 | EP0163510A2 Hermetically sealable package for electronic component |
| 12/04/1985 | EP0163384A1 Power source lines arrangement in an integrated circuit |
| 12/04/1985 | EP0163163A2 Method of manufacturing power semiconductor modules mounted on an insulating base |
| 12/04/1985 | EP0163155A1 Low temperature fired ceramics |
| 12/04/1985 | EP0163132A1 A semiconductor memory device comprising a matrix of six-transistor memory cells with a pair of CMOS inverters |
| 12/04/1985 | EP0163082A1 Packaged integrated circuit chip |
| 12/04/1985 | EP0163081A1 Method of making encapsulated IC chip |
| 12/04/1985 | EP0163077A1 Method of making packaged IC chip |
| 12/03/1985 | US4556899 Insulated type semiconductor devices |
| 12/03/1985 | US4556898 Semiconductor device |
| 12/03/1985 | US4556897 Titanium coated aluminum leads |