H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1986
11/26/1986	EP0202535A2 Layout process for cascode voltage switch logic
11/26/1986	EP0202498A2 Use of a thermo-setting, polymerizable composition and wiring board
11/26/1986	EP0202456A2 Integrated circuit logic array unit
11/26/1986	EP0202279A1 Process for encapsulating micro-electronic semi-conductor and layer-type circuits.
11/26/1986	EP0202240A1 Coating of iii-v and ii-vi compound semiconductors.
11/26/1986	CN85104187A Semiconductor assembly with cooling arrangement
11/25/1986	US4625260 Fasteners for surface mounting of printed circuit board components
11/25/1986	US4625228 Multi-layer electrical support substrate
11/25/1986	US4625227 Resin molded type semiconductor device having a conductor film
11/25/1986	US4625102 Memory card manufacturing method and cards thus obtained
11/25/1986	US4624896 Mullite, alumina
11/25/1986	US4624864 Process for the autopositioning of an interconnection line on an electric contact hole of an integrated circuit
11/25/1986	US4624863 Method of fabricating Schottky diodes and electrical interconnections in semiconductor structures
11/25/1986	US4624303 Heat sink mounting and method of making
11/25/1986	US4624045 Method of making thin film device
11/25/1986	CA1214574A1 Assembly-heat sink for semiconductor devices
11/25/1986	CA1214537A1 Integrated circuit module and method of making same
11/20/1986	WO1986006877A1 Polycide process in semiconductor fabrication
11/20/1986	WO1986006876A1 Optical provision of connections in integrated devices
11/20/1986	WO1986006871A1 New alloys having high electrical and mechanical performances, fabrication thereof and applications thereof, particularly in the electric, electronic and connectics fields
11/20/1986	EP0202109A2 A semiconductor device having high resistance to electrostatic and electromagnetic induction
11/20/1986	EP0201954A1 Semiconductor device comprising a heat sink
11/20/1986	EP0201952A1 Method and device for manufacturing an electronic identification card
11/20/1986	EP0201916A2 Bonding method of semiconductor device
11/20/1986	EP0201867A2 Method of manufacturing a bipolar transistor
11/20/1986	EP0201652A1 Boiler cooling for semiconductors, particularly for power rectifiers
11/20/1986	EP0201583A1 Process for fabricating dimensionally stable interconnect boards and product produced thereby.
11/19/1986	CN86103174A Semiconductor device and method of producing same
11/19/1986	CN86102885A Mulipurpose copper alloys and processing therefor with moderate conductivity and high strength
11/19/1986	CN86102036A Hybrid and multi-layer circuit
11/18/1986	US4623482 Copper conductive paint for porcelainized metal substrates
11/18/1986	US4623403 Indexing of laser beam for programming VLSI devices
11/18/1986	CA1214271A1 Dynamic semiconductor memory cell with random access (dram) and fabrication methods therefor
11/12/1986	EP0201170A1 Heat sink
11/12/1986	EP0200828A1 Dual curing coating method for substrates with shadow areas
11/12/1986	EP0200773A1 Process for encapsulating microelectronic circuits with organic components.
