Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1985
10/09/1985EP0157367A2 Method and apparatus for evaporative cooling
10/09/1985EP0157147A2 Stacked double density memory module using industry standard memory chips, double density memory board and method of forming a stacked double density memory module
10/09/1985EP0157052A1 Low resistivity tungsten silicon composite film
10/09/1985EP0157008A2 Electronic device having a package
10/08/1985US4546454 Semiconductor circuit
10/08/1985US4546413 Engineering change facility on both major surfaces of chip module
10/08/1985US4546409 Device for cooling semiconductor elements
10/08/1985US4546408 Electrically insulated heat sink assemblies and insulators used therein
10/08/1985US4546406 Inorganic semiconductor having selected thermal expansion properties; metal laminate substrates
10/08/1985US4546405 Heat sink for electronic package
10/08/1985US4546374 Semiconductor device including plateless package
10/08/1985US4546371 Semiconductor device having an improved dual-gate field effect transistor
10/08/1985US4546283 Conductor structure for thick film electrical device
10/08/1985US4546260 System of aligning a scanning beam to a pattern
10/08/1985US4546037 Embedded in dielectric polymeric matrix
10/08/1985US4546028 Composite substrate with high heat conduction
10/08/1985US4545885 Selective electroplating apparatus having a cleaning device
10/08/1985US4545864 Selective plating
10/08/1985US4545610 Method for forming elongated solder connections between a semiconductor device and a supporting substrate
10/08/1985US4545116 Heating a titanium-layered silicon in a nitrogen atmosphere to prevent silicon nitride formation
10/02/1985EP0156406A2 IC socket contact
10/02/1985EP0155965A1 Wafer
10/01/1985US4544942 Heat sinks with staked solderable studs
10/01/1985US4544941 Semiconductor device having multiple conductive layers and the method of manufacturing the semiconductor device
10/01/1985US4544642 High density, thermoconductivity, group 5 element
10/01/1985US4544445 Process for positioning an interconnection line on an electric contact hole of an integrated circuit
10/01/1985US4544442 Forming patterns by the radiation vaporization of the cured coating on substrate bonded filaments
10/01/1985US4544003 Terminal straightener for an integrated circuit package
10/01/1985US4543707 Method of forming through holes by differential etching of stacked silicon oxynitride layers
10/01/1985CA1194314A1 Method for producing multilayered glass-ceramic structure with copper-based conductors therein
09/1985
09/26/1985WO1985004134A1 Process for forming and locating buried layers
09/25/1985EP0155699A2 Semiconductor device having improved multi-layer structure of insulating film and conductive film
09/25/1985EP0155473A1 Power semiconductor module and method of manufacture
09/24/1985US4543659 Method for recognizing a pellet pattern
09/24/1985US4543595 Bipolar memory cell
09/24/1985US4543594 Fusible link employing capacitor structure
09/24/1985US4543593 Semiconductor protective device
09/24/1985US4543544 LCC co-planar lead frame semiconductor IC package
09/24/1985US4543504 Electric current rectifier
09/18/1985EP0155080A2 Contact for chip carrier and method of inserting same into a housing
09/18/1985EP0155044A2 Plastic pin grid array chip carrier
09/18/1985EP0154998A2 Improved structure of power supply wirings in semiconductor integrated circuit
09/18/1985EP0154757A1 Cap for semiconductor device
09/18/1985EP0154720A1 Polyamic acid copolymer solutions for improved semiconductor manufacturing
09/18/1985EP0154685A1 Semiconductor memory device
09/17/1985US4542438 Hybrid integrated circuit device
09/17/1985US4542401 Copper, nickel, tin and silver; lightweight, excellent electrical and thermal conductivity
09/17/1985US4542400 Semiconductor device with multi-layered structure
09/17/1985US4542398 Semiconductor devices of multi-emitter type
09/17/1985US4542259 High density packages
09/17/1985US4542105 Glass composition for covering semiconductor element
09/17/1985US4541892 Process for the positioning of an interconnection line on an electrical contact hole of an integrated circuit
09/17/1985US4541882 Applying filaments according to pattern, coating to position
09/17/1985US4541169 Method for making studs for interconnecting metallization layers at different levels in a semiconductor chip
09/17/1985CA1193754A1 Heat exchanger for integrated circuit packages
09/17/1985CA1193752A1 Electrical circuits
09/17/1985CA1193725A1 Bipolar memory cell
09/17/1985CA1193618A1 Highly heat-conductive ceramic material
09/12/1985WO1985004049A1 Improved integrated circuit structure having intermediate metal silicide layer and method of making same
09/11/1985EP0154562A2 Two terminal axial lead suppressor and diode device and method of making
09/11/1985EP0154431A1 Integrated circuit chip assembly
09/11/1985EP0154419A2 Process for producing an interconnection structure of a semiconductor device
09/11/1985EP0154346A2 Semiconductor integrated circuit device
09/11/1985EP0154187A2 Tape bonding material and structure for electronic circuit fabrication
09/10/1985US4541035 Low loss, multilevel silicon circuit board
09/10/1985US4541006 Semiconductor device
09/10/1985US4541005 Self-positioning heat spreader
09/10/1985US4541004 For cooling an integrated circuit package
09/10/1985US4541003 Semiconductor device including an alpha-particle shield
09/10/1985US4541000 Varactor or mixer diode with surrounding substrate metal contact and top surface isolation
09/10/1985US4540673 Sintered aluminum nitride and semi-conductor device using the same
09/10/1985US4540621 Mixing with binder; casting into sheet, drying and sintering
09/10/1985US4540603 Resin-molded semiconductor device and a process for manufacturing the same
09/10/1985US4540462 Substrate for semiconductor modules and method of manufacture
09/10/1985US4539742 Semiconductor device and method for manufacturing the same
09/04/1985EP0153737A2 Circuit substrate having high thermal conductivity
09/04/1985EP0153650A2 Thin film hybrid circuit
09/04/1985EP0153626A2 Device consisting of a semiconductor power component on an insulating substrate with conductor paths
09/04/1985EP0153618A2 Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same
09/03/1985US4539660 Semiconductor integrated circuit
09/03/1985US4539658 Semiconductor memory
09/03/1985US4539622 Hybrid integrated circuit device
09/03/1985US4539621 Integrated circuit carrier and assembly
09/03/1985US4539582 Anti-short bonding pad structure
09/03/1985US4539298 Highly heat-conductive ceramic material
09/03/1985US4539058 Forming multilayer ceramic substrates from large area green sheets
09/03/1985US4538864 Contact element with locking means
09/03/1985US4538344 Method of forming electrode/wiring layer
08/1985
08/29/1985WO1985003806A1 Integrated circuit chip assembly
08/29/1985WO1985003805A1 Monolithic wafer having interconnection system including programmable interconnection layer
08/29/1985WO1985003804A1 Wafer scale package system and header and method of manufacture thereof
08/28/1985EP0153028A2 A mirror wafer of compound semiconductor
08/28/1985EP0152972A2 Contact system for 2-pole electronic chips, in particular for semi-conductor chips
08/28/1985EP0152818A2 Semiconductor power module
08/28/1985EP0152802A2 Battery backed-up integrated switching device
08/28/1985EP0152794A2 Multi-layered electrical interconnection structure
08/28/1985EP0152624A2 Method of manufacturing a semiconductor device having a polycristalline silicon-active region.
08/28/1985EP0152557A1 Semiconductor component having metallic bump contacts and multi-layer wiring
08/27/1985US4538210 Mounting and contacting assembly for plate-shaped electrical device
08/27/1985US4538171 High power semiconductor heat sink assembly
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