| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/03/1986 | CA1205552A1 Series-parallel flow cooling apparatus |
| 05/28/1986 | EP0182371A2 Protection film structure for functional devices |
| 05/28/1986 | EP0182222A2 Semiconductor integrated circuit device constructed by polycell technique |
| 05/28/1986 | EP0182184A2 Process for the bubble-free bonding of a large-area semiconductor component to a substrate by soldering |
| 05/28/1986 | EP0182103A1 Heat radiation control device |
| 05/28/1986 | EP0182066A1 Sealing compound for electrical or electronic construction parts or groups |
| 05/28/1986 | EP0181975A1 Semiconductor device comprising a support body |
| 05/27/1986 | US4592022 Semiconductor memory |
| 05/27/1986 | US4591945 Device for protecting electronic circuits against electrostatic charges |
| 05/27/1986 | US4591896 Pressure-contact sealing arrangement for a semiconductor pellet |
| 05/27/1986 | US4591895 CMOS circuit with separate power lines to suppress latchup |
| 05/27/1986 | US4591894 Semiconductor device having a plurality of CMOS I/O cells located at the periphery of the chip arranged in a direction perpendicular to the sides of the chip |
| 05/27/1986 | US4591537 High thermoconductivity gor efficient heat dissiration |
| 05/27/1986 | US4591484 Lead materials for semiconductor devices |
| 05/27/1986 | US4590672 Package for electronic device and method for producing same |
| 05/27/1986 | CA1205209A1 Method for using titanium-tungsten alloy as a barrier metal in silicon semiconductor processing |
| 05/22/1986 | WO1986003056A1 Process for encapsulating microelectronic circuits with organic components |
| 05/22/1986 | WO1986003055A1 Process for encapsulating micro-electronic semi-conductor and layer-type circuits |
| 05/21/1986 | EP0181760A2 A device comprising a pair of CMOS FETs and a method of making it |
| 05/21/1986 | EP0181600A2 Signal transmission circuit in a semiconductor integrated circuit |
| 05/21/1986 | EP0181534A1 Vehicle arrangement |
| 05/21/1986 | EP0181416A1 Electrical component forming process |
| 05/21/1986 | EP0181355A1 Monolithic integrated planar semi-conductor device. |
| 05/20/1986 | US4590589 Electrically programmable read only memory |
| 05/20/1986 | US4590538 Immersion cooled high density electronic assembly |
| 05/20/1986 | US4590534 Tubes for integrated circuits |
| 05/20/1986 | US4590508 In a semiconductor memory device |
| 05/20/1986 | US4590382 Method of aligning two members utilizing marks provided thereon |
| 05/20/1986 | US4590258 Heat sealable coatings |
| 05/20/1986 | US4590095 Nickel coating diffusion bonded to metallized ceramic body and coating method |
| 05/20/1986 | US4590093 Accuracy, semiconductors |
| 05/20/1986 | US4589962 Electrodeposition or tin or tin-lead alloy onto leads |
| 05/20/1986 | US4589195 Method of fabricating a high current package with multi-level leads |
| 05/16/1986 | EP0166762A4 Electrical circuitry. |
| 05/14/1986 | EP0180906A1 Wave resistance-adapted chip support for a microwave semiconductor |
| 05/14/1986 | EP0180808A2 Electrical interconnection and method for its fabrication |
| 05/14/1986 | EP0180730A1 Arrangement for the tension compensation and the heat dissipation of an electronic component |
| 05/13/1986 | US4589010 Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor |
| 05/13/1986 | US4589008 Apparatus for electrically joining the ends of substantially parallel semiconductor lines |
| 05/13/1986 | US4589007 Semiconductor integrated circuit device |
| 05/13/1986 | US4588028 Heat sink and method of manufacture |
| 05/13/1986 | US4588023 Device for releasing heat |
| 05/13/1986 | US4587719 Method of fabrication of long arrays using a short substrate |
| 05/13/1986 | CA1204529A1 Method by means of which an electronic circuit can be manufactured which is protected from electrostatic charges |
| 05/13/1986 | CA1204527A1 Polymeric films for electronic circuits |
| 05/13/1986 | CA1204524A1 Semiconductor device having a protection circuit |
| 05/13/1986 | CA1204523A1 Unitary slotted heat sink for semiconductor packages |
| 05/13/1986 | CA1204522A1 Heat dissipator for semiconductor devices |
| 05/07/1986 | EP0180256A1 Method of manufacturing contacts on a semiconductor device |
