| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/25/1986 | US4572754 Procelain substrates for microelectronics industry |
| 02/25/1986 | US4572286 Boiling cooling apparatus |
| 02/25/1986 | US4571794 Method of accommodating electronic component in casing |
| 02/25/1986 | CA1201218A1 Integrated semiconductor circuit with bipolar transistor structure, and a fabrication method thereof |
| 02/25/1986 | CA1201213A1 Electronic component cap and seal |
| 02/25/1986 | CA1201211A1 Hermetically sealed semiconductor casing |
| 02/25/1986 | CA1200971A1 Low melting temperature glass for use over aluminium interconnects of an integrated circuit structure |
| 02/19/1986 | EP0172108A1 Access neutralization device to protect an integrated-circuit zone |
| 02/19/1986 | EP0171838A1 Encapsulated electric component |
| 02/19/1986 | EP0171783A2 Module board and module using the same and method of treating them |
| 02/19/1986 | EP0171662A2 Method of fabricating a chip interposer |
| 02/18/1986 | US4571612 Corrosion-protected electrical circuit component |
| 02/18/1986 | US4571611 Semiconductor chip with a metal heat radiator |
| 02/18/1986 | US4571608 Integrated voltage-isolation power supply |
| 02/18/1986 | US4571451 Method for routing electrical connections and resulting product |
| 02/18/1986 | US4571354 Tape automated bonding of integrated circuits |
| 02/18/1986 | US4570569 Soldering apparatus |
| 02/18/1986 | US4570337 Method of assembling a chip carrier |
| 02/18/1986 | US4570328 Method of producing titanium nitride MOS device gate electrode |
| 02/18/1986 | CA1200946A1 Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation |
| 02/18/1986 | CA1200923A1 Semiconductor packages |
| 02/13/1986 | WO1986001037A1 Semiconductor-on-insulator (soi) devices and soi ic fabrication method |
| 02/13/1986 | WO1986001035A1 Rotating rectifier assembly |
| 02/12/1986 | EP0171232A2 Area-bonding tape |
| 02/12/1986 | EP0171089A2 Power supply device |
| 02/12/1986 | EP0171051A1 Housing for a semiconductor body radiating heat in operation |
| 02/12/1986 | EP0170767A2 Substrate for printed circuits |
| 02/12/1986 | EP0170724A1 Optoelectronic semiconductor device and method for its production |
| 02/11/1986 | US4569902 Inorganic oxide substrate supporting laminate of laternating copper wire and inorsanic oxide insulator |
| 02/11/1986 | US4569876 Providing good electrical connection by embedding conductive material in holes in the insulator |
| 02/11/1986 | US4569738 Method of producing amorphous carbon coatings on substrates by plasma deposition |
| 02/11/1986 | US4569692 Low thermal expansivity and high thermal conductivity substrate |
| 02/11/1986 | US4569123 Method of manufacturing a semiconductor device utilizing simultaneous diffusion from an ion implanted polysilicon layer |
| 02/11/1986 | US4569122 Method of forming a low resistance quasi-buried contact |
| 02/11/1986 | US4569121 Method of fabricating a programmable read-only memory cell incorporating an antifuse utilizing deposition of amorphous semiconductor layer |
| 02/11/1986 | CA1200625A1 Semiconductor die-attach technique and composition therefor |
| 02/11/1986 | CA1200623A1 Plastic encapsulated semiconductor device and a lead frame therefor |
| 02/11/1986 | CA1200622A1 Collector for radiation-generated current carriers in a semiconductor structure |
| 02/11/1986 | CA1200619A1 Integrated circuit lead frame with improved power dissipation |
| 02/11/1986 | CA1200616A1 Method for producing integrated mos field effect transistors with an additional interconnect of metal silicides |
| 02/10/1986 | CN85106739A Sealing method of electric power-units |
| 02/10/1986 | CN85106736A Sealing method of high heat stability for electrical power element |
| 02/05/1986 | EP0170544A1 Self-aligning method of forming an interconnection line over a contact hole in an integrated circuit |
| 02/05/1986 | EP0170501A2 Method for logic design of integrated circuit |
| 02/05/1986 | EP0170477A2 Multilayer systems and their method of production |
| 02/05/1986 | EP0170268A2 Complementary MOS integrated circuit having means for preventing latch-up phenomenon |
| 02/05/1986 | EP0170250A2 Bipolar transistor and method for producing the bipolar transistor |
| 02/05/1986 | EP0170122A2 Low loss, multilevel silicon circuit board |
| 02/05/1986 | EP0170065A1 Molded electrical device, molded circuit board substrate and molded chip carrier |
