Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1985
08/27/1985US4538170 Power chip package
08/27/1985US4538169 Integrated alternator bridge heat sink
08/27/1985US4538168 High power semiconductor package
08/27/1985US4538167 Shorted junction type programmable read only memory semiconductor devices
08/27/1985US4537863 Lead-borate glass and two ceramic powders
08/27/1985US4537654 Two-gate non-coplanar FET with self-aligned source
08/27/1985US4537467 Thermal bonding un der low oxygen concentration
08/27/1985US4537246 Vertical heat sink
08/27/1985US4536951 Method of producing a layered structure
08/27/1985US4536949 Method for fabricating an integrated circuit with multi-layer wiring having opening for fuse
08/27/1985US4536948 Method of manufacturing programmable semiconductor device
08/27/1985CA1192671A1 Microcircuit flat pack with integral shell
08/27/1985CA1192668A1 Semiconductor device and its fabrication method
08/21/1985EP0152334A2 Semiconductor structure having alpha particle resistant film and method of making the same
08/21/1985EP0152168A2 Contact material for compression bonded semiconductor devices
08/20/1985US4536638 Integrated circuit chip carrier assembly
08/20/1985US4536469 Masking segments of thermal conductive layer on support, and plating unmasked segments
08/20/1985US4536435 Multilayer substrate including layers of an alumina and borosilicate-lead-glass ceramic material
08/20/1985US4536249 Improved resolution of the via by plasma etching through non-erodible mask-
08/20/1985US4535887 Mixing to form slurry, then baking
08/20/1985US4535841 High power chip cooling device and method of manufacturing same
08/20/1985CA1192317A1 Apparatus for cooling integrated circuit chips
08/15/1985WO1985003599A1 Programmable read-only memory cell and method of fabrication
08/15/1985WO1985003580A1 Process for forming slots of different types in self-aligned relationship using a latent image mask
08/14/1985EP0151553A2 Epoxy-resin/polysulfone molding compounds for cured products with excellent humidity and cracking resistance
08/14/1985EP0151546A2 Printed circuit board assembly having a liquid-cooling module system
08/14/1985EP0151354A2 Programmable read-only memory devices (PROM)
08/14/1985EP0151267A1 VLSI integrated circuit having improved density
08/14/1985EP0027825B1 Ceramic base
08/13/1985USRE31967 Gang bonding interconnect tape for semiconductive devices and method of making same
08/13/1985US4535388 High density wired module
08/13/1985US4535385 Circuit module with enhanced heat transfer and distribution
08/13/1985US4535384 Heat sink for a semiconductor device
08/13/1985US4534804 Migration of defect through lightly doped layer to form image
08/13/1985US4534649 Surface profile interferometer
08/13/1985US4534105 Method for grounding a pellet support pad in an integrated circuit device
08/13/1985US4534100 Electrical method of making conductive paths in silicon
08/07/1985EP0151068A2 Cooling system for electronic circuit device
08/07/1985EP0150882A1 Conductive die attach tape
08/07/1985EP0150403A1 Multilevel metal structure and process for making same
08/07/1985EP0150347A1 Power semiconductor device
08/07/1985EP0150304A2 Transmission line terminator for off-chip driver
08/06/1985US4533975 Including a roasted cobalt alumina pigment as promoter for low-temperature rapid curing of acrylates; film capacitors
08/06/1985US4533934 Device structures for high density integrated circuits
08/06/1985US4533846 Integrated circuit high voltage clamping systems
08/06/1985CA1191569A1 Connecting element for chip carriers
08/01/1985WO1985003385A1 Mounting and connection device for power semi-conductors
08/01/1985WO1985003381A1 Method and apparatus for forming hermetically sealed electrical feedthrough conductors
07/1985
07/31/1985EP0150101A2 Improvements in interference suppression for semi-conducting switching devices
07/31/1985EP0150088A2 A semiconductor device comprising a dielectric layer
07/31/1985EP0149932A1 Support for a fast acting component, especially a hyperfrequency component, incorporating decoupling elements
07/31/1985EP0149923A2 Microcircuit substrate and method of making same
07/31/1985EP0149867A2 Radiation hardenable coating and electronic components coated therewith
07/31/1985EP0149786A2 Semiconductor power module
07/30/1985US4532539 Solid-state diode-rectifier and heat sink structure
07/30/1985US4532538 Semiconductor arrangement with connector conductors cut out of sheetmetal
07/30/1985US4532419 Memory card having static electricity protection
07/30/1985US4532222 Reinforced glass composites
07/30/1985US4532112 Mixing concentrated hydrochloric acid with antimony trioxide to form antimony chloride, removing residue, adding water, heating, stirring to precipitate trioxide, separating, washing, drying
07/30/1985US4532022 Process of producing a semiconductor device
07/30/1985US4531792 IC Connector
07/30/1985EP0123692A4 Leadless chip carrier for logic components.