11/12/1986	EP0115514B1 Chip carrier
11/12/1986	EP0042417B1 Fabrication of circuit packages
11/12/1986	CN86101652A Semiconductor die attach system
11/12/1986	CN85103501A Conductor material of semiconductor apparatus
11/11/1986	US4622621 Chip carrier for high frequency power components cooled by water circulation
11/11/1986	US4622576 Conductive non-metallic self-passivating non-corrodable IC bonding pads
11/11/1986	US4622574 Semiconductor chip with recessed bond pads
11/11/1986	US4622434 Semiconductor device package and method thereof
11/11/1986	US4622433 Ceramic package system using low temperature sealing glasses
11/11/1986	US4622383 Method for the fractionation of reactive terminated polymerizable oligomers
11/11/1986	US4622236 Boron nitride film and process for preparing same
11/11/1986	US4622058 Formation of a multi-layer glass-metallized structure formed on and interconnected to multi-layered-metallized ceramic substrate
11/05/1986	EP0200469A2 Metallizing paste for silicon carbide sintered body and a semiconductor device including the same
11/05/1986	EP0200355A2 Improvements in or relating to integrated circuit assemblies
11/05/1986	EP0200291A2 Surface mountable microwave IC package
11/05/1986	EP0200221A2 Evaporation cooling module for semiconductor devices
11/05/1986	EP0199875A1 Integrated semiconductor circuit device with multilayer wiring
11/05/1986	EP0199873A2 Heat sink mounting and method of making the same
11/05/1986	CN86102992A Ceramic substrates for microelectronic circuits and process for producing same
11/05/1986	CN85103578A Method of manufacturing a semiconductor device
11/04/1986	US4621304 Heat radiator assembly
11/04/1986	US4621278 Composite film, semiconductor device employing the same and method of manufacturing
11/04/1986	US4621276 Buried contacts for N and P channel devices in an SOI-CMOS process using a single N+polycrystalline silicon layer
11/04/1986	US4621190 Card with an IC module
11/04/1986	US4621066 Low temperature fired ceramics
11/04/1986	US4621064 Low temperature sealing composition with synthetic zircon
11/04/1986	US4620986 MOS rear end processing
11/04/1986	US4620632 Carriers for pin grid array
11/04/1986	CA1213681A1 Monolithic microwave integrated circuit with pads for measuring dc characteristics
11/04/1986	CA1213679A2 Semiconductor structures and manufacturing methods
11/04/1986	CA1213678A2 Lead frame for plastic encapsulated semiconductor device
10/1986
10/29/1986	EP0199635A2 Integrated circuit device having stacked conductive layers connecting circuit elements therethrough
10/29/1986	EP0199415A2 Semiconductor device having a laser printable envelope
10/29/1986	EP0199386A1 Method of producing conductive electrodes on a circuit element, and semiconductor device so obtained
10/29/1986	EP0199078A1 Integrated semiconductor circuit having an aluminium or aluminium alloy contact conductor path and an intermediate tantalum silicide layer as a diffusion barrier
10/29/1986	EP0198976A2 Process for formation of insulating layer of silylated polysilsesquioxane on electronic circuit board
10/28/1986	US4620264 Multi-layer ceramic wiring circuit board and process for producing the same
10/28/1986	US4620216 Unitary slotted heat sink for semiconductor packages
10/28/1986	US4620215 Integrated circuit packaging systems with double surface heat dissipation
10/28/1986	US4619887 Vapor deposition of insulator; patterning and etching insulator into mask; deposition of metal onto exposed area
10/28/1986	US4619837 Solvent-free
10/28/1986	US4619316 Heat transfer apparatus
10/28/1986	US4619037 Method of manufacturing a semiconductor device
10/28/1986	CA1213293A1 Powdery silicon carbide composition for sintering
10/23/1986	WO1986006213A1 Electrostatic discharge input protection network
10/23/1986	WO1986006212A1 Mini chip carrier slotted array
10/22/1986	EP0198698A2 Integrated circuit device having strip line structure therein
10/22/1986	EP0198688A2 Integrated circuit structures
10/22/1986	EP0198660A1 Silver-filled glass metallizing pastes
10/22/1986	EP0198624A1 Overvoltage protection device
10/22/1986	EP0198621A2 Semiconductor device
10/22/1986	EP0198566A2 Electrical interconnect system, method of making the same and mass flow meter incorporating such system
10/22/1986	EP0198378A2 Apparatus for removing heat from electrical components, and method of manufacturing such apparatus
10/22/1986	EP0198376A1 Electronic unit, in particular for a microcircuit card, and card having such a unit
10/22/1986	EP0198354A2 Method for Brazing interconnect pins to metallic pads
10/22/1986	EP0198194A1 Packaged semiconductor chip
10/22/1986	EP0198159A1 Use of a copper-titanium-cobalt alloy as a material for electronic components
10/22/1986	EP0128154B1 Flat bag filled with heat-conducting liquid or paste
10/21/1986	US4618879 Semiconductor device having adjacent bonding wires extending at different angles
10/21/1986	US4618878 Polyimide-based resin film overlayer
10/21/1986	US4618877 Power semiconductor device with mesa type structure
10/21/1986	US4618872 Integrated power switching semiconductor devices including IGT and MOSFET structures
10/21/1986	US4618802 Hermetically sealed enclosure for thin film devices
10/21/1986	US4618739 Plastic chip carrier package

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