| 02/05/1986 | EP0170052A2 Master slice type semiconductor circuit device |
| 02/05/1986 | EP0170022A2 Semiconductor power device package for surface mounting |
| 02/05/1986 | EP0169941A1 Monolithic integrated semiconductor circuit |
| 02/05/1986 | EP0077813B1 Low resistivity composite metallization for semiconductor devices and method therefor |
| 02/04/1986 | US4568962 Plastic encapsulated semiconductor power device means and method |
| 02/04/1986 | US4568889 Distributed diode VCO with stripline coupled output and distributed variable capacitor control |
| 02/04/1986 | US4568796 Housing carrier for integrated circuit |
| 02/04/1986 | US4568586 Metal layer is firmly bonded to deramic substrate after cooling and solidification of eutectic interlayer |
| 02/04/1986 | CA1200326A1 High-power dual-gate field-effect transistor |
| 02/04/1986 | CA1200321A1 Modular semiconductor device |
| 02/04/1986 | CA1200155A1 Forming low-resistance contact to silicon |
| 01/30/1986 | WO1986000777A1 Zif socket for chip carriers |
| 01/30/1986 | WO1986000755A1 Integrated circuit having buried oxide isolation and low resistivity substrate for power supply interconnection |
| 01/30/1986 | WO1986000754A1 Heat sink for integrated circuit package |
| 01/30/1986 | WO1986000548A1 Terminal straightener for an integrated circuit package |
| 01/29/1986 | EP0169820A2 Process for producing protective envelopes in which corresponding electric-electronic circuit components are dipped |
| 01/29/1986 | EP0169788A2 Mounting structure of flat-lead package-type electronic component |
| 01/29/1986 | EP0169356A1 Semiconductor switching device resistant to load varation |
| 01/29/1986 | EP0169346A1 Dynamic memory cell and method for manufacturing the same |
| 01/29/1986 | EP0169270A1 Cooling device of semiconductor chips |
| 01/28/1986 | US4567545 Integrated circuit module and method of making same |
| 01/28/1986 | US4567505 Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like |
| 01/28/1986 | US4567504 Semiconductor component with a disc-shaped case |
| 01/28/1986 | US4567503 MIS Device employing elemental pnictide or polyphosphide insulating layers |
| 01/28/1986 | US4567499 Memory device |
| 01/28/1986 | US4567361 Reticle bar code and method and apparatus for reading same |
| 01/28/1986 | US4567006 Method for encapsulating microelectronic sensor devices |
| 01/28/1986 | US4566750 Plastic insert-mold element containing a metal-piece insert |
| 01/28/1986 | US4566529 Cooling device, in which converters or rectifiers or other semiconductor components are immersed in boiling liquor |
| 01/28/1986 | US4566177 Formation of electromigration resistant aluminum alloy conductors |
| 01/28/1986 | CA1200019A1 Electrical contact materials |
| 01/28/1986 | CA1200017A1 Microwave field effect transistor |
| 01/22/1986 | EP0168828A2 Method for manufacturing a semiconductor device having wiring layers |
| 01/22/1986 | EP0168815A2 Process for fabricating three-dimensional semiconductor device |
| 01/22/1986 | EP0168677A2 A cooling system for integrated circuit chips |
| 01/22/1986 | EP0168609A1 Method for repairing pinholes in dielectric layers |
| 01/22/1986 | EP0168535A1 A method of producing a layered structure |
| 01/22/1986 | EP0168456A1 Mounting and connection device for power semi-conductors. |
| 01/21/1986 | US4566027 Pre-matched module for an ultra-high frequency diode with high heat dissipation |
| 01/21/1986 | US4566026 Integrated circuit bimetal layer |
| 01/21/1986 | US4565840 Fiber-reinforced concrete and reinforcing material for concrete |
| 01/21/1986 | US4565741 Boron nitride film and process for preparing same |
| 01/21/1986 | US4565712 Method of making a semiconductor read only memory |
| 01/21/1986 | US4565288 Tubular container for the acceptance of semiconductor components |
| 01/15/1986 | EP0168125A1 Wiring layers in semiconductor devices |
| 01/15/1986 | EP0167732A1 Method for producing a basic material for a hybrid circuit |
| 01/15/1986 | EP0167665A1 Apparatus for cooling integrated circuit chips |
| 01/15/1986 | EP0167538A1 Flat package for integrated circuit memory chips. |
| 01/14/1986 | US4564885 Rectifier with slug construction and mold for fabricating same |
| 01/14/1986 | US4564880 Apparatus and method for protecting integrated circuits |
| 01/14/1986 | US4564854 Semiconductor device |