| 05/07/1986 | EP0180219A2 Capacitor built-in integrated circuit packaged unit and process of fabrication thereof |
| 05/07/1986 | EP0180173A2 Hermetically sealed enclosure for thin film devices |
| 05/07/1986 | EP0180091A2 Method of selectively depositing metal layers on a substrate |
| 05/07/1986 | EP0179980A1 Method of forming alignment marks in a semiconductor body |
| 05/07/1986 | EP0179802A1 Integrated circuits with contact pads in a standard array |
| 05/06/1986 | US4587595 Heat sink arrangement with clip-on portion |
| 05/06/1986 | US4587550 Press-packed semiconductor device with lateral fixing member |
| 05/06/1986 | US4587549 Multilayer interconnection structure for semiconductor device |
| 05/06/1986 | US4587548 Lead frame with fusible links |
| 05/06/1986 | US4587547 Electrode structure for a semiconductor devices |
| 05/06/1986 | US4587413 IC-module identification card |
| 05/06/1986 | US4587395 Bonding leads to semiconductor devices |
| 05/06/1986 | US4587140 Ethylene-alpha olefin copolymer |
| 05/06/1986 | US4587138 Metal oxide semiconductor, silkon-metal alloy |
| 05/06/1986 | US4586242 Operations on a semiconductor integrated circuit having two kinds of buffers |
| 05/06/1986 | CA1204222A1 Semiconductor device |
| 05/06/1986 | CA1204213A1 Memory card having static electricity protection |
| 04/30/1986 | EP0179714A1 Method for mounting two semiconductor components in a common housing, and device obtained by this method |
| 04/30/1986 | EP0179577A2 Method for making a semiconductor device having conductor pins |
| 04/30/1986 | EP0179369A2 Electrode and/or interconnection |
| 04/29/1986 | US4586169 Semiconductor memory circuit and large scale integrated circuit using the same |
| 04/29/1986 | US4586075 Semiconductor rectifier |
| 04/29/1986 | US4585936 Optical process for determining the dimensions of an object in relative movement, and more particularly of a coin in a pre-payment apparatus |
| 04/29/1986 | US4585931 Method for automatically identifying semiconductor wafers |
| 04/29/1986 | US4585706 Sintered aluminum nitride semi-conductor device |
| 04/29/1986 | US4585672 Resistance to electromigration |
| 04/29/1986 | US4585291 Dual-in-line connector assembly |
| 04/29/1986 | US4584760 Method of manufacturing a semiconductor device having a polycrystalline silicon layer |
| 04/29/1986 | CA1203920A1 Polycrystalline silicon interconnections for bipolar transistor flip-flop |
| 04/24/1986 | WO1986002490A1 Wafer-scale-integrated assembly |
| 04/24/1986 | WO1986002488A1 Coating of iii-v and ii-vi compound semiconductors |
| 04/23/1986 | EP0178977A1 Semiconductor component mounted in a plastic housing, and method for its manufacture |
| 04/23/1986 | EP0178512A1 MOS circuit including an EEPROM |
| 04/23/1986 | EP0178481A2 Hermetically sealed semiconductor package |
| 04/22/1986 | US4584688 Base for a semiconductor laser |
| 04/22/1986 | US4584595 For semiconductor devices |
| 04/22/1986 | CA1203643A1 Semiconductor device interconnection pattern with rim |
| 04/22/1986 | CA1203640A1 Apparatus for cooling integrated circuit chips |
| 04/22/1986 | CA1203638A1 Method of batch manufacture of microwave diodes with incorporated encapsulation and diodes obtained by said method |
| 04/22/1986 | CA1203634A1 Data card and method of manufacturing same |
| 04/16/1986 | EP0178227A2 Integrated circuit semiconductor device formed on a wafer |
| 04/16/1986 | EP0178170A2 Semiconductor device having a bonding wire and method for manufacturing it |
| 04/16/1986 | EP0177948A2 Integrated circuit package |
| 04/16/1986 | EP0177943A2 Semiconductor device package for high frequencies |
| 04/16/1986 | EP0177845A1 Integrated circuit with multilayer wiring and method for manufacturing it |
| 04/16/1986 | EP0177692A2 Protection device in an integrated circuit |
| 04/16/1986 | EP0177562A1 Nitride bonding layer |
| 04/16/1986 | EP0177560A1 Integrated circuit add-on components |
| 04/16/1986 | EP0177559A1 Integrated-circuit leadframe adapted for a simultaneous bonding operation. |
| 04/15/1986 | US4583111 Integrated circuit chip wiring arrangement providing reduced circuit inductance and controlled voltage gradients |
| 04/15/1986 | US4583109 Ionization inhibitors |