07/30/1985CA1191240A1 High-tension shielding for thyristor valve stacks
07/30/1985CA1191194A1 Device for protecting electronic circuits such as integrated circuits against electrostatic charges
07/24/1985EP0149330A1 ISFET Sensor and method of manufacture
07/24/1985EP0149317A2 Circuit packaging
07/24/1985EP0149232A2 Semiconductor component having a metalic base
07/24/1985EP0149062A1 Casting method for hollow spaces
07/24/1985EP0148927A1 A semiconductor die having undedicated input/output cells
07/24/1985EP0148820A1 Electronic circuit chip connection assembly and method.
07/23/1985US4531146 Apparatus for cooling high-density integrated circuit packages
07/23/1985US4531145 Method of fabricating complex micro-circuit boards and substrates and substrate
07/23/1985US4531144 Aluminum-refractory metal interconnect with anodized periphery
07/23/1985US4530152 Method for encapsulating semiconductor components using temporary substrates
07/23/1985EP0102988A4 Integrated circuit lead frame.
07/16/1985US4530003 Low-cost power device package with quick connect terminals and electrically isolated mounting means
07/16/1985US4530002 Connection lead arrangement for a semiconductor device
07/16/1985US4530001 High voltage integrated semiconductor devices using a thermoplastic resin layer
07/16/1985US4529836 Stress absorption matrix
07/16/1985US4529790 Reacting 3-methyl-6-alkylphenol with an aldehyde
07/16/1985US4529667 Containing barrier and oxidation resistant layers
07/16/1985US4528744 Method of manufacturing a semiconductor device
07/16/1985CA1190597A1 Rectifying device
07/10/1985EP0148083A2 Ultra-high speed semiconductor integrated circuit device having a multi-layered wiring board
07/10/1985EP0147807A2 Method for forming a substrate for tape automated bonding for electronic circuit elements
07/10/1985EP0147640A1 Method for the galvanic production of metallic bump contacts
07/10/1985EP0147576A1 Process for forming elongated solder connections between a semiconductor device and a supporting substrate
07/10/1985EP0147519A1 An integrated circuit module to planar board interconnection system
07/09/1985US4528583 Programmable semiconductor device and method of manufacturing same
07/09/1985US4528582 Interconnection structure for polycrystalline silicon resistor and methods of making same
07/09/1985US4528212 Coated ceramic substrates for mounting integrated circuits
07/04/1985WO1985002941A1 Flat package for integrated circuit memory chips
07/03/1985EP0147247A2 Method for forming hillock suppression layer in dual metal layer processing and structure formed thereby
07/03/1985EP0147203A2 Method of forming multilayer interconnections for a semiconductor device
07/03/1985EP0146928A2 Power semiconductor device with mesa type structure
07/03/1985EP0146811A2 High-temperature films and coating solutions for use in the manufacture of semi-conductor integrated circuits
07/03/1985EP0146803A1 Thermosetting epoxy resin compositions
07/03/1985EP0146688A1 An integrated circuit with a fusible link structure
07/02/1985US4527185 Integrated circuit device and subassembly
07/02/1985US4527184 Integrated semiconductor circuits with contact interconnect levels comprised of an aluminum/silicon alloy
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